PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Technology	Nominal Supply Voltage	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU27DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU47DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU47DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU28DR-L2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	240	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU47DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU47DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU46DR-L1FSVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1760	4	e1
XCZU28DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU27DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU46DR-1FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1760	4	e1
XCZU2EG-L2UBVA530E	Xilinx	PROGRAMMABLE SoC																30	245				4
XCZU47DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU25DR-L2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU28DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU25DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU48DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU3EG-2SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				CMOS	.85 V	R-PBGA-B484	4	e1
XCZU25DR-L1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	240	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU46DR-2FFVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1760	4	e1
XCZU25DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU29DR-L2FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	240	CMOS	.72 V	R-PBGA-B1760	4	e1
XCZU48DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU28DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU27DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU29DR-2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1760	4	e1
XCZU2EG-2UBVA530I	Xilinx	PROGRAMMABLE SoC																30	245				4
XCZU29DR-L2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1760	4	e1
XCZU3EG-L1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			CMOS	.72 V	R-PBGA-B484	4	e1
XCZU39DR-L2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1760	4	e1
XCZU43DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC
XCZU27DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU28DR-L2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU67DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU1EG-2LSFVC784E	Xilinx	PROGRAMMABLE SoC
XCZU1CG-1LUBVA494I	Xilinx	PROGRAMMABLE SoC
XCZU1EG-1LUBVA494I	Xilinx	PROGRAMMABLE SoC
XCZU1CG-2LSBVA484E	Xilinx	PROGRAMMABLE SoC
XCZU1EG-1LSFVC784I	Xilinx	PROGRAMMABLE SoC
XCZU1EG-1LSFVA625I	Xilinx	PROGRAMMABLE SoC
XCZU3EG-1LUVBA530I	Xilinx	PROGRAMMABLE SoC
XCZU65DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU1CG-1LSFVA625I	Xilinx	PROGRAMMABLE SoC
XCZU3CG-2LUBVA530E	Xilinx	PROGRAMMABLE SoC
XCZU67DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU3EG-2LUVBA530E	Xilinx	PROGRAMMABLE SoC
XCZU1EG-2LSFVA625E	Xilinx	PROGRAMMABLE SoC
XCZU2CG-1LUBVA530I	Xilinx	PROGRAMMABLE SoC
XCZU1EG-2LUBVA494E	Xilinx	PROGRAMMABLE SoC

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.