OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCZU9CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel		BOTTOM	2.61 mm	19 mm					19 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU5EV-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B900	4	e1
XCZU47DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU4EG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B900	4	e1
XCZU7CG-2LFFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1517,39X39,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4	e1
XCZU15EG-2LFFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	31 mm		0	30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU27DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU9CG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU9CG-2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	35 mm			30	245	35 mm	CMOS	.85 V		1 mm	R-PBGA-B1156	4	e1
XCZU2EG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU7EV-3FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V	GRID ARRAY		.873 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.9 V			R-PBGA-B1517	4	e1
XCZU9CG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B900	4	e1
XCZU28DR-L2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	240		CMOS	.72 V			R-PBGA-B1517	4	e1
XCZU6CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA625,25X25,32	.825 V	100 Cel		BOTTOM	3.43 mm	21 mm					21 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B625
XCZU3EG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU6EG-3FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V	GRID ARRAY		.873 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.9 V			R-PBGA-B900	4	e1
XCZU2EG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	R-PBGA-B625	4	e1
XCZU7EV-2LFFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1517,39X39,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4	e1
XCZU7EG-2LFFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1156,34X34,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm		0	30	245	35 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4	e1
XCZU5CG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU28DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU27DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1517	4	e1
XCZU17EG-2FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	45 mm			30	245	45 mm	CMOS	.85 V		1 mm	R-PBGA-B1924	4	e1
XCZU9CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XCZU19EG-1FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1924	4	e1
XCZU3CG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU4EG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm			30	245	31 mm	CMOS	.85 V		1 mm	R-PBGA-B900	4	e1
XCZU25DR-L2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B1156	4	e1
XCZU19EG-2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm			30	245	42.5 mm	CMOS	.85 V		1 mm	R-PBGA-B1760	4	e1
XCZU6CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel		BOTTOM	2.88 mm	31 mm					31 mm	CMOS	.85 V	I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU5EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B900	4	e1
XCZU7CG-2LFFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1156,34X34,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm		0	30	245	35 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4	e1
XCZU17EG-2LFFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1924,44X44,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	45 mm		0	30	245	45 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1924	4	e1
XCZU27DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU4EV-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			100 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	250		CMOS	.9 V			S-PBGA-B784	4	e1
XCZU9CG-2LFFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1156,34X34,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	35 mm		0	30	245	35 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4	e1
XCZU2EG-2LSFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA625,25X25,32		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4	e1
XCZU4EV-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU3EG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS	.85 V		.8 mm	R-PBGA-B625	4	e1
XCZU5EV-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4	e1
XCZU47DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1517	4	e1
XCZU4CG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS	.72 V			R-PBGA-B900	4	e1
XCZU29DR-1FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1760	4	e1
XCZU7EG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		110 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU6CG-2LFFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA900,30X30,40		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	31 mm		0	30	245	31 mm	CMOS	.85 V	CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4	e1
XCZU2EG-2LSBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY, FINE PITCH	BGA484,22X22,32		110 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		0	30	250	19 mm	CMOS	.85 V	CAN, I2C, SPI, UART	.8 mm	S-PBGA-B484	4	e1
XCZU7CG-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS	.85 V			R-PBGA-B1156	4	e1
XCZU25DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS	.85 V			R-PBGA-B1517	4	e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.