VFBGA Other Function uPs,uCs & Peripheral ICs 180

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
NRF52832-CIAA-R	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm						3.226 mm	CMOS	3 V			.4 mm	R-PBGA-B56
NRF52832-CIAA-R7	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm						3.226 mm	CMOS	3 V			.4 mm	R-PBGA-B56
NRF5340-CLAA-R7	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		BALL	95	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA95,12X12,14	1.7 V	105 Cel	-40 Cel		BOTTOM	.447 mm	3.994 mm						4.39 mm	CMOS	3 V			.35 mm	R-PBGA-B95
NRF5340-CLAA-R	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		BALL	95	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA95,12X12,14	1.7 V	105 Cel	-40 Cel		BOTTOM	.447 mm	3.994 mm						4.39 mm	CMOS	3 V			.35 mm	R-PBGA-B95
NRF52805-CAAA-R7	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS	3 V			.4 mm	R-PBGA-B28
NRF52805-CAAA-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS	3 V			.4 mm	R-PBGA-B28
NRF52805-CAAA-B-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS	3 V			.4 mm	R-PBGA-B28
NRF52805-CAAA-B-R7	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS	3 V			.4 mm	R-PBGA-B28
NRF52811-CAAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS	3 V			.4 mm	R-PBGA-B33
NRF52811-CAAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS	3 V			.4 mm	R-PBGA-B33
CY8C6247BZI-D54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm						9 mm	CMOS	1.8 V			.65 mm	S-PBGA-B124	3			e1
AM6254ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					250	13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
AM6231ASGGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					250	13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
CY8C6136BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm						9 mm	CMOS	1.8 V			.65 mm	S-PBGA-B124	3			e1
AM6231AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
CY8C6247BZI-D34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm						9 mm	CMOS	1.8 V			.65 mm	S-PBGA-B124	3			e1
AM6234ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					250	13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
AM6252ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					250	13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
AM6232ATCGGAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					250	13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425	3		1400 rpm
AM6231ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6231ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
MTFC4GMDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm	CMOS	1.8 V			.5 mm	R-PBGA-B153				e1
AM6232ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6231AGGGGHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
CY8C6137BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm						9 mm	CMOS	1.8 V			.65 mm	S-PBGA-B124	3			e1
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm	CMOS	1.8 V			.5 mm	R-PBGA-B153				e1
THGBM5G5A1JBAIRH2H	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel		BOTTOM	1 mm	11.5 mm						13 mm	CMOS	3.3 V			.5 mm	R-PBGA-B153
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm	CMOS	1.8 V			.5 mm	R-PBGA-B153				e1
CY8C6116BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm						9 mm	CMOS	1.8 V			.65 mm	S-PBGA-B124	3			e1
AM6234ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					250	13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425	3
SCIMX538DZK1C	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	529	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V		0.9/1.25,1.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA529,23X23,32	1.2 V				BOTTOM	.986 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	1.25 V	Graphics Processors		.5 mm	S-PBGA-B529		Not Qualified
AM6251ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6251AKGGHHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6254ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
MTFC4GMVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm	CMOS	1.8 V			.5 mm	R-PBGA-B153				e1
AM6252ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
ATMXT640U-CCU023	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V	TS 16949		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	2.7 V	85 Cel	-40 Cel		BOTTOM	.6 mm	6 mm				30	260	6 mm	CMOS	3.3 V			.5 mm	S-PBGA-B88
DLPC3439CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm	13 mm				30	260	13 mm	CMOS	1.1 V			.8 mm	S-PBGA-B201	3			e1
IS2083BM-232	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel	-40 Cel		BOTTOM	.9 mm	5.5 mm						5.5 mm	CMOS	1.2 V			.5 mm	S-PBGA-B82
IS2083BM-232-TRAY	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel	-40 Cel		BOTTOM	.9 mm	5.5 mm						5.5 mm	CMOS	1.2 V			.5 mm	S-PBGA-B82
AM6254ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
CY8C6137BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm						9 mm	CMOS	1.8 V			.65 mm	S-PBGA-B124	3			e1
AM6232ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6234ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6251ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
ATWILC1000B-UU-T	Microchip Technology	SoC		BALL	55	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA55,8X8,14		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.589 mm	3.24 mm						3.24 mm	CMOS	1.1 V			.35 mm	S-PBGA-B55
MEC1521H-B0-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm	CMOS	1.8 V		I2C, ESPI, UART	.65 mm	S-PBGA-B144
MEC1521H-B0-I/SZ-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm	CMOS	1.8 V		I2C, ESPI, UART	.65 mm	S-PBGA-B144

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.