PROGRAMMABLE SoC Other Function uPs,uCs & Peripheral ICs 1,173

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Technology	Nominal Supply Voltage	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU43DR-L1FFVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU49DR-2FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1760	4	e1
XCZU48DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU48DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU43DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC
XCZU43DR-L1FSVG1517I	Xilinx	PROGRAMMABLE SoC
XCZU39DR-L2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1760	4	e1
XCZU25DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU28DR-L2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	240	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU27DR-L2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU27DR-L2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU28DR-L1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	240	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU28DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU48DR-L2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU43DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC
XCZU42DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU29DR-1FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1760	4	e1
XCZU47DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU3EG-2UBVA530I	Xilinx	PROGRAMMABLE SoC																30	245				4
XCZU28DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU21DR-2FFVD1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU47DR-L2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU3EG-1UBVA530I	Xilinx	PROGRAMMABLE SoC																30	245				4
XCZU43DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC
XCZU47DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU28DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU25DR-L2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU47DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU48DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.72 V	R-PBGA-B1156	4	e1
XCZU28DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU27DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1517	4	e1
XCZU28DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU2EG-1UBVA530I	Xilinx	PROGRAMMABLE SoC																30	245				4
XCZU2EG-1UBVA530E	Xilinx	PROGRAMMABLE SoC																30	245				4
XCZU46DR-L1FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.72 V	R-PBGA-B1760	4	e1
XCZU43DR-L1FFVG1517I	Xilinx	PROGRAMMABLE SoC
XCZU43DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC
XCZU29DR-L1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245	CMOS	.72 V	R-PBGA-B1760	4	e1
XCZU46DR-2FFVH1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1760	4	e1
XCZU47DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1517	4	e1
XCZU43DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU21DR-1FFVD1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU47DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU43DR-1FSVE1156I	Xilinx	PROGRAMMABLE SoC
XCZU27DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		30	240	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU48DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		30	245	CMOS	.85 V	R-PBGA-B1156	4	e1
XCZU43DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC
XCZU3EG-L2UBVA530E	Xilinx	PROGRAMMABLE SoC																30	245				4

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.