FBGA Other Function uPs,uCs & Peripheral ICs 531

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V				GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm		25 mm				30	245	25 mm	CMOS	1.05 V			.8 mm		S-PBGA-B900	4			e1
LH7A404N0F000B3	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES				1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	260				Other uPs/uCs/Peripheral ICs		.8 mm		S-XBGA-B324	3	Not Qualified		e1
MCIMX6D6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
TMSDM6467TCUT1TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				GRID ARRAY, FINE PITCH		1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.3 V			.8 mm		S-PBGA-B529	4			e1
DRA785BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA752BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760	3			e1
DRA750BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		48	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1000 rpm	e1
DRA751BLGABCQ	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760
DRA783BRJABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz			15 mm	CMOS	1.06 V		CAN(2), I2C(2), SPI(4), QSPI, UART(3)	.65 mm		S-PBGA-B367				e1
DRA745BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1176 rpm	e1
DRA746BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
DRA755BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760
DRA783BRJABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz			15 mm	CMOS	1.06 V		CAN(2), I2C(2), SPI(4), QSPI, UART(3)	.65 mm		S-PBGA-B367				e1
DRA788BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA755BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760
DRA745BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1176 rpm	e1
DRA750BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760
DRA744BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1000 rpm	e1
DRA754BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760
DRA744BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1000 rpm	e1
DRA788BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA784BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA754BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760
XDRA821UXXGALM	Texas Instruments	SoC	AUTOMOTIVE	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm		17.2 mm						17.2 mm	CMOS	.8 V			.8 mm		S-PBGA-B433			2000 rpm
DRA784BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA752BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760	3			e1
DRA746BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
DRA751BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760
DRA829VMTGBALFRQ1	Texas Instruments	SoC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		24 mm					250	24 mm	CMOS	.8 V			.8 mm		S-PBGA-B827	3		2000 rpm	e1
DRA821U4TCBALMQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm		17.2 mm					250	17.2 mm	CMOS	.8 V			.8 mm		S-PBGA-B433	3		2000 rpm
XAM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm	CMOS	.75 V			.8 mm		S-PBGA-B484
AM69A98ATNGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
AM69A94ATMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
XAM62A74AUMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm	CMOS	.75 V			.8 mm		S-PBGA-B484
XAM69A98ATNGHAALY	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
XAM62A34ASMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm	CMOS	.75 V			.8 mm		S-PBGA-B484
XAM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm	CMOS	.75 V			.8 mm		S-PBGA-B484
AM69A54ANMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
AM69A34AHMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
AM69A78ATMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
DRA785BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
TMX320DM365AZCE	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	FBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA338,19X19,25					BOTTOM		2048					NOT SPECIFIED	NOT SPECIFIED		CMOS		Digital Signal Processors		.635 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TMS320DM6467CZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS32DM6467CCUTAV6	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CCUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.