PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
CY8C21534-24PVXA	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	AEC-Q100	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	-40 Cel		DUAL	2 mm	5.3 mm			10.2 mm	CMOS	5 V	.65 mm	R-PDSO-G28	3
CY8C4247AZA-M475	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	10 mm	30	260	10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C4124LQA-S413	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1.89 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.6 mm	6 mm			6 mm	CMOS	1.8 V	.5 mm	S-XQCC-N40	3	e4
CY8C4245AZA-M443	Infineon Technologies	PROGRAMMABLE SoC		GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.8 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	7 mm			7 mm	CMOS	3 V	.5 mm	S-PQFP-G48	3
CY8C4127LQS-S443	Infineon Technologies	PROGRAMMABLE SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	AEC-Q100	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.8 V	105 Cel	-40 Cel		QUAD	.6 mm	6 mm			6 mm	CMOS	3.3 V	.5 mm	S-XQCC-N40
XQZU15EG-L1FFRB1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU7EV-1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU15EG-1FFRB1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU5EV-L1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XQZU5EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU15EG-1FFRC900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	31 mm	40	245	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU15EG-L1FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	31 mm	40	245	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU15EG-1FFRB1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU7EV-2FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU5EV-1SFRC784M	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	125 Cel	-55 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XQZU15EG-1FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	31 mm	40	245	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU5EV-2FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU5EV-2SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XQZU3EG-2SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XQZU15EG-2FFRC900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	31 mm	40	245	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU3EG-L1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XQZU11EG-L1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU7EV-1FFRC1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU3EG-2SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm	40	245	19 mm	CMOS	.85 V	.8 mm	S-PBGA-B484	4	e0
XQZU7EV-2FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU5EV-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XQZU3EG-1SFRC784M	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	125 Cel	-55 Cel	TIN LEAD	BOTTOM	3.52 mm	23 mm	20	220	23 mm	CMOS	.85 V	.8 mm	S-PBGA-B784	4	e0
XQZU3EG-1SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm	40	245	19 mm	CMOS	.85 V	.8 mm	S-PBGA-B484	4	e0
XQZU5EV-1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU7EV-1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU7EV-L1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU5EV-L1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm		225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0
XQZU11EG-2FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU15EG-2FFRB1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.62 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU11EG-1FFRC1156I	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY	BGA1156,34X34,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	35 mm	40	245	35 mm	CMOS	.85 V	1 mm	S-PBGA-B1156	4	e0
XQZU3EG-L1SFRA484I	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.35 mm	19 mm	40	245	19 mm	CMOS	.85 V	.8 mm	S-PBGA-B484	4	e0
XCZU29DR-2FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	240		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU42DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC
XCZU29DR-2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	245		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU42DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU49DR-L1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM			30	240		CMOS	.72 V		R-PBGA-B1760	4	e1
XCZU48DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	245		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU46DR-2FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	240		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU48DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	240		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU48DR-L1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM			30	240		CMOS	.72 V		R-PBGA-B1156	4	e1
XCZU42DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU28DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	240		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU21DR-1FFVD1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			30	245		CMOS	.85 V		R-PBGA-B1156	4	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.