FBGA Other Function uPs,uCs & Peripheral ICs 531

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU2CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU3CG-2LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU4CG-2LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU2CG-1LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU2CG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU3EG-1LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU6CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.698 V	100 Cel	-40 Cel		BOTTOM	2.61 mm	19 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				19 mm	CMOS	.72 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU3EG-1LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU3CG-1LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU9CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XCZU9CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	0 Cel		BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU9CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XAZU2EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XCZU6CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	-40 Cel		BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU2CG-2LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel		BOTTOM	2.61 mm	19 mm		0			19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484
XCZU9CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	0 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU2EG-1LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU9CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	0 Cel		BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU2CG-1LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU9CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.698 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				21 mm	CMOS	.72 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XAZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3	e1
XCZU9CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	0 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU9CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.698 V	100 Cel	-40 Cel		BOTTOM	2.61 mm	19 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				19 mm	CMOS	.72 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU3CG-1LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU2EG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU4EG-3SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B784	4	e1
XCZU6CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	0 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU3EG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU5CG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XAZU2EG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.72 V		.8 mm	S-PBGA-B484	3	e1
XCZU3EG-2LSBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel		BOTTOM	2.61 mm	19 mm		0			19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484
XCZU9CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XCZU3CG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU2EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	3	e1
XCZU5CG-2LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU6CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU5EG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU3CG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU6CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XCZU3EG-2LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU9CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XAZU3EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	3	e1
XAZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4	e1
XCZU5EG-3SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B784	4	e1
XCZU2EG-2LSFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU4EV-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU3EG-1LSFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.