BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
XCVM1402-1MSEVFVC1596	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1596	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY	BGA1596,40X40,36	.775 V	100 Cel	0 Cel			BOTTOM	3.75 mm	37.5 mm					37.5 mm	CMOS	.8 V			.92 mm	S-PBGA-B1596
XQZU11EG-1FFRC1156M	Xilinx	PROGRAMMABLE SoC		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY	BGA1156,34X34,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm	35 mm			40	245	35 mm	CMOS	.85 V			1 mm	S-PBGA-B1156	4		e0
CYB0644ABZI-S2D44	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm	9 mm					9 mm	CMOS	1.8 V			.65 mm	S-PBGA-B124	3		e1
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS				.8 mm	S-PBGA-B624	3		e1
SA8155P	Qualcomm	SoC		BALL	989	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY			105 Cel	-40 Cel			BOTTOM								CMOS					S-PBGA-B989
XCZU28DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.72 V				R-PBGA-B1517	4		e1
XCZU29DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1760	4		e1
10AS016E4F27E3SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm					27 mm	TSMC	.9 V			1 mm	S-PBGA-B672
THGBM5G6A2JBAIR	Toshiba	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-25 Cel			BOTTOM	1 mm	11.5 mm					13 mm	CMOS	3.3 V			.5 mm	R-PBGA-B153
XCZU15EG-3FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.9 V				R-PBGA-B1156	4		e1
XCZU3CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)		30	250		CMOS	.72 V				S-PBGA-B784	4		e1
XCZU48DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU49DR-1FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM								CMOS	.85 V				R-PBGA-B1760	4		e1
XCZU6CG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
10AS016E3F27E2SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				27 mm	TSMC	.9 V			1 mm	S-PBGA-B672
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
EY82C621ASRH58	Intel	MICROPROCESSOR CIRCUIT		BALL	1310		RECTANGULAR	PLASTIC/EPOXY	YES											BOTTOM								CMOS					R-PBGA-B1310
XCVP1202-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel			BOTTOM	4.48 mm	50 mm					50 mm	CMOS	.8 V			.92 mm	S-PBGA-B2785
XCZU17EG-2FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.71 mm	42.5 mm			30	245	42.5 mm	CMOS	.85 V			1 mm	R-PBGA-B1760	4		e1
XCZU3EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY		30	250		CMOS	.72 V				R-PBGA-B784	4		e1
XCZU47DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU48DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU9EG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XQZU28DR-1FFRE1156M	Xilinx	MICROPROCESSOR CIRCUIT	MILITARY	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	MIL-PRF-38535		GRID ARRAY		.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM					40	245		CMOS	.85 V				S-PBGA-B1156	4		e0
10AS027E2F27E2LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				27 mm	TSMC	.9 V			1 mm	S-PBGA-B672
10AS027E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				29 mm	TSMC	.9 V			1 mm	S-PBGA-B780
88AP270MA2-BHE1E312	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V			TIN SILVER COPPER		BOTTOM								CMOS		Graphics Processors					Not Qualified	e1
MCIMX253DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V		1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY		40	260	17 mm	CMOS	1.45 V	Microprocessors		.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX287CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel			BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V		40	260	14 mm	CMOS	1.45 V			.8 mm	S-PBGA-B289	3
MCIMX6G2CVM05AA	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	105 Cel	-40 Cel			BOTTOM	1.32 mm	14 mm			40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
XA7Z020-1CLG400I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32				Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm			30	260	17 mm	CMOS		Other uPs/uCs/Peripheral ICs		.8 mm	S-PBGA-B400	3	Not Qualified	e1
XCVC1902-2MLEVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.775 V	110 Cel	0 Cel			BOTTOM	4 mm	40 mm					40 mm	CMOS	.8 V			.92 mm	S-PBGA-B1760
XCVM1802-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm					45 mm	CMOS	.8 V			.92 mm	S-PBGA-B2197			e1
XCZU19EG-1FFVD1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1760	4		e1
XCZU47DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU49DR-1FSVF1760E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM					30	240		CMOS	.85 V				R-PBGA-B1760	4		e1
XCZU5EV-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	250		CMOS	.85 V				R-PBGA-B784	4		e1
XCZU6CG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU7EG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM					30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XQ7Z030-1RF676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	3.37 mm	27 mm			30	225	27 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676	4	Not Qualified	e0
XQ7Z045-1RF676I	Xilinx	MICROPROCESSOR CIRCUIT		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY	BGA676,26X26,40				TIN LEAD	N	BOTTOM	3.37 mm	27 mm					27 mm	CMOS		Other uPs/uCs/Peripheral ICs		1 mm	S-PBGA-B676		Not Qualified	e0
XQZU3EG-1SFRC784I	Xilinx	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.808 V	100 Cel	-40 Cel	TIN LEAD		BOTTOM	3.52 mm	23 mm			20	220	23 mm	CMOS	.85 V			.8 mm	S-PBGA-B784	4		e0
10AS016C3U19E2LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	0 Cel			BOTTOM	3.25 mm	19 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				19 mm	TSMC	.9 V			.8 mm	S-PBGA-B484
10AS016E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm					29 mm	TSMC	.9 V			1 mm	S-PBGA-B780
10AS048E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY				29 mm	TSMC	.9 V			1 mm	S-PBGA-B780
88AP162-B0-BJD2C004	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel			BOTTOM								CMOS
88AP168-B0-BJD2C010	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V					BOTTOM								CMOS
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm	21 mm			40	260	21 mm	CMOS	1.4 V			.8 mm	S-PBGA-B624	3		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.