OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MFRC52202HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD						30	260			100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MCIMX535DVV1C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V		0.9/1.25,1.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm			40	260	19 mm	CMOS		1.25 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified	e2
MIMX8MM6DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
PN5321A3HN/C106,55	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/5	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD						30	260			150 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N40	2	Not Qualified	e4
XCZU4EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS		.85 V					R-PBGA-B784	4		e1
MFRC52202HN1,157	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD						30	260			100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MCIMX7D5EVM10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	105 Cel	-20 Cel		BOTTOM	1.42 mm		19 mm			40	260	19 mm	CMOS		1.225 V			.75 mm		S-PBGA-B541	3
MFRC52201HN1,115	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD						30	260			100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MCIMX6Q5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE		40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		e1
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
MFRC52202HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD						30	260			100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MIMX8MM5DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
MCIMX6Y2DVM09AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm			40	260	14 mm	CMOS		1.275 V			.8 mm		S-PBGA-B289	3		e1
SE050C1HQ1/Z01SCZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.33 mm		3 mm			30	260	3 mm	CMOS		1.8 V			.4 mm		S-PQCC-N20	1		e4
MCIMX7D3EVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	105 Cel	-20 Cel		BOTTOM	1.1 mm		12 mm			40	260	12 mm	CMOS		1.225 V			.4 mm		S-PBGA-B488	3
CC-WMX-J97C-TN	Digi International	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES				GRID ARRAY			70 Cel	-20 Cel		BOTTOM			50 mm					50 mm	CMOS					2 mm		S-XBGA-N400
SLS32AIA010MSUSON10XTMA2	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20	1.62 V	85 Cel	-25 Cel		DUAL	.6 mm		3 mm					3 mm	CMOS		3.3 V			.5 mm		S-PDSO-N10	1
TMS320DM368ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32	30	260	13 mm	CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
MCIMX6S5DVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		e1
MIMX8MM1DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
MIMX8MN5DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm		11 mm			40	260	11 mm	CMOS		.95 V			.5 mm		S-PBGA-B306	3
XCZU11EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm			30	245	40 mm	CMOS		.85 V			1 mm		R-PBGA-B1517	4		e1
MCIMX6S5DVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		e1
MCIMX6U5EVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		e1
XCZU3CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS		.85 V					S-PBGA-B784	4		e1
MIMX8MM3DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
XCZU4EV-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm		23 mm			30	250	23 mm	CMOS		.85 V			.8 mm		R-PBGA-B784	4		e1
MIMX8MN5DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
MCIMX6U5DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		e1
MFRC52201HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD						30	260			100 mA		Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified
MCIMX7D2DVM12SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA541,25X25,29	1.2 V	85 Cel	0 Cel		BOTTOM	1.42 mm		19 mm			40	260	19 mm	CMOS		1.225 V			.75 mm		S-PBGA-B541	3
XCZU4EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm		31 mm			30	245	31 mm	CMOS		.85 V			1 mm		R-PBGA-B900	4		e1
MCIMX6U5DVM10ACR	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS		1.4 V			.8 mm		S-PBGA-B624	3		e1
MCIMX6Q5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE		40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		e1
TDA8035HN/C1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		5 mm			30	260	5 mm	CMOS	220 mA	3.3 V	Other Microprocessor ICs		.5 mm		S-PQCC-N32	1	Not Qualified	e4
PN7120A0EV/C10801Y	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM						30	260				1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PBGA-B49	3	Not Qualified	e1
XCZU3EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	250		CMOS		.85 V					R-PBGA-B625	4		e1
MCIMX6U8DVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3		e1
XCZU7EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V					R-PBGA-B900	4		e1
XCZU7EV-L2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V					R-PBGA-B1517	4		e1
MIMX8MN1DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm			40	260	14 mm	CMOS		1 V			.5 mm		S-PBGA-B486	3		e2
XCZU4EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS		.9 V					R-PBGA-B900	4		e1
XCZU7EV-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V					R-PBGA-B1156	4		e1
XCZU7EV-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm			30	245	40 mm	CMOS		.85 V			1 mm		R-PBGA-B1517	4		e1
XCZU7EV-1FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V					R-PBGA-B1156	4		e1
XCZU7EV-2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		35 mm			30	245	35 mm	CMOS		.85 V			1 mm		R-PBGA-B1156	4		e1
XCZU4CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	250		CMOS		.85 V					S-PBGA-B784	4		e1
D2-92633-LR	Renesas Electronics	SoC	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V			FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm		14 mm			30	260	14 mm	CMOS		1.8 V			.4 mm		S-PQFP-G128	3		e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.