OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MCIMX6Q5EZK08AD	NXP Semiconductors	SoC	OTHER	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm		40	260	12 mm	CMOS		1.4 V		.4 mm	S-PBGA-B569	3		e1
MFRC52301HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD				30	260			10 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified	e4
MCIMX513CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm		40	260	19 mm	CMOS		1 V	Graphics Processors	.8 mm	S-PBGA-B529	3	Not Qualified	e1
MFRC63102HN,557	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								20 mA	5 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
MCIMX6Y7DVM09AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MCIMX6Q5EYM12AE	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6D5EZK08AD	NXP Semiconductors	SoC	OTHER	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm		40	260	12 mm	CMOS		1.4 V		.4 mm	S-PBGA-B569	3		e1
MFRC53001T/0FEA,11	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP32,.4		85 Cel	-25 Cel		DUAL								40 mA	5 V	Other Microprocessor ICs	1.27 mm	R-PDSO-G32		Not Qualified
MCIMX27LVJP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V	1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel	-20 Cel		BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		1.45 V	Microprocessors	.65 mm	S-PBGA-B404		Not Qualified
SE050A1HQ1/Z01SG	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel	-25 Cel		QUAD	.33 mm	3 mm				3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20
MFRC53001T/0FE,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP32,.4		85 Cel	-25 Cel		DUAL					250			40 mA	5 V	Other Microprocessor ICs	1.27 mm	R-PDSO-G32	3	Not Qualified
MCIMX502EVM8B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm	CMOS		1.05 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6U5DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMX8MN4DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MCIMX515DVK8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA527,25X25,20	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	13 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	13 mm	CMOS		1.1 V	Graphics Processors	.5 mm	S-PBGA-B625	3	Not Qualified	e1
MIMX8MM5DVTLZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MCIMX6D5EYM10AER	NXP Semiconductors	SoC	OTHER	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
SE050B1HQ1/Z01SE	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel	-25 Cel		QUAD	.33 mm	3 mm				3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20
SE050C1HQ1/Z01SC	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel	-25 Cel		QUAD	.33 mm	3 mm				3 mm	CMOS		1.8 V		.4 mm	S-PQCC-N20
MCIMX7D2DVK12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	85 Cel	0 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS		1.225 V		.4 mm	S-PBGA-B488	3
MCIMX6Y1DVK05AA	NXP Semiconductors	SoC	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS				.5 mm	S-PBGA-B272	3
MIMX8MN3DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MCIMX31DVMN5D	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V	1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	1.52 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.54 mm	19 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	19 mm	CMOS			Microprocessors	.8 mm	S-PBGA-B473	3	Not Qualified	e1
A7101CLTK2/T0BC2	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MCIMX7D3EVK10SC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.045 V	105 Cel	-20 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS		1.1 V		.4 mm	S-PBGA-B488	3
A7101CLTK2/T0BC2WJ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY		260	4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8	1
MCIMX357DJQ5C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS		1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX6D5EYM12AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
A7101CLTK2/T0BC27F	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MCIMX6U8DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX6S8DVM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MIMX8MN2DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
A7101CHUK/T0BC2HAZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	85 Cel	-25 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY	NOT SPECIFIED	NOT SPECIFIED	2.06 mm	CMOS		1.8 V		.5 mm	R-PBGA-B12
MCIMX353DJQ5C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V	40	260	17 mm	CMOS		1.8 V		.8 mm	S-PBGA-B400	3	Not Qualified	e1
A7101CLTK2/T0BC27J	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY		260	4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8	1
MCIMX27VJP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ	40	260	17 mm	CMOS		1.45 V		.65 mm	S-PBGA-B404	3	Not Qualified	e1
MFRC63102HN,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								20 mA	5 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
MCIMX6S8DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
SLE66CLX360PEC	Infineon Technologies		OTHER								1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS			Other uPs/uCs/Peripheral ICs				Not Qualified
SLE66CLX800PEC	Infineon Technologies		OTHER								1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS			Other uPs/uCs/Peripheral ICs				Not Qualified
SLE76CF3601PC	Infineon Technologies		OTHER								1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS			Other Microprocessor ICs				Not Qualified
SLE66CLX360M-C	Infineon Technologies		OTHER								1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS			Other Microprocessor ICs				Not Qualified
SLE6636ED	Infineon Technologies		OTHER								5		DIE OR CHIP		80 Cel	-40 Cel									CMOS		5 V	Other Microprocessor ICs				Not Qualified
SLE6636C	Infineon Technologies		OTHER								5		DIE OR CHIP		80 Cel	-40 Cel									CMOS		5 V	Other Microprocessor ICs				Not Qualified
SLE66CL180PEMC	Infineon Technologies		OTHER								1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS			Other uPs/uCs/Peripheral ICs				Not Qualified
SLE66C327PEC	Infineon Technologies		OTHER								1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS			Other uPs/uCs/Peripheral ICs				Not Qualified
SLE66CLX1280PE(M/S)-C	Infineon Technologies		OTHER								1.8/5		DIE OR CHIP		85 Cel	-25 Cel									CMOS			Other Microprocessor ICs				Not Qualified
CYW54907KWBG	Infineon Technologies	SYSTEM ON CHIP	OTHER	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA316(UNSPEC)	1.14 V	85 Cel	-30 Cel		BOTTOM	.33 mm	4.907 mm	MINIMUM BUMP PITCH IS CONSIDERED			5.848 mm	CMOS		1.2 V		.2 mm	R-PBGA-B316

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.