BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
AM6442BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm		17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			30	250	17.2 mm	CMOS	.75 V			.8 mm		S-PBGA-B441	3		1000 rpm
XC7Z100-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B900
AM4376BZDNA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.378 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.272 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	1.325 V			.65 mm		S-PBGA-B491	3			e1
OSD3358-1G-ISM	Octavo Systems	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY	BGA256,16X16,50		85 Cel	-40 Cel		BOTTOM	2.58 mm		21 mm						21 mm	CMOS	1.1 V			1.27 mm		S-PBGA-B256
XC7Z035-1FFG900C	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel		BOTTOM	3.35 mm		31 mm						31 mm	CMOS	1 V			1 mm		S-PBGA-B900
MCIMX6G2CVM05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		14 mm				40	260	14 mm	CMOS				.8 mm		S-PBGA-B289	3			e1
LS1021AXN7KQB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm				40	260	19 mm	CMOS	1 V			.8 mm		S-PBGA-B525	3			e1
OMAPL138EZWTD4E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
MIMXRT106FCVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm		10 mm				40	260	10 mm	CMOS				.65 mm		S-PBGA-B196	3
MCIMX6G2CVK05AB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel		BOTTOM	1.23 mm		9 mm				40	260	9 mm	CMOS				.5 mm		S-PBGA-B272	3
MCIMX257CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm	CMOS	1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
TMS320DM368ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS	1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
XCZU2CG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	250		CMOS	.85 V					R-PBGA-B484	4			e1
MCIMX6S5DVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MIMX8MM1DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm				40	260	14 mm	CMOS	1 V			.5 mm		S-PBGA-B486	3			e2
XCZU4EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS	.85 V					R-PBGA-B784	4			e1
XCZU3CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS	.85 V					S-PBGA-B784	4			e1
XC7Z035-2FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.35 mm		31 mm						31 mm	CMOS	1 V			1 mm		S-PBGA-B900
MIMX8MN5DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm		11 mm				40	260	11 mm	CMOS	.95 V			.5 mm		S-PBGA-B306	3
XC7Z045-1FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B900
NRF52811-CAAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		BALL	33	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA33,6X6,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm		2.464 mm						2.482 mm	CMOS	3 V			.4 mm		R-PBGA-B33
XCZU11EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm				30	245	40 mm	CMOS	.85 V			1 mm		R-PBGA-B1517	4			e1
MCIMX6S5DVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6U5EVM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
XCZU4EV-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS	.85 V					R-PBGA-B784	4			e1
XC7Z030-2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm		19 mm						19 mm	CMOS	1 V			.8 mm		S-PBGA-B485
XC7Z045-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
XC7Z030-2FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
XCZU3CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS	.85 V					S-PBGA-B784	4			e1
XC7Z045-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
MIMXRT1052CVL5A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm		10 mm	24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE					10 mm	CMOS				.65 mm		S-PBGA-B196
XC7Z045-2FBG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
MIMX8MM1CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.25 mm		14 mm				40	260	14 mm	CMOS	.95 V			.5 mm		S-PBGA-B486	3			e2
XC7Z007S-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm		13 mm						13 mm	CMOS	1 V			.8 mm		S-PBGA-B225
XC7Z030-L2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
XC7Z045-1FBG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
MCIMX536AVP8C2	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm		19 mm				40	260	19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B529	3			e2
XC7Z030-1FFG676C	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
MIMXRT1172CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm		14 mm				40	260	14 mm	CMOS				.8 mm		S-PBGA-B289	3
XC7Z007S-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm		17 mm						17 mm	CMOS	1 V			.8 mm		S-PBGA-B400
XCZU5CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250		CMOS	.72 V					S-PBGA-B784	4			e1
XC7Z020-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm		19 mm						19 mm	CMOS	1 V			.8 mm		S-PBGA-B484
MCIMX6S7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
XC7Z035-3FFG900E	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.35 mm		31 mm						31 mm	CMOS	1 V			1 mm		S-PBGA-B900
XC7Z015-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm		19 mm						19 mm	CMOS	1 V			.8 mm		S-PBGA-B485
XCZU4EV-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B900	4			e1
CY8C6247BZI-D54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm		9 mm						9 mm	CMOS	1.8 V			.65 mm		S-PBGA-B124	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.