Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
28 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
1.26 mm |
14 mm |
YES |
32 |
20 MHz |
14 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B272 |
200 rpm |
YES |
||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
203 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
PIN/PEG |
499 |
HPGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
NO |
3.465 V |
40 |
64 |
GRID ARRAY, HEAT SINK/SLUG |
3.135 V |
PERPENDICULAR |
57.4 mm |
YES |
128 |
500 MHz |
57.4 mm |
CMOS |
3.3 V |
2.54 mm |
FLOATING POINT |
S-CPGA-P499 |
Not Qualified |
500 rpm |
NO |
||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
337 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2 |
GRID ARRAY, FINE PITCH |
BGA337,23X23,20 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
1.2 V |
Microprocessors |
.5 mm |
S-PBGA-B337 |
Not Qualified |
200 rpm |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA289,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B289 |
Not Qualified |
266 rpm |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
OTHER |
BALL |
119 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
2 V |
27 |
32 |
GRID ARRAY |
1.7 V |
85 Cel |
-25 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
32 |
60 MHz |
CMOS |
1.8 V |
FIXED POINT |
S-PBGA-B119 |
2 |
Not Qualified |
60 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5,3.3 |
FLATPACK |
QFP160,1.0SQ,20 |
70 Cel |
0 Cel |
QUAD |
CMOS |
Microprocessors |
.5 mm |
S-PQFP-G160 |
Not Qualified |
66 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5/3.3,3.3 |
GRID ARRAY, FINE PITCH |
BGA289,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B289 |
Not Qualified |
400 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
416 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY |
BGA416,26X26,40 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
1000 mA |
Microprocessors |
1 mm |
S-PBGA-B416 |
Not Qualified |
133 rpm |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
.1 mA |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
20 rpm |
||||||||||||||||||||||||||||||||||||||||
|
Samsung |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
NO |
YES |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
NO |
YES |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
266 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
PIN/PEG |
499 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
2.5,3.3 |
GRID ARRAY |
HSPGA499,43X43 |
TIN LEAD |
PERPENDICULAR |
CMOS |
22200 mA |
Microprocessors |
1.27 mm |
S-PPGA-P499 |
3 |
Not Qualified |
600 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
1.27 mm |
S-PBGA-B272 |
Not Qualified |
166 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
PIN/PEG |
499 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
2.5,3.3 |
GRID ARRAY |
HSPGA499,43X43 |
TIN LEAD |
PERPENDICULAR |
CMOS |
18600 mA |
Microprocessors |
1.27 mm |
S-PPGA-P499 |
3 |
Not Qualified |
500 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
.1 mA |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
20 rpm |
||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
208 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA208,16X16,25 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
.635 mm |
S-PBGA-B208 |
Not Qualified |
133 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
337 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2 |
GRID ARRAY, FINE PITCH |
BGA337,23X23,20 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
1.2 V |
Microprocessors |
.5 mm |
S-PBGA-B337 |
Not Qualified |
40 rpm |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
.1 mA |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
20 rpm |
||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
0 Cel |
QUAD |
CMOS |
Microprocessors |
.5 mm |
S-PQFP-G208 |
Not Qualified |
133 rpm |
||||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA289,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B289 |
Not Qualified |
266 rpm |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA400,23X23,20 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
.1 mA |
Microprocessors |
.5 mm |
S-PBGA-B400 |
Not Qualified |
40 rpm |
||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
NO |
YES |
YES |
YES |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
PIN/PEG |
499 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
2.5,3.3 |
GRID ARRAY |
HSPGA499,43X43 |
TIN LEAD |
PERPENDICULAR |
CMOS |
19800 mA |
Microprocessors |
1.27 mm |
S-PPGA-P499 |
3 |
Not Qualified |
533 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA400,23X23,20 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
.1 mA |
Microprocessors |
.5 mm |
S-PBGA-B400 |
Not Qualified |
40 rpm |
||||||||||||||||||||||||||||||||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
22 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
0 Cel |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
10 MHz |
20 mm |
CMOS |
3.3 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
50 rpm |
YES |
||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
200 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
PIN/PEG |
499 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
2.5,3.3 |
GRID ARRAY |
HSPGA499,43X43 |
TIN LEAD |
PERPENDICULAR |
CMOS |
21000 mA |
Microprocessors |
1.27 mm |
S-PPGA-P499 |
3 |
Not Qualified |
566 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
289 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.2,3.3 |
GRID ARRAY, FINE PITCH |
BGA289,17X17,32 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B289 |
Not Qualified |
400 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
266 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5,3.3 |
FLATPACK |
QFP160,1.0SQ,20 |
70 Cel |
0 Cel |
QUAD |
CMOS |
Microprocessors |
.5 mm |
S-PQFP-G160 |
Not Qualified |
66 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2,3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
266 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
208 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
32 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.65 V |
70 Cel |
0 Cel |
QUAD |
1.6 mm |
28 mm |
YES |
32 |
44 MHz |
28 mm |
CMOS |
1.8 V |
.5 mm |
S-PQFP-G208 |
Not Qualified |
200 rpm |
YES |
|||||||||||||||||||||||||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
PIN/PEG |
499 |
PGA |
SQUARE |
PLASTIC/EPOXY |
NO |
64 |
2.5,3.3 |
GRID ARRAY |
HSPGA499,43X43 |
TIN LEAD |
PERPENDICULAR |
CMOS |
17400 mA |
Microprocessors |
1.27 mm |
S-PPGA-P499 |
3 |
Not Qualified |
466 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8/3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
.1 mA |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
20 rpm |
||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
203 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
160 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
2.5,3.3 |
GRID ARRAY, FINE PITCH |
BGA160,14X14,32 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B160 |
Not Qualified |
66 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
BALL |
272 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
GRID ARRAY, FINE PITCH |
BGA272,17X17,32 |
70 Cel |
0 Cel |
BOTTOM |
CMOS |
Microprocessors |
.8 mm |
S-PBGA-B272 |
Not Qualified |
203 rpm |
||||||||||||||||||||||||||||||||||||||||||||
Samsung |
MICROPROCESSOR, RISC |
COMMERCIAL |
GULL WING |
208 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
1.8,3.3 |
FLATPACK |
QFP208,1.2SQ,20 |
70 Cel |
0 Cel |
QUAD |
CMOS |
Microprocessors |
.5 mm |
S-PQFP-G208 |
Not Qualified |
200 rpm |
||||||||||||||||||||||||||||||||||||||||||||
|
Samsung |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
28 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.65 V |
85 Cel |
-40 Cel |
BOTTOM |
1.26 mm |
14 mm |
YES |
32 |
20 MHz |
14 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B272 |
200 rpm |
YES |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.