VFBGA Other Function uPs,uCs & Peripheral ICs 180

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
CY8C4128FNI-BL473	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CY8C4248FNI-BL493	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CY8C4248FNI-BL473	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CYWB0124ABX-FDXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1.8,1.8/3.3	GRID ARRAY, FINE PITCH	BGA81,9X9,16	1.7 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.55 mm	3.784 mm			260	3.788 mm	CMOS		1.8 V	Bus Controllers	.4 mm	S-PBGA-B81		Not Qualified	e1
CY8C4128FNI-BL493	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CYWB0321ABX-FDXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1.8,1.8/3.3,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA81,9X9,16	1.7 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.55 mm	3.91 mm				3.91 mm	CMOS	115 mA	1.8 V	Bus Controllers	.4 mm	S-PBGA-B81		Not Qualified	e1
CYWB0321ABX-FDXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1.8,1.8/3.3,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA81,9X9,16	1.7 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.55 mm	3.91 mm				3.91 mm	CMOS	115 mA	1.8 V	Bus Controllers	.4 mm	S-PBGA-B81		Not Qualified	e1
CYWB0320ABX-FDXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1.8,1.8/3.3,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA81,9X9,16	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	3.91 mm				3.91 mm	CMOS	115 mA	1.8 V	Bus Controllers	.4 mm	S-PBGA-B81		Not Qualified	e1
CYWB0226ABSX-FDXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	3.907 mm		40	260	3.91 mm	CMOS		1.8 V		.4 mm	R-PBGA-B81	1		e1
CY54590RKUBGT	Infineon Technologies	SYSTEM ON CHIP		BALL	194	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA194,12X18,16	1.14 V	85 Cel	-40 Cel		BOTTOM	.55 mm	5.155 mm				7.698 mm	CMOS		1.2 V		.4 mm	R-PBGA-B194
CYW54591RKUBG	Infineon Technologies	SYSTEM ON CHIP		BALL	194	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA194,12X18,16	1.14 V	85 Cel	-40 Cel		BOTTOM	.55 mm	5.155 mm				7.698 mm	CMOS		1.2 V		.4 mm	R-PBGA-B194
CY54590RKUBG	Infineon Technologies	SYSTEM ON CHIP		BALL	194	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA194,12X18,16	1.14 V	85 Cel	-40 Cel		BOTTOM	.55 mm	5.155 mm				7.698 mm	CMOS		1.2 V		.4 mm	R-PBGA-B194
CYW54907KWBGT	Infineon Technologies	SYSTEM ON CHIP		BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA316(UNSPEC)	1.14 V	85 Cel	-30 Cel		BOTTOM	.33 mm	4.907 mm	MINIMUM BUMP PITCH IS CONSIDERED			5.848 mm	CMOS		1.2 V		.2 mm	R-PBGA-B316
CY8C4248BZA-L489	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.71 V	85 Cel	-40 Cel		BOTTOM	1 mm	9 mm				9 mm	CMOS		3.3 V		.65 mm	S-PBGA-B241
CYPM1211-42FNXIT	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16	2.7 V	105 Cel	-40 Cel		BOTTOM	.55 mm	2.633 mm				3.184 mm	CMOS		3.3 V		.4 mm	R-PBGA-B42
CY8C4248BZS-L489	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.71 V	105 Cel	-40 Cel		BOTTOM	1 mm	9 mm				9 mm	CMOS		3.3 V		.65 mm	S-PBGA-B241	3
CY8C6136FTI-F42	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.33 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CY8C6117BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm				9 mm	CMOS		1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C6137BZI-F14	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm				9 mm	CMOS		1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C6245FNI-S3D41	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm				3.1024 mm	CMOS		1.8 V		.42 mm	R-PBGA-B49
CY8C6245FNI-S3D71	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm				3.1024 mm	CMOS		1.8 V		.42 mm	R-PBGA-B49
CY8C6245FNI-S3D11	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm				3.1024 mm	CMOS		1.8 V		.42 mm	R-PBGA-B49
CY8C6016BZI-F04	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel		BOTTOM	1 mm	9 mm				9 mm	CMOS		1.8 V		.65 mm	S-PBGA-B124	3
CY8C6136FDI-F42	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CY8C6036BZI-F04	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel		BOTTOM	1 mm	9 mm				9 mm	CMOS		1.8 V		.65 mm	S-PBGA-B124	3
MAX8893AEWV+T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.69 mm	2.52 mm		30	260	3.03 mm	CMOS		3.7 V		.5 mm	R-PBGA-B30	1		e1
MAX8893AEWV+	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.69 mm	2.52 mm		30	260	3.03 mm	BICMOS		3.7 V		.5 mm	R-PBGA-B30	1	Not Qualified	e1
MAX7359EWA+	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	.69 mm	2.09 mm		30	260	2.09 mm	BICMOS	.06 mA	2.5 V	Parallel IO Port	.4 mm	S-PBGA-B25	1	Not Qualified	e2
MAX8893CEWV+	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.69 mm	2.52 mm		30	260	3.03 mm	BICMOS		3.7 V		.5 mm	R-PBGA-B30	1	Not Qualified	e1
MAX98096EWF+T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	117	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.33 V	85 Cel	-40 Cel		BOTTOM	.81 mm	4.665 mm		NOT SPECIFIED	NOT SPECIFIED	6.875 mm	CMOS		1.8 V		.5 mm	R-PBGA-B117
MAX8893CEWV+T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.69 mm	2.52 mm		30	260	3.03 mm	CMOS		3.7 V		.5 mm	R-PBGA-B30	1		e1
MAX7359EWA+T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	UNSPECIFIED	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	.69 mm	2.09 mm		30	260	2.09 mm	BICMOS		2.5 V		.4 mm	S-XBGA-B25	1		e2
MAX8893BEWV+T	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.69 mm	2.52 mm		30	260	3.03 mm	CMOS		3.7 V		.5 mm	R-PBGA-B30	1		e1
MAX8893BEWV+	Maxim Integrated	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.69 mm	2.52 mm		30	260	3.03 mm	BICMOS		3.7 V		.5 mm	R-PBGA-B30	1	Not Qualified	e1
MTFC32GJDED-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	14 mm	IT ALSO OPERATES AT 3.3 VOLTS			18 mm	CMOS		1.8 V		.5 mm	R-PBGA-B169			e1
MTFC32GJVED-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	14 mm	IT ALSO OPERATES AT 3.3 VOLTS			18 mm	CMOS		1.8 V		.5 mm	R-PBGA-B169			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.