OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Bits	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
D2MC-72083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		30	260	14 mm	CMOS	1.8 V		.4 mm	S-PQFP-G128	3		e3
89TSF552BL	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	960	BGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY		1.71 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	3.29 mm	35 mm				35 mm	CMOS	1.8 V			S-PBGA-B960		Not Qualified	e0
D2-74583-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		30	260	14 mm	CMOS	1.8 V		.4 mm	S-PQFP-G128	3		e3
CDP68HC68P1E	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	6 V	8	5	IN-LINE	DIP16,.3	3 V	85 Cel	-55 Cel	TIN LEAD	DUAL	5.33 mm	7.62 mm				19.17 mm	CMOS	3.3 V	Parallel IO Port	2.54 mm	R-PDIP-T16		Not Qualified	e0
M65761FP	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			FLATPACK		4.5 V	70 Cel	-20 Cel		QUAD	3.05 mm	14 mm				20 mm	CMOS	5 V		.65 mm	S-PQFP-G100		Not Qualified
UPD77630AF1-ENZ-A	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	481	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	70 Cel	-20 Cel		BOTTOM	1.3 mm	12.7 mm				12.7 mm	CMOS	1.2 V		.5 mm	S-PBGA-B481
89TSF553BL	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	960	BGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY		1.71 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	3.29 mm	35 mm				35 mm	CMOS	1.8 V			S-PBGA-B960		Not Qualified	e0
D2-71683-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		30	260	14 mm	CMOS	1.8 V		.4 mm	S-PQFP-G128	3		e3
S3F49DAXXX-KT	Samsung	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	CHIP CARRIER	LCC64,.35SQ,20		85 Cel	-25 Cel		QUAD							CMOS		Other Microprocessor ICs	.5 mm	S-PQCC-N64		Not Qualified
MTFC4GMCDM-1MWTES	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-25 Cel		BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V		.5 mm	R-PBGA-B153
MTFC4GMCDM-1MWT	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-25 Cel		BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V		.5 mm	R-PBGA-B153
MTFC8GLCDM-1MWTES	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-25 Cel		BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS	1.8 V		.5 mm	R-PBGA-B153

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.