BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel		BOTTOM	2.42 mm	27 mm		16	20 MHz			27 mm	CMOS	1.15 V		I2C; SPI; UART; USB	1 mm	S-PBGA-B516				9
DS3655B+	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY		3 V	85 Cel	-40 Cel		BOTTOM									CMOS	3.3 V				S-PBGA-B16	3
DS3655B+TRL	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	16	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY		3 V	85 Cel	-40 Cel		BOTTOM									CMOS	3.3 V				S-PBGA-B16	3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm	S-PBGA-B289	3
MCIMX512CJM6CR2	NXP Semiconductors	SYSTEM ON CHIP		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm	S-PBGA-B529	3	Not Qualified	e1
MPC8247CVRTIEA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V		1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm				30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B516	3	Not Qualified	e2
MPFS250T-FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel		BOTTOM	1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm	CMOS	1 V			.5 mm	S-PBGA-B536
T1024NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm				30	250	23 mm	CMOS	1 V			.8 mm	S-PBGA-B780	3		e1
TMS320DM365ZCEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	13 mm		32		30	260	13 mm	CMOS	1.35 V		I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3		e1
WP32C2W6NFEI-400B2	Microchip Technology	MICROPROCESSOR CIRCUIT		BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA896(UNSPEC)				TIN SILVER COPPER	BOTTOM									CMOS					S-PBGA-B896			e1
XC7Z030-1SB485I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V			.8 mm	S-PBGA-B485
XC7Z030-L2SBG485I	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V			.8 mm	S-PBGA-B485
XCVC1902-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm						45 mm	CMOS	.8 V			.92 mm	S-PBGA-B2197			e1
XCZU11EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm				30	245	42.5 mm	CMOS	.85 V			1 mm	R-PBGA-B1760	4		e1
XCZU11EG-3FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.9 V				R-PBGA-B1517	4		e1
XCZU11EG-3FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.9 V				R-PBGA-B1760	4		e1
XCZU15EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU15EG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V				R-PBGA-B900	4		e1
XCZU17EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU19EG-1FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU19EG-2FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1760	4		e1
XCZU19EG-2FFVE1924E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	45 mm				30	245	45 mm	CMOS	.85 V			1 mm	R-PBGA-B1924	4		e1
XCZU27DR-1FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU49DR-2FFVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1760	4		e1
XCZU4CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.88 mm	31 mm				30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XCZU4EG-2FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU4EG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.85 V			.8 mm	R-PBGA-B784	4		e1
XCZU5EG-1FBVB900E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm				30	245	31 mm	CMOS	.85 V			1 mm	R-PBGA-B900	4		e1
XCZU5EG-L1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA900,30X30,40	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.88 mm	31 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245	31 mm	CMOS	.72 V			1 mm	R-PBGA-B900	4		e1
XCZU6EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU7EG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
ATBTLC1000A-UU-T	Microchip Technology	SoC		BALL	31	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA31,9X7,14	1.8 V	85 Cel	-40 Cel		BOTTOM	.541 mm	2.142 mm						2.282 mm	CMOS	3.6 V			.35 mm	R-PBGA-B31
LS1043AXE7MQB	NXP Semiconductors	SoC		BALL	621		SQUARE	PLASTIC/EPOXY	YES							105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.92 mm	21 mm				30	250	21 mm	CMOS				.8 mm	S-PBGA-B621	3		e1
MCIMX513DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm	S-PBGA-B529	3	Not Qualified	e1
XCZU11EG-1FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU11EG-L2FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V				R-PBGA-B1156	4		e1
XCZU2CG-L2SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V				R-PBGA-B625	4		e1
10AS016E4F29I3LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	29 mm						29 mm	TSMC	.9 V			1 mm	S-PBGA-B780
88AP270MA2-BHE1C520	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM									CMOS		Graphics Processors					Not Qualified	e1
XCZU27DR-2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	240		CMOS	.85 V				R-PBGA-B1156	4		e1
88AP270MA2-BHE1C416	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM									CMOS		Graphics Processors					Not Qualified	e1
XCZU27DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm						19 mm	CMOS	1.1 V			.8 mm	S-PBGA-B529
MCIMX27LVOP4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	17 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ			40	260	17 mm	CMOS	1.45 V			.65 mm	S-PBGA-B404	3	Not Qualified	e1
CSR8675C-ICXT-R	Qualcomm	MICROPROCESSOR CIRCUIT		BALL		BGA	UNSPECIFIED	PLASTIC/EPOXY	YES				GRID ARRAY						BOTTOM									CMOS					X-PBGA-B
LS1023ASN7KQB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	621	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA621,25X25,32	.87 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	21 mm				30	250	21 mm	CMOS	.9 V			.8 mm	S-PBGA-B621	3		e1
MCIMX515CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm	S-PBGA-B529	3	Not Qualified	e1
MCIMX6U7CVM08AD	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.