FBGA Other Function uPs,uCs & Peripheral ICs 531

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
AM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS		.75 V		.8 mm	S-PBGA-B484
AM62A74AUMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS		.75 V		.8 mm	S-PBGA-B484
AM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS		.75 V		.8 mm	S-PBGA-B484
AM62A34ASMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS		.75 V		.8 mm	S-PBGA-B484
AM62A31AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS		.75 V		.8 mm	S-PBGA-B484
TDA8026ET/C2/S1,15	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM							260 mA	3.3 V	Other Microprocessor ICs	.8 mm	S-PBGA-B64		Not Qualified
TDA8026ET/C2,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM			30	260			260 mA	3.3 V	Other Microprocessor ICs	.8 mm	S-PBGA-B64	2	Not Qualified	e1
TDA8026ET/C2,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM				260			260 mA	3.3 V	Other Microprocessor ICs	.8 mm	S-PBGA-B64	2	Not Qualified
P1025NXE5DFB	NXP Semiconductors	SoC		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH	BGA561,27X27,32		125 Cel	-40 Cel		BOTTOM	2.3 mm	23 mm			23 mm	CMOS				.8 mm	S-PBGA-B561	3
P1025NSE5DFB	NXP Semiconductors	SoC		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel		BOTTOM	2.3 mm	23 mm			23 mm	CMOS		1 V		.8 mm	S-PBGA-B561	3
TDA8026ET/C2/S1,11	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES			3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM							260 mA	3.3 V	Other Microprocessor ICs	.8 mm	S-PBGA-B64		Not Qualified
PCIMX535DVV1C	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, FINE PITCH		1.2 V				BOTTOM	1.85 mm	19 mm			19 mm	CMOS		1.25 V		.8 mm	S-PBGA-B529	3	Not Qualified	e2
935361156557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
LH79524N0E100A0	NXP Semiconductors		INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA208,16X16,32		85 Cel	-40 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B208		Not Qualified
935361281557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
LH7A404N0E000B1A	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
935313319518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
935314748557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
935315187557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
935361152557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935361269557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935320812557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
935357607557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
935314739557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
LH79524	NXP Semiconductors		INDUSTRIAL	BALL	208	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA208,16X16,32		85 Cel	-40 Cel		BOTTOM									Other Microprocessor ICs	.8 mm	S-PBGA-B208		Not Qualified
LH7A400N0E000B5	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B256		Not Qualified
935319909518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
935320155557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
LH7A404-N0F-000	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel		BOTTOM									Other Microprocessor ICs	.8 mm	S-XBGA-B324		Not Qualified
935361283557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935314748518	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
LH7A404N0E000B2	NXP Semiconductors		COMMERCIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		70 Cel	0 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
935357614557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
LH7A404N0F000B1A	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel		BOTTOM									Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B324		Not Qualified
935325679557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
KCIMX6D6AVT08AC	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
935361138557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935317648557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
935319909557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
935341041557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
935361158557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935361276557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935313319557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
LH7A400N0E000	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel		BOTTOM									Other Microprocessor ICs	.8 mm	S-XBGA-B256		Not Qualified
935357612557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
935361137557	NXP Semiconductors	SYSTEM ON CHIP		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.055 V			GRID ARRAY, FINE PITCH	BGA780,28X28,32	.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm	30	250	23 mm	CMOS		1.025 V		.8 mm	S-PBGA-B780	3		e1
935357609557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624
935357621557	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm			21 mm	CMOS				.8 mm	S-PBGA-B624

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.