BALL Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XC7Z030-2FF676I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm				27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z035-2FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z035-3FFG676E	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-1FFG900C	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z045-2FF900I	Xilinx	PROGRAMMABLE SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	31 mm				31 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z045-2FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm				27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XCVC1902-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm				45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVC1902-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVE1752-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVE2002-1LSESFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY		.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.7 V		S-PBGA-B784		e1
XCVE2302-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY	BGA784,28X28,31	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.66 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B784		e1
XCVM1102-1MSISFVA784	Xilinx	MICROPROCESSOR CIRCUIT		BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY		.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							CMOS	.8 V		S-PBGA-B784		e1
XCVM1802-1LSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	40 mm				40 mm	CMOS	.7 V	.92 mm	S-PBGA-B1760		e1
XCVM1802-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm				45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197		e1
XCVM1802-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm				45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVP1202-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1202-2MLEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1402-1MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	100 Cel	0 Cel		BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1502-2MSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.775 V	110 Cel	0 Cel		BOTTOM	4.48 mm	50 mm				50 mm	CMOS	.8 V	.92 mm	S-PBGA-B2785
XCVP1702-1MSIVSVA3340	Xilinx	MICROPROCESSOR CIRCUIT		BALL	3340	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA3340,58X58,36	.775 V	110 Cel	-40 Cel		BOTTOM	4.48 mm	55 mm				55 mm	CMOS	.8 V	.92 mm	S-PBGA-B3340
XCVP1802-2MLEVSVA5601	Xilinx	MICROPROCESSOR CIRCUIT		BALL	5601	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA5601,75X75,36	.775 V	110 Cel	0 Cel		BOTTOM	4.55 mm	70 mm				70 mm	CMOS	.8 V	.92 mm	S-PBGA-B5601
XCZU15EG-1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU15EG-L1FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS	.72 V		R-PBGA-B1156	4	e1
XCZU17EG-1FFVC1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU17EG-1FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU17EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU19EG-3FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V	GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.9 V		R-PBGA-B1760	4	e1
XCZU19EG-L2FFVB1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS	.72 V		R-PBGA-B1517	4	e1
XCZU21DR-2FFVD1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU27DR-2FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU27DR-2FSVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU28DR-1FFVE1156E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1156	4	e1
XCZU28DR-L2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	245		CMOS	.72 V		R-PBGA-B1517	4	e1
XCZU2CG-2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.61 mm	19 mm		30	250	19 mm	CMOS	.85 V	.8 mm	R-PBGA-B484	4	e1
XCZU47DR-1FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU48DR-2FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU49DR-1FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU49DR-2FSVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	240		CMOS	.85 V		R-PBGA-B1760	4	e1
XCZU49DR-L2FFVF1760I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V	GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	245		CMOS	.72 V		R-PBGA-B1760	4	e1
XCZU4EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	250		CMOS	.85 V		R-PBGA-B784	4	e1
XCZU6CG-2FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B900	4	e1
XCZU7CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B900	4	e1
XCZU7CG-2FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B1517	4	e1
XCZU7EG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B900	4	e1
XCZU7EV-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.97 mm	31 mm		30	245	31 mm	CMOS	.85 V	1 mm	R-PBGA-B900	4	e1
XCZU9CG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V	GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				30	245		CMOS	.85 V		R-PBGA-B900	4	e1
XQ7Z045-1RFG676Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY			125 Cel	-40 Cel		BOTTOM	3.37 mm	27 mm		NOT SPECIFIED	NOT SPECIFIED	27 mm	CMOS		1 mm	S-PBGA-B676
XQZU7EV-1FFRB900M	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V	GRID ARRAY	BGA900,30X30,40	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)	BOTTOM	3.71 mm	31 mm			225	31 mm	CMOS	.85 V	1 mm	S-PBGA-B900	4	e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.