BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
OMAPL132EZWTA2R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
OMAPL138EZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.8 mm		S-PBGA-B361	3		456 rpm	e1
STV0991FAH	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1.1 V			.65 mm		S-PBGA-B201
STV0991FAH/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1.1 V			.65 mm		S-PBGA-B201
TCI6630K2LXCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM							30	245		CMOS	.95 V					S-PBGA-B900	4			e1
XA7Z030-1FBV484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY			125 Cel	-40 Cel		BOTTOM										CMOS						S-PBGA-B484
XAZU4EV-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm		23 mm				30	250	23 mm	CMOS	.85 V			.8 mm		S-PBGA-B784	4			e1
XC7Z030-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm		27 mm						27 mm	CMOS	1 V			1 mm		S-PBGA-B676
XCZU17EG-1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B1760	4			e1
XCZU19EG-L2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V					R-PBGA-B1760	4			e1
XCZU5EG-2FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm		31 mm				30	245	31 mm	CMOS	.85 V			1 mm		R-PBGA-B900	4			e1
XCZU5EV-3SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS	.9 V					S-PBGA-B784	4			e1
XCZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V					R-PBGA-B784	4			e1
XCZU6EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B1156	4			e1
XCZU7CG-2FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.51 mm		40 mm				30	245	40 mm	CMOS	.85 V			1 mm		R-PBGA-B1517	4			e1
XTDA4AHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
XTDA4APXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm		31 mm						31 mm	CMOS	.8 V			.8 mm		S-PBGA-B1414
AM5718AABCXQ1	Texas Instruments	SYSTEM ON CHIP	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760	3		1500 rpm	e1
AM6252ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm		13 mm						13 mm	CMOS	.75 V			.5 mm		S-PBGA-B425
LS1043AXE8QQB	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V				GRID ARRAY, FINE PITCH		.87 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	ALSO OPERATES AT 1V SUPPLY NOM			30	250	23 mm	CMOS	.9 V			.8 mm		S-PBGA-B780	3			e1
MCIMX351AVM4B	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V	AEC-Q100			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.22 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm				40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX6QP7CVT8AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1
MCIMX6X3CVN08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm				40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3			e1
MCIMX6X3CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm				40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3			e1
STV0991FA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1.1 V			.65 mm		S-PBGA-B201
STV0991FA/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1.1 V			.65 mm		S-PBGA-B201
STV0991FAR/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm		10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1.1 V			.65 mm		S-PBGA-B201
TCI6630K2LXCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM							30	245		CMOS	.95 V					S-PBGA-B900	4			e1
XCZU4CG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B900	4			e1
XCZU5CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm		31 mm				30	245	31 mm	CMOS	.85 V			1 mm		R-PBGA-B900	4			e1
XCZU5EG-2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm		23 mm				30	250	23 mm	CMOS	.85 V			.8 mm		R-PBGA-B784	4			e1
AGFA006R16A2E3V	Intel	SoC FPGA		BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	0 Cel		BOTTOM																R-PBGA-B1546
AGFA027R24C2E3E	Intel	SoC FPGA		BALL	2340		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	0 Cel		BOTTOM																R-PBGA-B2340
AGIB022R31B1E2V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	0 Cel		BOTTOM																R-PBGA-B3184
AGIB027R31B2E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	0 Cel		BOTTOM																R-PBGA-B3184
AGIB027R31B2I1V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	-40 Cel		BOTTOM																R-PBGA-B3184
AGIB027R31B2I3V	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	-40 Cel		BOTTOM																R-PBGA-B3184
AGIB027R31B3E3E	Intel	SoC FPGA		BALL	3184		RECTANGULAR	PLASTIC/EPOXY	YES								100 Cel	0 Cel		BOTTOM																R-PBGA-B3184
DM355SDZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
MPFS250TFCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm		19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm		S-PBGA-B484
TCI6630K2LXCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM							30	245		CMOS	.95 V					S-PBGA-B900	4			e1
XCVM1802-1MSEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V				GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm		40 mm						40 mm	CMOS	.8 V			.92 mm		S-PBGA-B1760				e1
XCZU48DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	240		CMOS	.85 V					R-PBGA-B1517	4			e1
ADSP-SC589-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm		19 mm						19 mm	CMOS	1.1 V			.8 mm		S-PBGA-B529
AM68A72AHGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm		23 mm						23 mm	CMOS	.8 V			.8 mm		S-PBGA-B770
AM68A72ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm		23 mm				30	260	23 mm	CMOS	.8 V			.8 mm		S-PBGA-B770	3
OMAPL138EZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
TCI6630K2LXCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM							30	245		CMOS	.95 V					S-PBGA-B900	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.