VFBGA Other Function uPs,uCs & Peripheral ICs 180

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
STM32TS60ZH6XXY	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.4 V	85 Cel	-40 Cel		BOTTOM	.6 mm	7 mm				7 mm	CMOS				.5 mm	S-PBGA-B144
PN5472A2EV/C20804	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM	1 mm	4 mm				4.3 mm	CMOS		3.6 V		.5 mm	R-PBGA-B49
PN5472A2EV/C20803	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM	1 mm	4 mm				4.3 mm	CMOS		3.6 V		.5 mm	R-PBGA-B49
NHS3152UK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.54 mm	2.51 mm				2.51 mm	CMOS		3.3 V		.4 mm	S-PBGA-B25
NHS3100UK	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.72 V	85 Cel	-40 Cel		BOTTOM	.54 mm	2.51 mm				2.51 mm	CMOS		3 V		.4 mm	S-PBGA-B25
935369502023	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	90 Cel	-40 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			2.06 mm	CMOS		1.8 V		.5 mm	R-PBGA-B12
935369482023	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	85 Cel	-25 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			2.06 mm	CMOS		1.8 V		.5 mm	R-PBGA-B12
A7102CHUK/T0BC2VAZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	90 Cel	-40 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY	NOT SPECIFIED	NOT SPECIFIED	2.06 mm	CMOS		1.8 V		.5 mm	R-PBGA-B12
PN7150B0UK/C110XX	NXP Semiconductors	NFC CONTROLLER		BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16	1.65 V	85 Cel	-30 Cel		BOTTOM	.58 mm	2.8 mm				2.88 mm	CMOS		1.8 V		.4 mm	R-PBGA-B42
MCIMX508CZK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel	0 Cel		BOTTOM	.9 mm	13 mm				13 mm	CMOS		1.225 V		.5 mm	S-PBGA-B416
MCIMX538DZK1C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL EXTENDED	BALL	520	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA520,29X29,16	1.2 V	85 Cel	-20 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	.986 mm	12 mm		40	260	12 mm	CMOS		1.25 V		.4 mm	S-PBGA-B520	3
A7101CHUK/T0BC2HAZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	85 Cel	-25 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY	NOT SPECIFIED	NOT SPECIFIED	2.06 mm	CMOS		1.8 V		.5 mm	R-PBGA-B12
CY8C6137FDI-F02	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CY8C6117FDI-F02	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CY8C6246BZI-D04	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm				9 mm	CMOS		1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C4045FNI-S412	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.482 mm	1.932 mm				2.022 mm	CMOS		1.8 V		.35 mm	R-PBGA-B25			e1
CY8C4024FNI-S402	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.482 mm	1.932 mm				2.022 mm	CMOS		1.8 V		.35 mm	R-PBGA-B25			e1
CYWB0125ABX-FDXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1.8,1.8/3.3	GRID ARRAY, FINE PITCH	BGA81,9X9,16	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	3.784 mm			260	3.788 mm	CMOS	115 mA	1.8 V	Bus Controllers	.4 mm	S-PBGA-B81		Not Qualified	e1
CYS0644ABZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm				9 mm	CMOS		1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C4248FLI-BL483	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.4 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CYS0644AFNI-S2D43T	Infineon Technologies	PROGRAMMABLE SoC		BALL	100	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,12X17,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.9025 mm				4.1068 mm	CMOS		1.8 V		.42 mm	R-PBGA-B100
CY8C4245FNI-DS402	Infineon Technologies	PROGRAMMABLE SoC		BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.8 V	85 Cel	-40 Cel		BOTTOM	.55 mm	2.07 mm				2.11 mm	CMOS		3 V		.4 mm	R-PBGA-B25
CY8C6247FDI-D52	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CYW54907KWBG	Infineon Technologies	SYSTEM ON CHIP	OTHER	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA316(UNSPEC)	1.14 V	85 Cel	-30 Cel		BOTTOM	.33 mm	4.907 mm	MINIMUM BUMP PITCH IS CONSIDERED			5.848 mm	CMOS		1.2 V		.2 mm	R-PBGA-B316
CY8C6247FDI-D32	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CY8C6247BZI-D44	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm				9 mm	CMOS		1.8 V		.65 mm	S-PBGA-B124	3		e1
CY8C6145FNI-S3F71	Infineon Technologies	PROGRAMMABLE SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm				3.1024 mm	CMOS		1.8 V		.42 mm	R-PBGA-B49
CY8C4128FNI-BL483	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CYPD3126-42FNXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	21.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	2.633 mm				3.184 mm	CMOS		3.3 V		.4 mm	R-PBGA-B42	1		e1
CY8C6247FDI-D02	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CYWB0224ABM-BVXIES	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	6 mm		30	260	6 mm	CMOS		1.8 V		.5 mm	S-PBGA-B100	3		e1
CY8C4025FNI-S402	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.482 mm	1.932 mm				2.022 mm	CMOS		1.8 V		.35 mm	R-PBGA-B25			e1
CY8C4025FNI-S412	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.482 mm	1.932 mm				2.022 mm	CMOS		1.8 V		.35 mm	R-PBGA-B25			e1
CY8C4248FNI-BL463	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CY8C4248FNI-BL453	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CYW20707UA1KFFB1G	Infineon Technologies	SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,6X8,20	1.14 V	85 Cel	-30 Cel		BOTTOM	1 mm	4 mm				4.5 mm	CMOS		1.2 V		.5 mm	R-PBGA-B49
CY8C4128FNI-BL443	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
BCM20707UA2EKUBGT	Infineon Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	36	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.14 V	85 Cel	-30 Cel		BOTTOM	.55 mm	2.51 mm				2.77 mm	CMOS		1.2 V		.4 mm	R-PBGA-B36
CYWB0124AB-BVXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1.8,1.8/3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,20	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	6 mm		20	260	6 mm	CMOS		1.8 V	Bus Controllers	.5 mm	S-PBGA-B100	3	Not Qualified	e1
CYWB0220ABSX2-FDXIT	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	3.907 mm				3.91 mm	CMOS		1.8 V		.4 mm	R-PBGA-B81	3		e1
CY8C4024FNI-S412	Infineon Technologies	PSoC	INDUSTRIAL	BALL	25	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,14	1.71 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.482 mm	1.932 mm				2.022 mm	CMOS		1.8 V		.35 mm	R-PBGA-B25			e1
CY8C6145FNI-S3F11	Infineon Technologies	PROGRAMMABLE SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm				3.1024 mm	CMOS		1.8 V		.42 mm	R-PBGA-B49
CY8C4248FNI-BL483	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CY8C6247FTI-D52	Infineon Technologies	PROGRAMMABLE SoC		BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.33 mm	3.19 mm				3.676 mm	CMOS		1.8 V		.35 mm	R-PBGA-B80
CYWB0220ABSX2-FDXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.9 V	1.8,1.8/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA81,9X9,16	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	3.907 mm			260	3.91 mm	CMOS	115 mA	1.8 V	Bus Controllers	.4 mm	R-PBGA-B81		Not Qualified	e1
CY8C4128FNI-BL453	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM	.55 mm	3.87 mm				4.04 mm	CMOS		3.3 V		.4 mm	R-PBGA-B76
CY8C6145FNI-S3F41	Infineon Technologies	PROGRAMMABLE SoC		BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm				3.1024 mm	CMOS		1.8 V		.42 mm	R-PBGA-B49
CYWB0224ABSX-FDXI	Infineon Technologies	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	81	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.55 mm	3.907 mm			260	3.91 mm	CMOS		1.8 V		.4 mm	R-PBGA-B81	1		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.