PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

Reset All

Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
CY8C6136FTI-F42	Infineon Technologies	PROGRAMMABLE SoC	BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,11X15,14	1.7 V	85 Cel	-40 Cel		BOTTOM	.33 mm	3.19 mm			3.676 mm	CMOS	1.8 V	.35 mm	R-PBGA-B80
CY8C4125LQA-S433	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm			7 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4146LQE-S253	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQE-S243	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4124PVA-S412	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4
CY8C4147LQE-S253	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4125PVS-S422	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4
CY8C4127LQA-S453	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQS-S263	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C6117BZI-F34	Infineon Technologies	PROGRAMMABLE SoC	BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm			9 mm	CMOS	1.8 V	.65 mm	S-PBGA-B124	3	e1
CY8C6137BZI-F14	Infineon Technologies	PROGRAMMABLE SoC	BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm	9 mm			9 mm	CMOS	1.8 V	.65 mm	S-PBGA-B124	3	e1
CY8C4127AZS-S445	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4147LQA-S263	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4146AZS-S255	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4125PVS-S412	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4
CY8C4147AZE-S295	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C4146AZA-S275	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4147AZA-S285	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4126AZA-S455	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C21334-24PVXA	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm	20	260	7.2 mm	CMOS	5 V	.65 mm	R-PDSO-G20	3	e3
CY8C4146PVS-S432	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4
CY8C4147LQS-S283	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40	3
CY8C4146AZS-S245	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C624ALQI-S2D02	Infineon Technologies	PROGRAMMABLE SoC																									3
CY8C4146LQE-S453	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4146LQA-S253	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147AZS-S245	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4124LQA-S423	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4146LQA-S433	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4146LQS-S453	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4146LQA-S453	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQA-S273	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4125LQE-S423	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm			7 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4147AZE-S245	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64
CY8C624ALQI-S2D42	Infineon Technologies	PROGRAMMABLE SoC																									3
CY8C4014SXS-421Z	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	SMALL OUTLINE	SOP16,.25	1.71 V	105 Cel	-40 Cel		DUAL	1.727 mm	3.8985 mm			9.893 mm	CMOS	3.3 V	1.27 mm	R-PDSO-G16	3
CY8C4127LQE-S443	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4146LQA-S263	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147AZS-S265	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	105 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64	3
CY8C4125LQE-S413	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.27SQ,20	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm	7 mm			7 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4146LQA-S423	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C6248AZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC														PURE TIN											3
CY8C4124PVE-S432	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4
CY8C4126LQA-S453	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147LQE-S273	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4146PVE-S432	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	2 mm	5.3 mm			10.2 mm	CMOS	1.8 V	.65 mm	R-PDSO-G28	3	e4
CY8C4147LQS-S273	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
CY8C4147AZE-S465	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	125 Cel	-40 Cel		QUAD	1.6 mm	10 mm			10 mm	CMOS	3.3 V	.5 mm	S-PQFP-G64

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.