OTHER Other Function uPs,uCs & Peripheral ICs 1,116

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
AM4372BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	1.26 V			.65 mm		S-PBGA-B491	3			e1
TMS320DM6467ZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM335DZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6467CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
66AK2L06XCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm		25 mm				30	245	25 mm	CMOS	1.05 V			.8 mm		S-PBGA-B900	4			e1
DLPC910ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, HEAT SINK/SLUG		.95 V	85 Cel	0 Cel		BOTTOM	3 mm		27 mm						27 mm	CMOS	1 V		I2C; USB	1 mm		S-PBGA-B676
OMAP3515DCUS	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA423,24X24,25	1.71 V	90 Cel	0 Cel		BOTTOM	1.4 mm		16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1.8 V	Graphics Processors		.65 mm		S-PBGA-B423		Not Qualified
TMS320DM6467CCUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM355DZCE27J	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DLPC2607ZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.95 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM								260		CMOS	1 V					S-PBGA-B176	3			e1
TMS320DM6467TCUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS	1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TCI6636K2HDSAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1
AM5716AABCD	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760	3			e1
DLPC3437CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm		13 mm				30	260	13 mm	CMOS	1.1 V			.8 mm		S-PBGA-B201	3			e1
66AK2L06XCMS	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			GRID ARRAY, FINE PITCH		.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.55 mm		25 mm				30	245	25 mm	CMOS	1.05 V			.8 mm		S-PBGA-B900	4			e1
TMS320DM365ZCEM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.71 V	85 Cel	0 Cel		BOTTOM	1.3 mm		13 mm	ALSO REQIRIES 3.3 V SUPPLY					13 mm	CMOS	1.8 V			.65 mm		S-PBGA-B338
TMS320DM6467TZUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
OMAPL132EZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
TMS320DM355DZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6467ZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
OMAP3503DCUS72	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	90 Cel	0 Cel		BOTTOM	1.4 mm		16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1.8 V	Graphics Processors		.8 mm		S-PBGA-B423		Not Qualified
TMS320DM6467CCUTV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
DLPC3433CZVB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm		7 mm				30	260	7 mm	CMOS	1.1 V			.4 mm		S-PBGA-B176	3			e1
TMS320DM6467CCUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CGUTA6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			20	220	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e0
DM368ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm				30	260	13 mm	CMOS	1.35 V			.65 mm		S-PBGA-B338	3			e1
TMS320DM355ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DLPC410ZYR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V	85 Cel	0 Cel		BOTTOM	3 mm		27 mm				NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS	1 V			1 mm		S-PBGA-B676
OMAP3515DCBC	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA515,21X21,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm				30	260	12 mm	CMOS	1.8 V	Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified		e1
TMS320DM335ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM6441AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm	CMOS	1.05 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
TMS320DM6467ZUTV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified
OMAP3503DCBC	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,21X21,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm				30	260	12 mm	CMOS	1.8 V	Graphics Processors		.4 mm		S-PBGA-B515	3	Not Qualified		e1
TMS320DM6443BZWTB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3			e1
TMS320DM6467CCUTA6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TCI6636K2HDSAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V	100 Cel	0 Cel		BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TMS320DM335ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		32		30	260	13 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B337	3	Not Qualified		e1
TMS320DM6467CCUTV6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM335DZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM369ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32		30	260	13 mm	CMOS		Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
LC898113	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM	.8 mm		4 mm						4 mm	CMOS	3.3 V			.5 mm		S-PBGA-B49
LC898124EP3XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA27,3X9,16	2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.33 mm		1.3 mm				30	260	3.89 mm	CMOS	2.8 V			.4 mm		R-PBGA-B27	1			e1
LC898129DP1XHTBG	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	40	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA40,4X10,16	2.7 V	85 Cel	-30 Cel	TIN SILVER	BOTTOM	.35 mm		1.6 mm			1 MHz	30	260	4.15 mm		2.8 V		I2C, SPI	.4 mm		R-PBGA-B40	1			e2
LC898113RA-WH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	49	VFLGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM	.8 mm		4 mm	ALSO REQIRIES 1.8 V SUPPLY; SEATED HGT-NOM					4 mm	CMOS	3.3 V			.5 mm		S-PBGA-B49
LC898124EP2XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.33 mm		1.3 mm				30	260	3.89 mm	CMOS	2.8 V			.4 mm		R-PBGA-B27	1			e1
LC898128DP1XGTBG	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel	TIN SILVER	BOTTOM	.35 mm		1.175 mm				30	260	4.3 mm	CMOS	2.8 V			.4 mm		R-PBGA-B30	1			e2
AX-SIP-SFEU-1-01-TB05	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BUTT	44	HVBCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2 V	85 Cel	-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	BOTTOM	.996 mm		7 mm					260	9 mm	CMOS	3 V					R-XBCC-B44	3			e4
LC898123F40XC-VH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.45 mm		2.3 mm				30	260	3.22 mm	CMOS	2.8 V			.4 mm		R-PBGA-B35	1			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.