Samsung Microprocessors 46

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

S3C2410A20-YO80

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

BOTTOM

1.26 mm

14 mm

YES

32

20 MHz

14 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B272

200 rpm

YES

S3C2410X01-YOR0

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

203 rpm

21164

Samsung

MICROPROCESSOR, RISC

PIN/PEG

499

HPGA

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

NO

3.465 V

40

64

GRID ARRAY, HEAT SINK/SLUG

3.135 V

PERPENDICULAR

57.4 mm

YES

128

500 MHz

57.4 mm

CMOS

3.3 V

2.54 mm

FLOATING POINT

S-CPGA-P499

Not Qualified

500 rpm

NO

S3C24A0XXX-YA

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

337

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2

GRID ARRAY, FINE PITCH

BGA337,23X23,20

85 Cel

-40 Cel

BOTTOM

CMOS

1.2 V

Microprocessors

.5 mm

S-PBGA-B337

Not Qualified

200 rpm

S3C2413X26-YQ8N

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

289

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA289,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B289

Not Qualified

266 rpm

K5D1G13ACA-D075

Samsung

MICROPROCESSOR, RISC

OTHER

BALL

119

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

2 V

27

32

GRID ARRAY

1.7 V

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

YES

32

60 MHz

CMOS

1.8 V

FIXED POINT

S-PBGA-B119

2

Not Qualified

60 rpm

YES

e1

S3C44B0X01-ED80

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

32

2.5,3.3

FLATPACK

QFP160,1.0SQ,20

70 Cel

0 Cel

QUAD

CMOS

Microprocessors

.5 mm

S-PQFP-G160

Not Qualified

66 rpm

S3C2440AXX-YQ

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

289

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

2.5/3.3,3.3

GRID ARRAY, FINE PITCH

BGA289,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B289

Not Qualified

400 rpm

S3C2510AXX-GB

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY

BGA416,26X26,40

85 Cel

-40 Cel

BOTTOM

CMOS

1000 mA

Microprocessors

1 mm

S-PBGA-B416

Not Qualified

133 rpm

S3C2412X20-YO80

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

NOT SPECIFIED

NOT SPECIFIED

CMOS

.1 mA

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

20 rpm

S3C2450X01-YL80

Samsung

S3C6410X01-YB

Samsung

MICROPROCESSOR, RISC

NO

YES

YES

YES

S3C6410X5A-Y2

Samsung

MICROPROCESSOR, RISC

NO

YES

YES

YES

S3C2410A01-YOR0

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

266 rpm

S3C2412X

Samsung

KP21164-600CN

Samsung

MICROPROCESSOR, RISC

PIN/PEG

499

PGA

SQUARE

PLASTIC/EPOXY

NO

64

2.5,3.3

GRID ARRAY

HSPGA499,43X43

TIN LEAD

PERPENDICULAR

CMOS

22200 mA

Microprocessors

1.27 mm

S-PPGA-P499

3

Not Qualified

600 rpm

e0

S3C2501X-GA

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY

BGA272,20X20,50

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

1.27 mm

S-PBGA-B272

Not Qualified

166 rpm

KP21164-500CN

Samsung

MICROPROCESSOR, RISC

PIN/PEG

499

PGA

SQUARE

PLASTIC/EPOXY

NO

64

2.5,3.3

GRID ARRAY

HSPGA499,43X43

TIN LEAD

PERPENDICULAR

CMOS

18600 mA

Microprocessors

1.27 mm

S-PPGA-P499

3

Not Qualified

500 rpm

e0

S3C2412X26-YO8N

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

20 rpm

S3C2450X01-YL40

Samsung

S3C2400XX-YE

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

208

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA208,16X16,25

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.635 mm

S-PBGA-B208

Not Qualified

133 rpm

S3C24A0XX-YA

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

337

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2

GRID ARRAY, FINE PITCH

BGA337,23X23,20

85 Cel

-40 Cel

BOTTOM

CMOS

1.2 V

Microprocessors

.5 mm

S-PBGA-B337

Not Qualified

40 rpm

S3C2412X26-YO80

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

20 rpm

S3C2400XX-EE

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

GULL WING

208

QFP

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

FLATPACK

QFP208,1.2SQ,20

70 Cel

0 Cel

QUAD

CMOS

Microprocessors

.5 mm

S-PQFP-G208

Not Qualified

133 rpm

S3C2413X26-YQ80

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

289

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA289,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B289

