FBGA Other Function uPs,uCs & Peripheral ICs 531

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

TMS320DM6467CCUTA

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467ZUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

32768

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TCUT1

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TZUT9

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TZUTD1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUTV

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUT7

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUT4

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CZUTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467ZUTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

BOTTOM

3.3 mm

32768

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

TMS320DM6467TCUTL1

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TCUTD1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467ZUT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

32768

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUT6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

AM5716AABCDA

Texas Instruments

SYSTEM ON CHIP

INDUSTRIAL

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

GRID ARRAY, FINE PITCH

BGA760,28X28,31

1.11 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

30

250

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

3

e1

66AK2L06XCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

TMS320DM6467CCUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUT7

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467TCUT9

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

AM5716AABCD

Texas Instruments

SYSTEM ON CHIP

OTHER

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

GRID ARRAY, FINE PITCH

BGA760,28X28,31

1.11 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

30

250

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

3

e1

66AK2L06XCMS

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

TMS320DM6467TZUT1

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467ZUTD7

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

32768

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467ZUT7

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

32768

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUTV

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CGUTA6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

20

220

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e0

TMS320DM6467CZUTD7

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467ZUTV

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

BOTTOM

3.3 mm

32768

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

AM5716AABCDEA

Texas Instruments

SYSTEM ON CHIP

INDUSTRIAL

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

GRID ARRAY, FINE PITCH

BGA760,28X28,31

1.11 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

30

250

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

3

e1

TMS320DM6467CCUTA6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM6467CCUTV6

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

AM6421BSEFHAALV

Texas Instruments

SYSTEM ON CHIP

BALL

441

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA441,21X21,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.652 mm

17.2 mm

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

17.2 mm

CMOS

.75 V

.8 mm

S-PBGA-B441

AM6441BSFFHAALV

Texas Instruments

SYSTEM ON CHIP

BALL

441

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA441,21X21,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.652 mm

17.2 mm

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

250

17.2 mm

CMOS

.75 V

.8 mm

S-PBGA-B441

3

AM6441BSDFHAALV

Texas Instruments

SYSTEM ON CHIP

BALL

441

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA441,21X21,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.652 mm

17.2 mm

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

17.2 mm

CMOS

.75 V

.8 mm

S-PBGA-B441

AM6421BSEGHAALV

Texas Instruments

SYSTEM ON CHIP

BALL

441

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA441,21X21,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.652 mm

17.2 mm

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

17.2 mm

CMOS

.75 V

.8 mm

S-PBGA-B441

AM6441BSEGHAALV

Texas Instruments

SYSTEM ON CHIP

BALL

441

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA441,21X21,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.652 mm

17.2 mm

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

17.2 mm

CMOS

.75 V

.8 mm

S-PBGA-B441

AM6421BSDFHAALV

Texas Instruments

SYSTEM ON CHIP

BALL

441

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA441,21X21,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.652 mm

17.2 mm

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

17.2 mm

CMOS

.75 V

.8 mm

S-PBGA-B441

AM6421BSFFHAALV

Texas Instruments

SYSTEM ON CHIP

BALL

441

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA441,21X21,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.652 mm

17.2 mm

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

250

17.2 mm

CMOS

.75 V

.8 mm

S-PBGA-B441

3

TDA4VE88TGAALZRQ1

Texas Instruments

SYSTEM ON CHIP

BALL

770

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

AEC-Q100; ISO 26262

GRID ARRAY, FINE PITCH

BGA770,28X28,32

.76 V

125 Cel

-40 Cel

BOTTOM

2.57 mm

23 mm

23 mm

CMOS

.8 V

.8 mm

S-PBGA-B770

3

2000 rpm

TDA4VL21HGAALZRQ1

Texas Instruments

SYSTEM ON CHIP

BALL

770

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

AEC-Q100; ISO 26262

GRID ARRAY, FINE PITCH

BGA770,28X28,32

.76 V

125 Cel

-40 Cel

BOTTOM

2.57 mm

23 mm

23 mm

CMOS

.8 V

.8 mm

S-PBGA-B770

3

1200 rpm

AM62A74AVMSIAMBQ1

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

125 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

AM68A92ATGGHAALZR

Texas Instruments

SoC

BALL

770

FBGA

SQUARE

PLASTIC/EPOXY

YES

.84 V

GRID ARRAY, FINE PITCH

BGA770,28X28,32

.76 V

105 Cel

-40 Cel

BOTTOM

2.57 mm

23 mm

30

260

23 mm

CMOS

.8 V

.8 mm

S-PBGA-B770

3

AM62A32AMLHAAMB

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

AM62A74AUMSIAMBRQ1

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

125 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

AM62A74AUMHAAMBR

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

105 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

AM62A32AMLSIAMBQ1

Texas Instruments

SoC

BALL

484

FBGA

SQUARE

PLASTIC/EPOXY

YES

.79 V

AEC-Q100

GRID ARRAY, FINE PITCH

BGA484,22X22,32

.715 V

125 Cel

-40 Cel

BOTTOM

2.556 mm

18 mm

18 mm

CMOS

.75 V

.8 mm

S-PBGA-B484

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.