FBGA Other Function uPs,uCs & Peripheral ICs 531

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
LH7A404-N0E-000	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM								Other Microprocessor ICs	.8 mm	S-XBGA-B324		Not Qualified
935357618557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
LH7A404N0F092B3	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	260				Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324	3	Not Qualified	e1
LH7A404N0E000B0A	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM								Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
935317979557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935357605557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935361133557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935311432557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935361135557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LH7A404N0E000B3	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM								Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
935341041538	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935361134557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361139557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361157557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935316461557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
KCIMX6D6AVT08ACR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935361154557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361151557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361142557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LH7A404N0F000B2	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel		BOTTOM								Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
935361155557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935316342518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935318005557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935361144557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361285557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361143557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LH7A404-N0F-092	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM								Other Microprocessor ICs	.8 mm	S-XBGA-B324		Not Qualified
LH7A404-N0E-092	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES		1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM								Other Microprocessor ICs	.8 mm	S-XBGA-B324		Not Qualified
935361278557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935317648518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935361153557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361274557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935320155518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935361145557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935311627557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935316342557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
935314739518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935311432518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935361141557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935361272557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935323456557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935325679518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
935361136557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
935357616557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS			.8 mm	S-PBGA-B624
LS1084ASN7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1
LS1088AXE7PQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm			23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
MCIMX6DP4AVT8ABR	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
LS1048AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V		GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.