OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MF3ICD4101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS			Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3MODH2101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MF3MODH8101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MF3ICD8101DUD/01	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS	30 mA		Other Microprocessor ICs		X-XUUC-N		Not Qualified
MF3MODH2101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
935373763118	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MF3MOD2101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MF3ICDH8101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS			Other Microprocessor ICs		X-XUUC-N		Not Qualified
MC92600CJUB	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V		GRID ARRAY		1.65 V	70 Cel	-40 Cel		BOTTOM	2.32 mm	23 mm		30	220	23 mm	CMOS		1.8 V		1.27 mm	S-PBGA-B217	3	Not Qualified
MPC8548EVJAQJA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAQHA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3ICDH2101DUD/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES			UNCASED CHIP	WAFER		70 Cel	-25 Cel		UPPER							CMOS			Other Microprocessor ICs		X-XUUC-N		Not Qualified
MPC8548EVJAUJD	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.294 mm	29 mm		40	260	29 mm	CMOS		1.1 V		1 mm	R-PBGA-B783	3
MPC8548EVJAUGB	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3MOD4101DA4/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
935297046118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	4	VSON	RECTANGULAR	PLASTIC/EPOXY	YES			SMALL OUTLINE, VERY THIN PROFILE			70 Cel	-25 Cel		DUAL	.5 mm	1.5 mm				2 mm	CMOS				.5 mm	R-PDSO-N4
MPC8548EVJAVJA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MPC8548EVJAVGA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MF3MOD8101DA8/05	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	PLASTIC/EPOXY	YES			MICROELECTRONIC ASSEMBLY			70 Cel	-25 Cel		UNSPECIFIED							CMOS					X-PXMA-N
MPC8548EVJAUHA	NXP Semiconductors	SoC	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V		GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel		BOTTOM	3.38 mm	29 mm	ALSO AVAILABLE IN BGA WITH STAMPED LID			29 mm	CMOS		1.1 V		1 mm	S-PBGA-B783
MCIMX353DJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm			1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX31DVKN5D	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	457	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V	1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA457,26X26,20	1.52 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	14 mm	CMOS			Microprocessors	.5 mm	S-PBGA-B457	3	Not Qualified	e1
MIMX8MN6DVTJZCA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel		BOTTOM	1.25 mm	14 mm				14 mm	CMOS		1 V		.5 mm	S-PBGA-B486
MIMX8MN6DVTJZDA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel		BOTTOM	1.25 mm	14 mm				14 mm	CMOS		1 V		.5 mm	S-PBGA-B486
MFRC52301HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD				30	260			10 mA		Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified	e4
A7101CLTK2/T0BC2BY	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MIMX8MN5DVPIZDA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm				11 mm	CMOS		.95 V		.5 mm	S-PBGA-B306
MCIMX6DP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.	40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
A7101CLTK2/T0BC2WE	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
LS1023AXN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm		30	250	21 mm	CMOS		.9 V		.8 mm	S-PBGA-B621	3		e1
MCIMX503EVM8B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	-20 Cel		BOTTOM	1.6 mm	17 mm				17 mm	CMOS		1.225 V		.8 mm	S-PBGA-B400	3
MCIMX31LDVKN5D	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	457	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V	1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA457,26X26,20	1.52 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	14 mm	CMOS			Microprocessors	.5 mm	S-PBGA-B457	3	Not Qualified	e1
MCIMX31LDVMN5D	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.65 V	1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	1.52 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.54 mm	14 mm	UNAVAILABLE FOR IMPORT OR SALE IN US	40	260	14 mm	CMOS			Microprocessors	.8 mm	S-PBGA-B473	3	Not Qualified	e1
MIMX8MM5DVTLZDA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
A7101CHTK2/T0BC2V6	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	90 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MCIMX357DJQ5CR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm			1.8 V		.8 mm	S-PBGA-B400	3		e1
MIMX8MM2DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS		1 V		.5 mm	S-PBGA-B486	3		e2
MIMX8MN5DVPIZCA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm				11 mm	CMOS		.95 V		.5 mm	S-PBGA-B306
LS1023ASE8KQA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY, FINE PITCH		.87 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm	ALSO OPERATES AT 1V SUPPLY NOM			23 mm	CMOS		.9 V		.8 mm	S-PBGA-B780
MCIMX6D5EYM12AE	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
MCIMX7D7DVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	95 Cel	0 Cel		BOTTOM	1.1 mm	12 mm		40	260	12 mm	CMOS		1.225 V		.4 mm	S-PBGA-B488	3
MCIMX357DVM5BR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.22 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm		40	260	17 mm			1.8 V		.8 mm	S-PBGA-B400	3		e1
MCIMX6D5EYM12AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		1.4 V		.8 mm	S-PBGA-B624	3		e1
935380944118	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	1.62 V	85 Cel	-25 Cel		DUAL	1 mm	4 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY			4 mm	CMOS		1.8 V		.8 mm	S-PDSO-N8
MFRC53001T/0FE,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP32,.4		85 Cel	-25 Cel		DUAL					250			40 mA	5 V	Other Microprocessor ICs	1.27 mm	R-PDSO-G32	1	Not Qualified
MFRC63102HN,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD				30	260			20 mA	5 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32	1	Not Qualified
MCIMX27VOP4-LF	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel	-20 Cel		BOTTOM	1.4 mm	17 mm	ALSO OPERATES 1.3V AT 266MHZ			17 mm	CMOS		1.45 V		.65 mm	S-PBGA-B404
MFRC63102HN,518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD								20 mA	5 V	Other Microprocessor ICs	.5 mm	S-PQCC-N32		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.