OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
SLE88CF4000PDSO20	Infineon Technologies		OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		1.8/5	SMALL OUTLINE	SOP20,.4		85 Cel	-25 Cel		DUAL											Other Microprocessor ICs		1.27 mm	R-PDSO-G20		Not Qualified
SLS32AIA010MK	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		BOTTOM	.6 mm	3 mm					3 mm	CMOS		3.3 V			.5 mm	S-PDSO-N10
SLS32AIA020U2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		DUAL	.6 mm	3 mm					3 mm	CMOS		3.3 V			.5 mm	S-PDSO-N10
SLS32AIA020A4	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		DUAL	.6 mm	3 mm					3 mm	CMOS					.5 mm	S-PDSO-N10
SLS32AIA020X4	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		DUAL	.6 mm	3 mm					3 mm	CMOS		5 V			.5 mm	S-PDSO-N10
SLS32AIA020X4USON10XTMA4	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		DUAL	.6 mm	3 mm					3 mm	CMOS		5 V			.5 mm	S-PDSO-N10
SLS32AIA010MS	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		BOTTOM	.6 mm	3 mm					3 mm	CMOS		3.3 V			.5 mm	S-PDSO-N10
SLS32AIA020U2USON10XTMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		DUAL	.6 mm	3 mm					3 mm	CMOS		3.3 V			.5 mm	S-PDSO-N10	1
PT8A3518CWEX	Diodes Incorporated		OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP8,.25		85 Cel	-10 Cel		DUAL								CMOS	.4 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	R-PDSO-G8		Not Qualified
PT8A3516CWEX	Diodes Incorporated		OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP8,.25		85 Cel	-10 Cel		DUAL								CMOS	.4 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	R-PDSO-G8		Not Qualified
PT8A3515CWEX	Diodes Incorporated		OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP8,.25		85 Cel	-10 Cel		DUAL								CMOS	.4 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	R-PDSO-G8		Not Qualified
PT8A3517CWEX	Diodes Incorporated		OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP8,.25		85 Cel	-10 Cel		DUAL								CMOS	.4 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	R-PDSO-G8		Not Qualified
PT8A3519CWEX	Diodes Incorporated		OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP8,.25		85 Cel	-10 Cel		DUAL								CMOS	.4 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	R-PDSO-G8		Not Qualified
PT8A3514CWEX	Diodes Incorporated		OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP8,.25		85 Cel	-10 Cel		DUAL								CMOS	.4 mA	5 V	Other uPs/uCs/Peripheral ICs		1.27 mm	R-PDSO-G8		Not Qualified
PT8A3240PE	Diodes Incorporated		OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		3.5/5	IN-LINE	DIP8,.3		85 Cel	-20 Cel		DUAL								CMOS	.25 mA		Other uPs/uCs/Peripheral ICs		2.54 mm	R-PDIP-T8		Not Qualified
XCZU25DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU17EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU9CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel		BOTTOM	2.88 mm	31 mm					31 mm	CMOS		.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU5EG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU19EG-3FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.9 V				R-PBGA-B1517	4		e1
XCZU11EG-2LFFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1760,42X42,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm		0	30	245	42.5 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1760	4		e1
XCZU17EG-L2FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V				R-PBGA-B1924	4		e1
XCZU2EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS		.85 V			.8 mm	S-PBGA-B784	4		e1
XCZU46DR-2FFVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU7CG-2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm			30	245	35 mm	CMOS		.85 V			1 mm	R-PBGA-B1156	4		e1
XCZU4CG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU29DR-L2FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	240		CMOS		.72 V				R-PBGA-B1760	4		e1
XCZU48DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU17EG-3FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.9 V				R-PBGA-B1924	4		e1
XCZU5EG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS		.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4		e1
XCZU7EG-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V				R-PBGA-B1156	4		e1
XCZU3CG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS		.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4		e1
XCZU5EV-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU4EG-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	250		CMOS		.9 V				S-PBGA-B784	4		e1
XCZU27DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU11EG-2LFFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1517,39X39,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4		e1
XCZU29DR-L2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V				R-PBGA-B1760	4		e1
XCZU2EG-3SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	250		CMOS		.9 V				S-PBGA-B625	4		e1
XCZU9CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel		BOTTOM	2.88 mm	31 mm					31 mm	CMOS		.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU2EG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS		.72 V				R-PBGA-B784	4		e1
XCZU29DR-2FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU29DR-2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU6CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY, FINE PITCH	BGA78428X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS		.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B784	4
XCZU3EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS		.85 V			.8 mm	S-PBGA-B784	4		e1
XCZU48DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU6EG-2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	35 mm			30	245	35 mm	CMOS		.85 V			1 mm	R-PBGA-B1156	4		e1
XCZU46DR-2FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU19EG-L2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V				R-PBGA-B1760	4		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.