OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MCIMX6Y2DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm		14 mm			40	260	14 mm	CMOS				.8 mm		S-PBGA-B289	3
XCZU4CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V					R-PBGA-B900	4			e1
MCIMX6Q5EYM12AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE		40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6S5EVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6U5DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
XCZU2CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250		CMOS	.85 V					R-PBGA-B484	4			e1
TMS320DM368ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32	30	260	13 mm	CMOS	1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XCZU3CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250		CMOS	.85 V					R-PBGA-B484	4			e1
XCZU19EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V					R-PBGA-B1517	4			e1
XCZU3EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS	.85 V					R-PBGA-B784	4			e1
MCIMX7D7DVM10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,30	1.045 V	95 Cel	0 Cel		BOTTOM	1.4 mm		19 mm			40	260	19 mm	CMOS	1.1 V			.75 mm		S-PBGA-B541	3
XCZU7EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.9 V					R-PBGA-B900	4			e1
MCIMX6S5EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX7D3DVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	95 Cel	0 Cel		BOTTOM	1.1 mm		12 mm			40	260	12 mm	CMOS	1.1 V			.4 mm		S-PBGA-B488	3
XCZU11EG-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V					R-PBGA-B1156	4			e1
MCIMX515DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm			40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX6S8DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
XCZU11EG-1FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V					R-PBGA-B1517	4			e1
VCBU68WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm			30	260	13 mm	CMOS	1.35 V			.65 mm		S-PBGA-B338	3			e1
AM4376BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm	CMOS	1.26 V			.65 mm		S-PBGA-B491	3			e1
XCZU2EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250		CMOS	.85 V					R-PBGA-B625	4			e1
XCZU3EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM									CMOS	.85 V					R-PBGA-B484	4			e1
D2-92683-QR-T	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm		10 mm			30	260	10 mm	CMOS	1.8 V			.5 mm		S-PQCC-N72	3			e3
TMS320DM368ZCE48	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm			30	260	13 mm	CMOS	1.35 V			.65 mm		S-PBGA-B338	3			e1
AM4378BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm	CMOS	1.325 V			.65 mm		S-PBGA-B491	3			e1
XCZU2CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS	.85 V					R-PBGA-B625	4			e1
MCIMX6QP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.		40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1
MCIMX6Y2DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm		14 mm			40	260	14 mm	CMOS				.8 mm		S-PBGA-B289	3
VS3674PITTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm			30	260	13 mm	CMOS	1.35 V			.65 mm		S-PBGA-B338	3			e1
VS3674UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm			30	260	13 mm	CMOS	1.35 V			.65 mm		S-PBGA-B338	3			e1
XCZU3CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250		CMOS	.85 V					R-PBGA-B625	4			e1
MIMX8MM4DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS	1 V			.5 mm		S-PBGA-B486	3			e2
AM4376BZDN100	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm			30	260	17 mm	CMOS	1.325 V			.65 mm		S-PBGA-B491	3			e1
MCIMX27VOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ		40	260	17 mm	CMOS	1.45 V			.65 mm		S-PBGA-B404	3	Not Qualified		e1
XCZU25DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.85 V					R-PBGA-B1156	4			e1
XCZU25DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	240		CMOS	.85 V					R-PBGA-B1517	4			e1
XCZU7EV-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.9 V					R-PBGA-B1156	4			e1
XCZU11EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm			30	245	40 mm	CMOS	.85 V			1 mm		R-PBGA-B1517	4			e1
AM5718AABCX	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm			30	250	23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760	3		1500 rpm	e1
XCZU11EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V					R-PBGA-B1760	4			e1
XCZU5CG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V					R-PBGA-B900	4			e1
XCZU25DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V					R-PBGA-B1517	4			e1
XCZU2CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS	.85 V					S-PBGA-B784	4			e1
PN7120A0EV/C10801E	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM						30	260			1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PBGA-B49	3	Not Qualified		e1
THGBM5G5A1JBAIRH2H	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel		BOTTOM	1 mm		11.5 mm					13 mm	CMOS	3.3 V			.5 mm		R-PBGA-B153
XCZU7EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm			30	245	40 mm	CMOS	.85 V			1 mm		R-PBGA-B1517	4			e1
XCZU7EG-3FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.9 V					R-PBGA-B1517	4			e1
SSD1926QL9	Solomon Systech	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.98 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1.62 V	85 Cel	-30 Cel		QUAD	1.6 mm		14 mm					14 mm	CMOS	1.8 V			.4 mm		S-PQFP-G128

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.