OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
AX-SIP-SFEU-API-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	.996 mm	7 mm					260	9 mm	CMOS		3 V				R-XBCC-B44	3		e4
LC898123AXD-VH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.45 mm	2.3 mm				30	260	3.39 mm	CMOS		2.8 V			.4 mm	R-PBGA-B35	1		e1
LC898113-TBM-H	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM	.8 mm	4 mm	ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM			30	260	4 mm	CMOS		3.3 V			.5 mm	S-PBGA-B49	4
LC898124EP1XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.33 mm	1.3 mm				30	260	3.89 mm	CMOS		2.8 V			.4 mm	R-PBGA-B27	1		e1
L6604A	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	10 V		CHIP CARRIER		7 V	70 Cel	-20 Cel		QUAD	4.57 mm	11.5062 mm						11.5062 mm	CMOS		8.5 V			1.27 mm	S-PQCC-J28		Not Qualified
STG2000XC	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, FINE PITCH		3 V	85 Cel	0 Cel		QUAD	4.07 mm	28 mm						28 mm	CMOS		3.3 V			.5 mm	S-PQFP-G208		Not Qualified
L6603A	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	10 V		IN-LINE		7 V	70 Cel	-20 Cel		DUAL		15.24 mm						36.83 mm	CMOS		8.5 V			2.54 mm	R-PDIP-T28		Not Qualified
ST8024CD	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		3.3,5	SMALL OUTLINE	SOP28,.4		85 Cel	-25 Cel		DUAL										1.5 mA		Other Microprocessor ICs		1.27 mm	R-PDSO-G28		Not Qualified
STV0987A/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	104	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	-25 Cel		BOTTOM	1.31 mm	5 mm						5 mm	CMOS		1.8 V			.4 mm	S-PBGA-B104
STV0987/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	104	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	-25 Cel		BOTTOM	1.31 mm	5 mm						5 mm	CMOS		1.8 V			.4 mm	S-PBGA-B104
STV0987B/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	104	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES			GRID ARRAY			70 Cel	-25 Cel	TIN SILVER COPPER NICKEL	BOTTOM							260		CMOS						X-PBGA-B104	3		e2
MF1S7035DUB,005	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER										WAFER		70 Cel	-25 Cel														Other Microprocessor ICs					Not Qualified
935248340518	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		2.7 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm	ALSO REQUIRES 5V SUPPLY					17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28
P5CC073TS	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1.98 V		SMALL OUTLINE		1.62 V	85 Cel	-25 Cel		DUAL									CMOS		1.8 V				R-PDSO-G20
P5CD144A4	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X		Not Qualified
P5CC081XS	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	1		UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY						CMOS		1.8 V	Other Microprocessor ICs			X-XXMA-X		Not Qualified
TDA8002G/3/C2-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V		FLATPACK, LOW PROFILE, FINE PITCH		3 V	85 Cel	-25 Cel		QUAD	1.6 mm	5 mm						5 mm	CMOS		3.3 V			.5 mm	S-PQFP-G32		Not Qualified
P5CD041X1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	3		UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel		UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY						CMOS		1.8 V	Other Microprocessor ICs			X-XXMA-X		Not Qualified
P40C040U15	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		QCCN	UNSPECIFIED	UNSPECIFIED		5.5 V		CHIP CARRIER		4.5 V	85 Cel	-25 Cel		UPPER			ALSO OPERATES AT 1.62 V						CMOS		5 V				X-XUCC-N
TDA8002BT/5/C2-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		4.5 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		5 V			1.27 mm	R-PDSO-G28		Not Qualified
TDA8002G/5/C2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6.5 V		FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	85 Cel	-25 Cel		QUAD	1.6 mm	5 mm						5 mm	CMOS		5 V			.5 mm	S-PQFP-G32		Not Qualified
P5CN144HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD									CMOS		1.8 V	Other Microprocessor ICs		.5 mm	S-PQCC-N32		Not Qualified
P5CD012X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X8		Not Qualified
935268131118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	6 V		FLATPACK, LOW PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel		QUAD	1.6 mm	7 mm						7 mm	CMOS		3.3 V			.5 mm	S-PQFP-G48
P5CC021HN	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.98 V	1.8/5	CHIP CARRIER	LCC32,.2SQ,20	1.62 V	85 Cel	-25 Cel		QUAD									CMOS		1.8 V	Other Microprocessor ICs		.5 mm	S-PQCC-N32		Not Qualified
T1024NSE7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS		1 V			.8 mm	S-PBGA-B780	3		e1
TDA8002C/CD-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified	e4
P5CD144X0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X8		Not Qualified
TDA8002AT/3/C2-T	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified
T1014NSN7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
P5CD016XD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	3		UNSPECIFIED	UNSPECIFIED	NO	1.98 V	1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	1.62 V	85 Cel	-25 Cel	PALLADIUM	UNSPECIFIED			ALSO OPERATES AT 3V, 5V SUPPLY						CMOS		1.8 V	Other Microprocessor ICs			X-XXMA-X		Not Qualified	e4
PN5472A2EV/C20804	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel		BOTTOM	1 mm	4 mm						4.3 mm	CMOS		3.6 V			.5 mm	R-PBGA-B49
P40C012X60	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8	DIE	UNSPECIFIED	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		2.7 V	85 Cel	-25 Cel		UPPER									CMOS						X-XUUC-N8
TDA8002C/CD	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	2.65 mm	7.5 mm						17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified	e4
P5CD009EV1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8		UNSPECIFIED	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER				0	10 MHz				CMOS		1.8 V		UART		X-XUUC-N8		Not Qualified
P5CD041AI	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1.98 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER			ALSO OPERATES AT 3V, 5V SUPPLY						CMOS		1.8 V				R-XUUC-N
T1014NSE7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780	3		e1
T1014NSN7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
P40C012X85	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	8	DIE	UNSPECIFIED	UNSPECIFIED	YES	5.5 V		UNCASED CHIP		2.7 V	85 Cel	-25 Cel		UPPER									CMOS						X-XUUC-N8
T1024NSN7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm						23 mm	CMOS		1 V			.8 mm	S-PBGA-B780
SLRC61002HN,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		3.3/5	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD						30	260			20 mA		Other Microprocessor ICs		.5 mm	S-PQCC-N32	1	Not Qualified
935261652112	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	6.5 V		SMALL OUTLINE		3 V	85 Cel	-25 Cel		DUAL	2.65 mm	7.5 mm				NOT SPECIFIED	NOT SPECIFIED	17.9 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G28		Not Qualified
P5CC145UA	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1.98 V		UNCASED CHIP		1.62 V	85 Cel	-25 Cel		UPPER									CMOS		1.8 V				X-XUUC-N
MF1ICS5005W/V9D	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER										WAFER		70 Cel	-25 Cel														Other Microprocessor ICs					Not Qualified
P5CC128XS	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1.98 V		MICROELECTRONIC ASSEMBLY		1.62 V	85 Cel	-25 Cel		UNSPECIFIED									CMOS		1.8 V				X-XXMA-X
SLRC40001T/0FE,112	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		5	SMALL OUTLINE	SOP32,.4		85 Cel	-25 Cel		DUAL										150 mA	5 V	Other Microprocessor ICs		1.27 mm	R-PDSO-G32		Not Qualified
P5CD144X1	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO		1.8/5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)		85 Cel	-25 Cel		DUAL									CMOS			Other Microprocessor ICs			R-XDMA-X8		Not Qualified
MF0ICU1001W/S7DL,0	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER										DIE OR CHIP		70 Cel	-25 Cel														Other Microprocessor ICs					Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.