OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
T1024NSN7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
P40C040U75	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		QCCN	UNSPECIFIED	UNSPECIFIED		5.5 V		CHIP CARRIER		4.5 V	85 Cel	-25 Cel		UPPER			ALSO OPERATES AT 1.62 V				CMOS		5 V			X-XUCC-N
TDA8002CG/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	3 V	85 Cel	-25 Cel	TIN	QUAD	1.6 mm	5 mm				5 mm	CMOS	140 mA	3.3 V	Other Microprocessor ICs	.5 mm	S-PQFP-G32	3	Not Qualified	e3
TDA8002U/5/C2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	6.5 V		UNCASED CHIP		4.5 V	85 Cel	-25 Cel		UPPER							CMOS		5 V			X-XUUC-N		Not Qualified
P5CD020X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS			Other Microprocessor ICs		R-XDMA-X8		Not Qualified
88MW320-A0-NAPE/AZ	NXP Semiconductors	SoC	OTHER																				260								3
P40C040X60	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8		UNSPECIFIED	UNSPECIFIED	YES	5.5 V		MICROELECTRONIC ASSEMBLY		4.5 V	85 Cel	-25 Cel		UNSPECIFIED			ALSO OPERATES AT 1.62 V				CMOS		5 V			X-XXMA-N8
P60D080PX30	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1.98 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER			IT ALSO OPERATES WITH 3V AND 5V SUPPLY				CMOS		1.8 V			X-XUUC-N
P5SC072EV0/TXXX	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER					PLASTIC/EPOXY			1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel												Other Microprocessor ICs				Not Qualified
TDA8002U/3/C2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	6.5 V		UNCASED CHIP		3 V	85 Cel	-25 Cel		UPPER							CMOS		5 V			X-XUUC-N		Not Qualified
P5CD016HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD		5 mm	ALSO OPERATES AT 3V, 5V SUPPLY			5 mm	CMOS		1.8 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
NT2H0301F0DTL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC4,.08,20		70 Cel	-25 Cel		DUAL	.8 mm	2 mm				3 mm	CMOS			Serial IO/Communication Controllers	.5 mm	R-PDSO-N8		Not Qualified
P5CD128X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1.98 V		MICROELECTRONIC ASSEMBLY		1.62 V	85 Cel	-25 Cel		DUAL							CMOS		1.8 V			R-XDMA-X
P5CC040XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		UNSPECIFIED							CMOS		1.8 V	Other Microprocessor ICs		X-XXMA-X		Not Qualified
P5CD051XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	3		UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel	PALLADIUM	UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY				CMOS		1.8 V	Other Microprocessor ICs		X-XXMA-X		Not Qualified	e4
TDA8007BHL	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	6 V	3/5	FLATPACK	QFP48,.35SQ,20	2.7 V	85 Cel	-25 Cel	MATTE TIN	QUAD							CMOS	300 mA	3.3 V	Other Microprocessor ICs	.5 mm	S-PQFP-G48		Not Qualified	e3
P5CD020A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS			Other Microprocessor ICs		R-XDMA-X		Not Qualified
P5CC080HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD							CMOS		1.8 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
T1024NSN7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				23 mm	CMOS		1 V		.8 mm	S-PBGA-B780	3		e1
TDA8002CT/B/C1,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm				17.9 mm	CMOS		3.3 V		1.27 mm	R-PDSO-G28		Not Qualified	e4
P60C144PHN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		1.8/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD							CMOS			Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
MF0ICU1001W/U7D,00	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER										DIE OR CHIP		70 Cel	-25 Cel												Other Microprocessor ICs				Not Qualified
P5CN080HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD							CMOS		1.8 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified
P5CD040A6	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL							CMOS			Other Microprocessor ICs		R-XDMA-X		Not Qualified
MF3MOD2101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MPC8548EVJATJA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935369482023	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,20	1.62 V	85 Cel	-25 Cel		BOTTOM	.65 mm	2.018 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			2.06 mm	CMOS		1.8 V		.5 mm	R-PBGA-B12
MF3MODH4101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
935368739118	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MF3ICD8101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS			Other Microprocessor ICs		X-XUUC-N		Not Qualified
MPC8548EVJATHB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3ICD2101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS			Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3MODH4101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MPC8548EVJAVJB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAQHB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
935368097118	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MF3ICDH4101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS			Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3MOD8101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MPC8548EVJAQJB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
HTCM400/EAE,122	NXP Semiconductors		OTHER		27			PLASTIC/EPOXY			5	MICROELECTRONIC ASSEMBLY	MODULE,27LEAD,1		85 Cel	-25 Cel										100 mA	5 V	Other uPs/uCs/Peripheral ICs				Not Qualified
MPC8548EVJATJB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3MOD4101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MPC8548EVJAUHB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAVGB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3MODH8101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
935372576118	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MPC8548EVJATHA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAUGA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.