FBGA Other Function uPs,uCs & Peripheral ICs 531

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
LS1084AXE7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
LS1048AXN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
LS1084AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
MCIMX6DP6AVT8AB	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.225 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MIMX8QX2AVOFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	417	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, FINE PITCH	BGA417,29X29,32	1.05 V	125 Cel	-40 Cel		BOTTOM	2.73 mm	17 mm			40	260	17 mm	CMOS	1.1 V		.8 mm	S-PBGA-B417	3
LS1048AXN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
MCIMX6DP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3	e1
LS1088ASN7QQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1088AXE7Q1A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
LS1088AXE7P1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1088AXE7PTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
LS1088ASN7MQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
LS1088AXE7M1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1088AXE7QQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1044ASN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm				250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3
LS1088ASN7PQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1023AXE8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3	e1
LS1088ASE7M1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1023AXN8PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3	e1
LS1088AXN7QQA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1043AXN7PQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm	ALSO OPERATES AT 1V SUPPLY NOM		30	250	21 mm	CMOS	.9 V		.8 mm	S-PBGA-B621	3	e1
LS1088ASN7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
LS1088ASN7MTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
LS1084ASE7Q1A	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm			30	250	23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780	3	e1
LS1088AXE7QTA	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V	GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel		BOTTOM	2.61 mm	23 mm					23 mm	CMOS	1.025 V		.8 mm	S-PBGA-B780
MCIMX6Q4AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6Q4AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3	e1
LS1023AXE7QQB	NXP Semiconductors	SoC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, FINE PITCH	BGA621,25X25,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm			30	250	21 mm	CMOS	1 V		.8 mm	S-PBGA-B621	3
XQZU5EV-L1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e0
XQZU5EV-1SFRC784M	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	125 Cel	-55 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e0
XQZU5EV-2SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e0
XQZU3EG-2SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e0
XQZU3EG-L1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e0
XQZU3EG-2SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm			40	245	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	4	e0
XQZU5EV-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e0
XQZU3EG-1SFRC784M	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	125 Cel	-55 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e0
XQZU3EG-1SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm			40	245	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	4	e0
XQZU3EG-L1SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm			40	245	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	4	e0
XCZU2EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V		.8 mm	S-PBGA-B784	4	e1
XAZU2EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	3	e1
XCZU5CG-2LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU6CG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel	-40 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU5EG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU3CG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU6CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XCZU3EG-2LSFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU9CG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XAZU3EG-1SBVA484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS	.85 V		.8 mm	S-PBGA-B484	3	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.