OTHER Other Function uPs,uCs & Peripheral ICs 1,116

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCZU3EG-3SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	250		CMOS		.9 V				S-PBGA-B484	4		e1
XCZU48DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU3CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm			30	250	19 mm	CMOS		.85 V			.8 mm	R-PBGA-B484	4		e1
XCZU2CG-2LSFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA625,25X25,32		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.43 mm	21 mm		0	30	250	21 mm	CMOS		.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B625	4		e1
XCZU6CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel		BOTTOM	2.88 mm	31 mm					31 mm	CMOS		.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	1 mm	S-PBGA-B900
XCZU7EV-2LFFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1156,34X34,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm		0	30	245	35 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4		e1
XCZU19EG-2LFFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1760,42X42,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm		0	30	245	42.5 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1760	4		e1
XCZU28DR-L2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V				R-PBGA-B1156	4		e1
XCZU3EG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS		.72 V				R-PBGA-B784	4		e1
XCZU15EG-2FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	35 mm			30	245	35 mm	CMOS		.85 V			1 mm	R-PBGA-B1156	4		e1
XCZU46DR-1FSVH1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1760	4		e1
XCZU7EG-L2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V				R-PBGA-B1517	4		e1
XCZU25DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU47DR-1FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU6EG-2LFFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.42 mm	31 mm		0	30	245	31 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU11EG-2LFFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1156,34X34,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	35 mm		0	30	245	35 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1156	4		e1
XCZU3EG-L2SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY					CMOS		.72 V				R-PBGA-B484	4		e1
XCZU6EG-3FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.9 V				R-PBGA-B1156	4		e1
XCZU25DR-2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	240		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU6CG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.825 V	100 Cel	0 Cel		BOTTOM	2.61 mm	19 mm					19 mm	CMOS		.85 V		I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)	.8 mm	S-PBGA-B484
XCZU4CG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS		.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4		e1
XCZU27DR-L2FSVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	240		CMOS		.72 V				R-PBGA-B1156	4		e1
XCZU7EG-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	245		CMOS		.9 V				R-PBGA-B900	4		e1
XCZU19EG-2LFFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1760,42X42,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm		0	30	245	42.5 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1760	4		e1
XCZU2EG-3SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY			100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	250		CMOS		.9 V				S-PBGA-B484	4		e1
XCZU7EV-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1517	4		e1
XCZU17EG-L2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V		GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	245		CMOS		.72 V				R-PBGA-B1760	4		e1
XCZU17EG-2LFFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1760,42X42,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm		0	30	245	42.5 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1760	4		e1
XCZU5CG-2LFBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA900,30X30,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm		0			31 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B900	4		e1
XCZU47DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU2CG-2LSFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA784,28X28,32		110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm		0	30	250	23 mm	CMOS		.85 V		CAN, I2C, SPI, UART	.8 mm	S-PBGA-B784	4		e1
XCZU9CG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM					30	245		CMOS		.85 V				R-PBGA-B1156	4		e1
XCZU3CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm			30	250	23 mm	CMOS		.85 V			.8 mm	S-PBGA-B784	4		e1
XCZU7EG-2LFFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA1517,39X39,40		110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm	40 mm		0	30	245	40 mm	CMOS		.85 V		CAN, I2C, SPI, UART	1 mm	S-PBGA-B1517	4		e1
XCZU5EV-3FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V		GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM					30	245		CMOS		.9 V				R-PBGA-B900	4		e1
XCZU2CG-2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V		GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.43 mm	21 mm			30	250	21 mm	CMOS		.85 V			.8 mm	R-PBGA-B625	4		e1
TC358765XBG	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH		1.1 V	85 Cel	-30 Cel		BOTTOM	1.2 mm	6 mm					6 mm	CMOS		1.2 V			.65 mm	S-PBGA-B64
TC358764XBG	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH		1.1 V	85 Cel	-30 Cel		BOTTOM	1.2 mm	5 mm					5 mm	CMOS		1.2 V			.65 mm	S-PBGA-B49
9LPRS436CKLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	3.3	CHIP CARRIER	LCC48,.24SQ,16	3.135 V	85 Cel	0 Cel	MATTE TIN	QUAD	1 mm	6 mm			30	260	6 mm	CMOS	100 mA	3.3 V	Clock Generators		.4 mm	S-PQCC-N48	3	Not Qualified	e3
9LPRS436CKLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	3.3	CHIP CARRIER	LCC48,.24SQ,16	3.135 V	85 Cel	0 Cel	MATTE TIN	QUAD	1 mm	6 mm			30	260	6 mm	CMOS	100 mA	3.3 V	Clock Generators		.4 mm	S-PQCC-N48	3	Not Qualified	e3
9LPRS436CGLFT	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	3.3	SMALL OUTLINE	TSSOP48,.3,20	3.135 V	85 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm			30	260	12.5 mm	CMOS	100 mA	3.3 V	Clock Generators		.5 mm	R-PDSO-G48	1	Not Qualified	e3
9LPRS436CGLF	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	48	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	3.3	SMALL OUTLINE	TSSOP48,.3,20	3.135 V	85 Cel	0 Cel	MATTE TIN	DUAL	1.2 mm	6.1 mm			30	260	12.5 mm	CMOS	100 mA	3.3 V	Clock Generators		.5 mm	R-PDSO-G48	1	Not Qualified	e3
MC-10118BF1-ENY-A	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	481	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	70 Cel	-20 Cel		BOTTOM	1.3 mm	12.7 mm			NOT SPECIFIED	NOT SPECIFIED	12.7 mm	CMOS		1.2 V			.5 mm	S-PBGA-B481		Not Qualified
D2MC-76083-LR	Renesas Electronics	MICROPROCESSOR CIRCUIT	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm			30	260	14 mm	CMOS		1.8 V			.4 mm	S-PQFP-G128	3		e3
D2-92684-QR	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm	10 mm			30	260	10 mm	CMOS		1.8 V			.5 mm	S-PQCC-N72	3		e3
D2-92634-LR	Renesas Electronics	SoC	OTHER	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	1.6 mm	14 mm			30	260	14 mm	CMOS		1.8 V			.4 mm	S-PQFP-G128	3		e3
D2-92684-QR-T	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm	10 mm			30	260	10 mm	CMOS		1.8 V			.5 mm	S-PQCC-N72	3		e3
HD0-4702A-6	Renesas Electronics		OTHER								5		DIE OR CHIP		25 Cel	25 Cel										CMOS		5 V	Other Microprocessor ICs					Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.