OTHER Other Function uPs,uCs & Peripheral ICs 1,116

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
XCZU28DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.85 V					R-PBGA-B1156	4			e1
XCZU28DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V					R-PBGA-B1517	4			e1
XCZU2CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm		19 mm			30	250	19 mm	CMOS		.85 V			.8 mm		R-PBGA-B484	4			e1
XCZU47DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU48DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	240		CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU7CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS		.85 V					R-PBGA-B900	4			e1
XCZU7EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.97 mm		31 mm			30	245	31 mm	CMOS		.85 V			1 mm		R-PBGA-B900	4			e1
XCZU9CG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V					R-PBGA-B900	4			e1
CSR8811A08-ICXR-R	Qualcomm	MICROPROCESSOR CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM	.6 mm		2.569 mm					3.208 mm	CMOS		3.3 V			.5 mm		R-PBGA-B28	1
D2-92683-QR	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm		10 mm			30	260	10 mm	CMOS		1.8 V			.5 mm		S-PQCC-N72	3			e3
DLPC350ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V			GRID ARRAY		3.135 V	85 Cel	0 Cel		BOTTOM	2.36 mm		23 mm			NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS		3.3 V			1 mm		S-PBGA-B419					14
M82710-14	Mindspeed Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES				GRID ARRAY			110 Cel	-25 Cel		BOTTOM									CMOS							R-PBGA-B484
MCIMX257DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY		40	260	17 mm	CMOS		1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX512CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm			40	260	19 mm	CMOS		1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX512DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		19 mm			40	260	19 mm	CMOS		1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX6D5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE		40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6S5EVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm			40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
XCZU15EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS		.85 V					R-PBGA-B1156	4			e1
VCBUP7CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm			30	245	19 mm	CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
TMSDM6467TCUT1TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			GRID ARRAY, FINE PITCH		1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm			30	245	19 mm	CMOS		1.3 V			.8 mm		S-PBGA-B529	4			e1
TFB2022AIMFP	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	240	FQFP	SQUARE	METAL	YES	5.25 V			FLATPACK, FINE PITCH		4.75 V	85 Cel	-20 Cel		QUAD	4.2 mm		31.64 mm					31.64 mm	CMOS		5 V			.5 mm		S-MQFP-G240		Not Qualified
CC3000YFVT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	126	BGA	SQUARE	PLASTIC/EPOXY	YES	4.8 V			GRID ARRAY		2.7 V	70 Cel	-20 Cel		BOTTOM									CMOS							S-PBGA-B126
VVLOG365ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.28 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm			30	260	13 mm	CMOS		1.2 V			.65 mm		S-PBGA-B338	3			e1
TMX320DM6467ZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel		BOTTOM	3.1 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529		Not Qualified
XCC3000MOD	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		1.8 V	70 Cel	-20 Cel		UNSPECIFIED	2 mm		13.5 mm	SEATED HGT-NOM				16.3 mm	CMOS		2.7 V					R-XXMA-N46
CC3000MODR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	3.6 V		3.6	MICROELECTRONIC ASSEMBLY	LGA46(UNSPEC)	1.8 V	70 Cel	-20 Cel		UNSPECIFIED	2 mm		13.5 mm	SEATED HGT-NOM				16.3 mm	CMOS	275 mA	2.7 V	Serial IO/Communication Controllers				R-XXMA-N46		Not Qualified
TMX320DM365AZCE300	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel		BOTTOM	1.3 mm		13 mm					13 mm	CMOS		1.35 V			.65 mm		S-PBGA-B338		Not Qualified
TMX320DM6446DZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm		16 mm					16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B316
SN3490586	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY		30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
CC3000MODT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	4.8 V			MICROELECTRONIC ASSEMBLY		2.7 V	70 Cel	-20 Cel		QUAD	2 mm		13.5 mm	SEATED HGT-NOM				16.3 mm	CMOS		3.6 V					R-XQMA-N46
VCBUP7TC6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm			NOT SPECIFIED	245	19 mm	CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
TNETV1647GSTZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY		30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TMX320DM365BZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel	0 Cel		BOTTOM	1.3 mm	8192	13 mm			NOT SPECIFIED	NOT SPECIFIED	13 mm	CMOS		1.2 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TMX320DM355ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel		BOTTOM	1.3 mm	32768	13 mm			NOT SPECIFIED	NOT SPECIFIED	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
DM8147SCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, HEAT SINK/SLUG		3.14 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY	48	NOT SPECIFIED	250	23 mm	CMOS		3.3 V		ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B684	4		1000 rpm	e1
TFB2022AMFP	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	240	FQFP	SQUARE	METAL	YES	5.25 V			FLATPACK, FINE PITCH		4.75 V	85 Cel	-20 Cel		QUAD	4.2 mm		31.64 mm					31.64 mm	CMOS		5 V			.5 mm		S-MQFP-G240		Not Qualified
TMX320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm		16 mm					16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B316
VCBUP7CT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm			30	245	19 mm	CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
TNETV6446AINZWT8	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm			30	260	16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TMSDM6467CCUT6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm			30	245	19 mm	CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
TMSDM6467CCUT7TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm			NOT SPECIFIED	245	19 mm	CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
TMX320DM365AZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel		BOTTOM	1.3 mm		13 mm					13 mm	CMOS		1.2 V			.65 mm		S-PBGA-B338		Not Qualified
TWL92230CZQE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.8 V	85 Cel	-30 Cel		BOTTOM	1 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm	BICMOS					.5 mm		S-PBGA-B80		Not Qualified
TWL92230CZQER	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.8 V	85 Cel	-30 Cel		BOTTOM	1 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm	BICMOS					.5 mm		S-PBGA-B80		Not Qualified
CC3000MOD	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	46		RECTANGULAR	UNSPECIFIED	YES	3.6 V		3.6	MICROELECTRONIC ASSEMBLY	LGA46(UNSPEC)	1.8 V	70 Cel	-20 Cel		UNSPECIFIED	2 mm		13.5 mm	SEATED HGT-NOM				16.3 mm	CMOS	275 mA	2.7 V	Serial IO/Communication Controllers				R-XXMA-N46		Not Qualified
TMX320DM6441DZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1 V	85 Cel	0 Cel		BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP				16 mm	CMOS		1.05 V			.8 mm		S-PBGA-B316
CC3000YFVR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	126	VFBGA	RECTANGULAR	UNSPECIFIED	YES	4.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM						30	260		CMOS							R-XBGA-B126	1			e1
TMX320DM6443CZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm		16 mm					16 mm	CMOS		1.2 V			.8 mm		S-PBGA-B316

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.