BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
MPFS250T-FCG1152E	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	0 Cel		BOTTOM	2.99 mm		35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS		1 V			1 mm		S-PBGA-B1152
MPFS250T-FCG1152I	Microchip Technology	PROGRAMMABLE SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY	BGA1152,34X34,40	.97 V	100 Cel	-40 Cel		BOTTOM	2.99 mm		35 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					35 mm	CMOS		1 V			1 mm		S-PBGA-B1152
TMS320DM365ZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS		1.35 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
AM6442BSEGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm		17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY					17.2 mm	CMOS		.75 V			.8 mm		S-PBGA-B441			1000 rpm
MCIMX6X3EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm				40	260	17 mm	CMOS					.8 mm		S-PBGA-B400	3			e1
OMAPL138EZCEA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
OMAPL138EZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
XCZU11EG-2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm				30	245	40 mm	CMOS		.85 V			1 mm		R-PBGA-B1517	4			e1
XCZU15EG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	245		CMOS		.85 V					R-PBGA-B1156	4			e1
10AS066N3F40E2LG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA1517,39X39,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm		40 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY					40 mm	TSMC		.9 V			1 mm		S-PBGA-B1517
A2F200M3F-CSG288I	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, THIN PROFILE, FINE PITCH	BGA288,21X21,20	1.425 V	100 Cel	-40 Cel		BOTTOM	1.05 mm		11 mm						11 mm	CMOS		1.5 V			.5 mm		S-PBGA-B288	3
AM5718AABCX	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS		1.15 V			.8 mm		S-PBGA-B760	3		1500 rpm	e1
AM5718AABCXA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V				GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS		1.15 V			.8 mm		S-PBGA-B760	3		1500 rpm	e1
AM6232ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm		13 mm						13 mm	CMOS		.75 V			.5 mm		S-PBGA-B425
MCIMX6S6AVM08ACR	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
SCANSTA112SM/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,10X10,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		10 mm		0		30	260	10 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B100	4	Not Qualified		e1
XCZU11EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS		.85 V					R-PBGA-B1760	4			e1
XCZU5CG-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS		.72 V					R-PBGA-B900	4			e1
AM6231AGGGGHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM	.89 mm		13 mm						13 mm	CMOS		.75 V			.5 mm		S-PBGA-B425
10AS032E4F29I3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	-40 Cel		BOTTOM	3.35 mm		29 mm						29 mm	TSMC		.9 V			1 mm		S-PBGA-B780
AM5716AABCXEQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS		1.15 V			.8 mm		S-PBGA-B760	3			e1
XCZU3EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS		.85 V					R-PBGA-B784	4			e1
XCZU48DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	245		CMOS		.85 V					R-PBGA-B1156	4			e1
AM6412BSCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm		17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				250	17.2 mm	CMOS		.75 V			.8 mm		S-PBGA-B441	3
CY8C6137BZI-F34	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm		9 mm						9 mm	CMOS		1.8 V			.65 mm		S-PBGA-B124	3			e1
MPC8248CVRTIEA	NXP Semiconductors	SoC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V			1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm				30	245	27 mm	CMOS		1.5 V	Other uPs/uCs/Peripheral ICs		1 mm		S-PBGA-B516	3	Not Qualified		e2
MPFS250TS-1FCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm		19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS		1 V			.8 mm		S-PBGA-B484
XC7Z030-1FBG484C	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA484,22X22,40	.95 V	85 Cel	0 Cel		BOTTOM	2.54 mm		23 mm						23 mm	CMOS		1 V			1 mm		S-PBGA-B484
XCZU25DR-1FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	240		CMOS		.85 V					R-PBGA-B1517	4			e1
XCZU25DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS		.72 V					R-PBGA-B1517	4			e1
XCZU2CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS		.85 V					S-PBGA-B784	4			e1
XCZU3EG-1SBVA484I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM										CMOS		.85 V					R-PBGA-B484	4			e1
XCZU4EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS		.85 V					R-PBGA-B784	4			e1
XCZU5CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	245		CMOS		.85 V					R-PBGA-B900	4			e1
AM4372BZDNA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.144 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS		1.1 V			.65 mm		S-PBGA-B491	3			e1
MTFC8GLVEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm		11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm	CMOS		1.8 V			.5 mm		R-PBGA-B153				e1
OMAPL138EZWTA3E	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm	CMOS		1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
PN7120A0EV/C10801E	NXP Semiconductors		OTHER	BALL	49	FBGA	SQUARE	PLASTIC/EPOXY	YES				1.8	GRID ARRAY, FINE PITCH	BGA49,7X7,20		85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM							30	260				1.8 V	Other uPs/uCs/Peripheral ICs		.5 mm		S-PBGA-B49	3	Not Qualified		e1
THGBM5G5A1JBAIRH2H	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel		BOTTOM	1 mm		11.5 mm						13 mm	CMOS		3.3 V			.5 mm		R-PBGA-B153
XC7Z014S-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm		19 mm						19 mm	CMOS		1 V			.8 mm		S-PBGA-B484
XCZU7EG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm				30	245	40 mm	CMOS		.85 V			1 mm		R-PBGA-B1517	4			e1
XCZU7EG-3FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V				GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS		.9 V					R-PBGA-B1517	4			e1
XCZU7EG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS		.72 V					R-PBGA-B900	4			e1
MCIMX356AJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm				40	260	17 mm	CMOS		1.8 V			.8 mm		S-PBGA-B400	3	Not Qualified		e1
MTFC8GLDEA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm		11.5 mm	IT ALSO OPERATES AT 3.3 VOLTS					13 mm	CMOS		1.8 V			.5 mm		R-PBGA-B153				e1
TDA8026ET/C2,551	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,32		85 Cel	-25 Cel		BOTTOM								260			260 mA	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	2	Not Qualified
XC7Z012S-2CLG485E	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	0 Cel		BOTTOM	1.6 mm		19 mm						19 mm	CMOS		1 V			.8 mm		S-PBGA-B485
XCZU7EG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS		.85 V					R-PBGA-B1517	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.