Not Qualified

266 rpm

S3C2460B01-YL8Z

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA400,23X23,20

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.5 mm

S-PBGA-B400

Not Qualified

40 rpm

S3C6410X5D-Y2

Samsung

MICROPROCESSOR, RISC

NO

YES

YES

YES

KP21164-533CN

Samsung

MICROPROCESSOR, RISC

PIN/PEG

499

PGA

SQUARE

PLASTIC/EPOXY

NO

64

2.5,3.3

GRID ARRAY

HSPGA499,43X43

TIN LEAD

PERPENDICULAR

CMOS

19800 mA

Microprocessors

1.27 mm

S-PPGA-P499

3

Not Qualified

533 rpm

e0

S3C2460B01-YL7Z

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA400,23X23,20

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.5 mm

S-PBGA-B400

Not Qualified

40 rpm

S3C6400

Samsung

S3C4520A

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

22

32

FLATPACK, LOW PROFILE, FINE PITCH

3 V

70 Cel

0 Cel

QUAD

1.6 mm

20 mm

YES

16

10 MHz

20 mm

CMOS

3.3 V

.5 mm

FIXED POINT

S-PQFP-G144

Not Qualified

50 rpm

YES

S3C2410AXX-YO-20

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

200 rpm

KP21164-566CN

Samsung

MICROPROCESSOR, RISC

PIN/PEG

499

PGA

SQUARE

PLASTIC/EPOXY

NO

64

2.5,3.3

GRID ARRAY

HSPGA499,43X43

TIN LEAD

PERPENDICULAR

CMOS

21000 mA

Microprocessors

1.27 mm

S-PPGA-P499

3

Not Qualified

566 rpm

e0

S3C2440X01-YQ

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

289

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.2,3.3

GRID ARRAY, FINE PITCH

BGA289,17X17,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B289

Not Qualified

400 rpm

S3C2410AXX-YO

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

266 rpm

S3C44B0XX-ED

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

32

2.5,3.3

FLATPACK

QFP160,1.0SQ,20

70 Cel

0 Cel

QUAD

CMOS

Microprocessors

.5 mm

S-PQFP-G160

Not Qualified

66 rpm

S3C2410AXX-YO-26

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

2,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

266 rpm

S3C2800-EE

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

GULL WING

208

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

32

32

FLATPACK, LOW PROFILE, FINE PITCH

1.65 V

70 Cel

0 Cel

QUAD

1.6 mm

28 mm

YES

32

44 MHz

28 mm

CMOS

1.8 V

.5 mm

S-PQFP-G208

Not Qualified

200 rpm

YES

S3C2443X

Samsung

KP21164-466CN

Samsung

MICROPROCESSOR, RISC

PIN/PEG

499

PGA

SQUARE

PLASTIC/EPOXY

NO

64

2.5,3.3

GRID ARRAY

HSPGA499,43X43

TIN LEAD

PERPENDICULAR

CMOS

17400 mA

Microprocessors

1.27 mm

S-PPGA-P499

3

Not Qualified

466 rpm

e0

S3C2412X20-YO8N

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8/3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

85 Cel

-40 Cel

BOTTOM

CMOS

.1 mA

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

20 rpm

S3C2410X-YO

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

203 rpm

S3C44B0XX-YD

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

160

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

2.5,3.3

GRID ARRAY, FINE PITCH

BGA160,14X14,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B160

Not Qualified

66 rpm

S3C2410XX-YO

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

BALL

272

FBGA

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

GRID ARRAY, FINE PITCH

BGA272,17X17,32

70 Cel

0 Cel

BOTTOM

CMOS

Microprocessors

.8 mm

S-PBGA-B272

Not Qualified

203 rpm

S3C2800XX-EE

Samsung

MICROPROCESSOR, RISC

COMMERCIAL

GULL WING

208

QFP

SQUARE

PLASTIC/EPOXY

YES

32

1.8,3.3

FLATPACK

QFP208,1.2SQ,20

70 Cel

0 Cel

QUAD

CMOS

Microprocessors

.5 mm

S-PQFP-G208

Not Qualified

200 rpm

S3C2410A20-YOR0

Samsung

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.95 V

28

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.65 V

85 Cel

-40 Cel

BOTTOM

1.26 mm

14 mm

YES

32

20 MHz

14 mm

CMOS

1.8 V

.8 mm

FIXED POINT

S-PBGA-B272

200 rpm

YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.