VFBGA Other Function uPs,uCs & Peripheral ICs 180

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
AM6234ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm					13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel	-40 Cel		BOTTOM		1 mm	7 mm					7 mm	CMOS		3.3 V			.65 mm	S-PBGA-B100
ATMXT640UD-CCU001	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	3.14 V	85 Cel	-40 Cel		BOTTOM		.6 mm	6 mm					6 mm	CMOS		3.3 V			.5 mm	S-PBGA-B88
CY8C6136BZI-F14	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1 mm	9 mm					9 mm	CMOS		1.8 V			.65 mm	S-PBGA-B124	3		e1
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	128		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm			30	260	2.01 mm	CMOS	.03 mA	1.8 V			.4 mm	S-PBGA-B25	1		e1	20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V	128		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm			30	260	2.01 mm	CMOS	.03 mA	1.8 V			.4 mm	S-PBGA-B25	1		e1	20
ATBTLC1000A-UU-T	Microchip Technology	SoC		BALL	31	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA31,9X7,14	1.8 V	85 Cel	-40 Cel		BOTTOM		.541 mm	2.142 mm					2.282 mm	CMOS		3.6 V			.35 mm	R-PBGA-B31
CYB0644ABZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1 mm	9 mm					9 mm	CMOS		1.8 V			.65 mm	S-PBGA-B124	3		e1
THGBM5G6A2JBAIR	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel		BOTTOM		1 mm	11.5 mm					13 mm	CMOS		3.3 V			.5 mm	R-PBGA-B153
EFR32FG12P431F1024GL125-C	Silicon Labs	SYSTEM ON CHIP		BALL	125	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA125,13X13,20	1.62 V	85 Cel	-40 Cel		BOTTOM		.94 mm	7 mm					7 mm	CMOS		1.8 V			.5 mm	S-PBGA-B125
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel		BOTTOM		.6 mm	5 mm					5 mm	CMOS		3.3 V			.5 mm	S-PBGA-B64
ATMXT640T-CCU035	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,20	3 V	85 Cel	-40 Cel		BOTTOM		.6 mm	6 mm					6 mm	CMOS		3.3 V			.5 mm	S-PBGA-B84
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel		BOTTOM		.8 mm	7 mm	3.3V NOM SUPPLY ALSO AVAILABLE				7 mm	CMOS		1.8 V		I2C, QSPI, UART	.65 mm	S-PBGA-B84
CSR8811A08-ICXR-R	Qualcomm	MICROPROCESSOR CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM		.6 mm	2.569 mm					3.208 mm	CMOS		3.3 V			.5 mm	R-PBGA-B28	1
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.8 mm	9 mm					9 mm	CMOS		3 V			.65 mm	S-PBGA-B144			e1
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel		BOTTOM		.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE				9 mm	CMOS		1.8 V			.65 mm	S-PBGA-B144
TWL92230CZQE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.8 V	85 Cel	-30 Cel		BOTTOM		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm	BICMOS					.5 mm	S-PBGA-B80		Not Qualified
TWL92230CZQER	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.8 V	85 Cel	-30 Cel		BOTTOM		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm	BICMOS					.5 mm	S-PBGA-B80		Not Qualified
CC3000YFVR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	126	VFBGA	RECTANGULAR	UNSPECIFIED	YES	4.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM						30	260		CMOS						R-XBGA-B126	1		e1
OMAP3503DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm					12 mm	CMOS		1.8 V	Graphics Processors		.4 mm	S-PBGA-B515	3	Not Qualified	e1
DLPC3439ZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel		BOTTOM		1 mm	13 mm					13 mm	CMOS		1.1 V			.8 mm	S-PBGA-B201
DLPC3438CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		1 mm	13 mm			30	260	13 mm	CMOS		1.1 V			.8 mm	S-PBGA-B201	3		e1
OMAP3515DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA515,28X28,16	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm			30	260	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm	S-PBGA-B515	3	Not Qualified	e1
LM8330TMX	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-30 Cel		BOTTOM		.675 mm	2.015 mm					2.015 mm	CMOS		1.8 V			.4 mm	S-PBGA-B25
OMAP3515DCBB	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA515,23X23,20	1.71 V	90 Cel	0 Cel		BOTTOM		.9 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm	S-PBGA-B515		Not Qualified
OMAP3515DCBCA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA515,26X26,20	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm			30	260	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm	S-PBGA-B515	3	Not Qualified	e1
OMAP3503DCBB	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,23X23,20	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm			30	260	12 mm	CMOS		1.8 V	Graphics Processors		.4 mm	S-PBGA-B515	3	Not Qualified	e1
OMAP3503DCBCA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm			30	260	12 mm	CMOS		1.8 V	Graphics Processors		.4 mm	S-PBGA-B515	3	Not Qualified	e1
DLPC2607ZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.95 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM							260		CMOS		1 V				S-PBGA-B176	3		e1
DLPC3437CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		1 mm	13 mm			30	260	13 mm	CMOS		1.1 V			.8 mm	S-PBGA-B201	3		e1
DLPC3433CZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		1 mm	7 mm			30	260	7 mm	CMOS		1.1 V			.4 mm	S-PBGA-B176	3		e1
OMAP3515DCBC	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA515,21X21,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm			30	260	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm	S-PBGA-B515	3	Not Qualified	e1
OMAP3503DCBC	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,21X21,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		.9 mm	12 mm			30	260	12 mm	CMOS		1.8 V	Graphics Processors		.4 mm	S-PBGA-B515	3	Not Qualified	e1
DLPC3434CZVB	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH					Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		1 mm	7 mm			30	260	7 mm	CMOS					.4 mm	S-PBGA-B176	3		e1
AM6252ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm					13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425
AM6252ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm			30	250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6251ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6232ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
AM6231ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm				250	13 mm	CMOS		.75 V			.5 mm	S-PBGA-B425	3
LC898113	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM		.8 mm	4 mm					4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49
LC898124EP3XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA27,3X9,16	2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		.33 mm	1.3 mm			30	260	3.89 mm	CMOS		2.8 V			.4 mm	R-PBGA-B27	1		e1
LC898129DP1XHTBG	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	40	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA40,4X10,16	2.7 V	85 Cel	-30 Cel	TIN SILVER	BOTTOM		.35 mm	1.6 mm		1 MHz	30	260	4.15 mm			2.8 V		I2C, SPI	.4 mm	R-PBGA-B40	1		e2
LC898124EP2XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		.33 mm	1.3 mm			30	260	3.89 mm	CMOS		2.8 V			.4 mm	R-PBGA-B27	1		e1
LC898128DP1XGTBG	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel	TIN SILVER	BOTTOM		.35 mm	1.175 mm			30	260	4.3 mm	CMOS		2.8 V			.4 mm	R-PBGA-B30	1		e2
LC898123F40XC-VH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		.45 mm	2.3 mm			30	260	3.22 mm	CMOS		2.8 V			.4 mm	R-PBGA-B35	1		e1
LC898123AXD-VH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		.45 mm	2.3 mm			30	260	3.39 mm	CMOS		2.8 V			.4 mm	R-PBGA-B35	1		e1
LC898124EP1XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		.33 mm	1.3 mm			30	260	3.89 mm	CMOS		2.8 V			.4 mm	R-PBGA-B27	1		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.