FBGA Other Function uPs,uCs & Peripheral ICs 531

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
LS1046AXE8Q1A	NXP Semiconductors	SoC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3			e1
MCIMX534AVV8C	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100	1.1,1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS	1.1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified		e2
MPFS250T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			23 mm	CMOS	1 V		.8 mm	S-PBGA-B784
66AK2L06XCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm	25 mm		30	245	25 mm	CMOS	1.05 V		.8 mm	S-PBGA-B900	4			e1
MPFS025T-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
AM5718AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		1500 rpm	e1
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4			e1
AM5718AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	23 mm		30	250	23 mm	CMOS	1.15 V		.8 mm	S-PBGA-B760	3		1500 rpm	e1
LS1043AXE8QQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM	30	250	23 mm	CMOS	.9 V		.8 mm	S-PBGA-B780	3			e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3			e1
MPFS250TFCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
AM68A72AHGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770
AM68A72ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm		30	260	23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770	3
AM6421BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
DRA821U4TCBALMRQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	17.2 mm			250	17.2 mm	CMOS	.8 V		.8 mm	S-PBGA-B433	3		2000 rpm
AM6441BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
AM6441BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
MCIMX6D6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS095T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			23 mm	CMOS	1 V		.8 mm	S-PBGA-B784
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529	3			e2
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3			e1
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG784E	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			23 mm	CMOS	1 V		.8 mm	S-PBGA-B784
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770	3		2000 rpm
XCZU5CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4			e1
10AS016C4U19I3LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	-40 Cel		BOTTOM	3.25 mm	19 mm				19 mm	TSMC	.9 V		.8 mm	S-PBGA-B484
AM6412BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
MCIMX6D6AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MIMX8QX2AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.52 mm	21 mm		40	260	21 mm	CMOS	1.1 V		.8 mm	S-PBGA-B609	3
XCZU4CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4			e1
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm				19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
XQZU3EG-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm		20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4			e0
10AS016C3U19E2LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	0 Cel		BOTTOM	3.25 mm	19 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			19 mm	TSMC	.9 V		.8 mm	S-PBGA-B484
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3			e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.72 V		.8 mm	S-PBGA-B784	4			e1
XQZU3EG-1SFRA484M	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm		40	245	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	4			e0
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B256		Not Qualified
QG6402/SL9XC	Intel			BALL	655	FBGA	RECTANGULAR	PLASTIC	YES			1.5,1.8,3.3	GRID ARRAY, FINE PITCH	BGA655,23X29,32					BOTTOM							CMOS		Other uPs/uCs/Peripheral ICs	.8 mm	R-PBGA-B655		Not Qualified
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS	.85 V		.8 mm	S-PBGA-B625	3			e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4			e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.