NXP Semiconductors Microprocessors 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
935316715557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	245											3				e1
935320229557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	245											3				e1
S9S08RNA32W1VLC	NXP Semiconductors	MICROPROCESSOR																												40	260											3
935312396557	NXP Semiconductors	MICROPROCESSOR, RISC
P5021PXE72QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
BSC9131NXN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm		21 mm	YES	32		30	245	21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520	3		1000 rpm	YES	e1
SVF311R3N2CKU2	NXP Semiconductors	MICROPROCESSOR, RISC
935313684557	NXP Semiconductors	MICROPROCESSOR, RISC
PPC7448HX1420LD	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.25 V		36	32		GRID ARRAY		1.15 V	105 Cel		0 Cel		BOTTOM	2.8 mm		25 mm	YES	64	200 MHz			25 mm	CMOS		1.2 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1420 rpm	YES
P5020NSE1MMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, HEAT SINK/SLUG		.95 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1200 rpm	YES	e1
935373201557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								40	260											3				e1
MVF60NS152CMK50	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V	8	0	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA364,20X20,32	.9 V	85 Cel	0	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	1572864	17 mm	YES	0	24 MHz	40	260	17 mm	CMOS	850 mA	1 V	32	7		.8 mm	FLOATING POINT	S-PBGA-B364	3		500 rpm	YES	e1
SCIMX6D5EYM10CC	NXP Semiconductors	MICROPROCESSOR		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	64	1.05/1.5	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.35 V					BOTTOM	1.6 mm		21 mm	YES	64	24 MHz	NOT SPECIFIED	NOT SPECIFIED	21 mm	CMOS	3920 mA				Graphics Processors	.8 mm	FIXED POINT	S-PBGA-B624		Not Qualified	1000 rpm	YES
935325978557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	250											3				e1
935315499557	NXP Semiconductors	MICROPROCESSOR
S9S08RN48W1MLH	NXP Semiconductors	MICROPROCESSOR	AUTOMOTIVE	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	0	8		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	2.7 V	125 Cel	16	-40 Cel	MATTE TIN	QUAD	1.6 mm	4096	10 mm	NO	0	20 MHz	40	260	10 mm	CMOS	14.8 mA	3 V		3		.5 mm	FIXED POINT	S-PQFP-G64	3		20 rpm	YES	e3
P2010NSN2NHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY		1 V				TIN SILVER	BOTTOM	2.46 mm		31 mm	YES	64	100 MHz	40	260	31 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-PBGA-B689	3		1333 rpm	YES	e2
P5040PSN12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
P5021NXE1TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		0	64		GRID ARRAY	BGA1295,36X36,40	1.05 V	105 Cel	12	-40 Cel		BOTTOM	3.53 mm		37.5 mm	YES	0				37.5 mm	CMOS		1.1 V	8	2		1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES
935311628557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER								40	260											3				e2
P2020NXE2NHC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16			GRID ARRAY	BGA689,29X29,40	1 V	125 Cel	7			BOTTOM	2.46 mm		31 mm	YES	64	100 MHz			31 mm	CMOS		1.05 V	4			1 mm	FIXED POINT	S-PBGA-B689			1333 rpm	NO
P5010NXE1QMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1600 rpm	YES	e1
BSC9131NSE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm		21 mm	YES	32		30	245	21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520	3		1000 rpm	YES	e1
935325734557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	245											3				e1
XC7445ARX1000LG	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.35 V		36	32		GRID ARRAY		1.25 V					BOTTOM	3.2 mm		25 mm	YES	64	133 MHz			25 mm	CMOS		1.3 V				1.27 mm	FLOATING POINT	S-CBGA-B360		Not Qualified	1000 rpm	YES
XPC857TZP100B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V					BOTTOM	2.05 mm		25 mm	YES	32				25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357			100 rpm	YES
P5021PSE7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5040NXN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz	30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
935322233557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	250											3				e1
935322068557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER								40	260											3				e2
935318895557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN								40	260											3				e3
MPE603ERX133LX	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V		32	32		GRID ARRAY		3.135 V					BOTTOM	3 mm		21 mm	YES	64	66.67 MHz			21 mm	CMOS		3.3 V				1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	133.33 rpm	YES
935320418557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER								40	260											3				e2
PPC8568VTAUJJA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		0	32		GRID ARRAY		1.045 V				TIN SILVER	BOTTOM	2.75 mm		33 mm	YES	0	166 MHz			33 mm	CMOS		1.1 V				1 mm	FLOATING POINT	S-PBGA-B1023		Not Qualified	1333 rpm	YES	e2
935373048557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER								40	260											3				e2
P5021PXE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
SCIMX27LMOP4A	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER COPPER OVER NICKEL								40	260		CMOS									3
M7448PHX1600LC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	360	BGA	SQUARE	CERAMIC		YES				32	1.3,1.8/2.5	GRID ARRAY	BGA360,19X19,50					Tin/Lead (Sn/Pb)	BOTTOM										CMOS					Microprocessors	1.27 mm		S-XBGA-B360		Not Qualified	1600 rpm		e0
P5040PSN1TMB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY, HEAT SINK/SLUG		1.05 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
BSC9131NXE1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm	YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
BSC9132NXN7PNKB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	32		GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.53 mm		23 mm	YES	64	100 MHz			23 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B780			1400 rpm	YES
P2020NSN2MFC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		16		1.05	GRID ARRAY	BGA689,29X29,40	1 V		7		TIN SILVER	BOTTOM	2.46 mm		31 mm	YES	64		40	260	31 mm	CMOS		1.05 V	4		Microprocessors	1 mm	FIXED POINT	S-PBGA-B689	3	Not Qualified	1200 rpm	NO	e2
XPC8260VVIHBC	NXP Semiconductors	MICROPROCESSOR, RISC	COMMERCIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY, LOW PROFILE		1.7 V	70 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		37.5 mm	YES	64	66.66 MHz	30	245	37.5 mm	CMOS		1.8 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3	Not Qualified	200 rpm	NO	e1
935331866557	NXP Semiconductors	MICROPROCESSOR, RISC																				TIN SILVER COPPER								30	250											3				e1
PR31500ABC-T	NXP Semiconductors	MICROPROCESSOR, RISC		GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES						FLATPACK							QUAD										CMOS								S-PQFP-G208		Not Qualified
XPC8240RVV250E	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.625 V		32	32		GRID ARRAY, LOW PROFILE		2.375 V				Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.65 mm		35 mm	YES	32	66 MHz	30	245	35 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	250 rpm	YES	e1
P5040PXN12QB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY, HEAT SINK/SLUG		1.17 V				TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm	YES	64	166 MHz			37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
935324841557	NXP Semiconductors	MICROPROCESSOR																				TIN SILVER								40	260											3				e2

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.