BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
XQZU7EV-L1FFRB900I	Xilinx	PROGRAMMABLE SoC		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.892 V				GRID ARRAY	BGA900,30X30,40	.808 V	100 Cel	-40 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.71 mm		31 mm					225	31 mm	CMOS	.85 V			1 mm		S-PBGA-B900	4			e0
66AK2L06XCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V				GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM	3.55 mm		25 mm				30	245	25 mm	CMOS	1.05 V			.8 mm		S-PBGA-B900	4			e1
A2F200M3F-1CSG288	Microchip Technology	SoC FPGA		BALL	288	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.425 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM										CMOS	1.5 V					S-PBGA-B288	3
ADSP-SC584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel			BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC587BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel			BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM	1.5 mm		19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3
ATMXT224T-CCU027	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA64,8X8,20	3 V	85 Cel	-40 Cel			BOTTOM	.6 mm		5 mm						5 mm	CMOS	3.3 V			.5 mm		S-PBGA-B64
ATMXT640T-CCU035	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,20	3 V	85 Cel	-40 Cel			BOTTOM	.6 mm		6 mm						6 mm	CMOS	3.3 V			.5 mm		S-PBGA-B84
CEC1712H-S2-I/SX	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	84	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA84,10X10,25	1.71 V	85 Cel	-40 Cel			BOTTOM	.8 mm		7 mm	3.3V NOM SUPPLY ALSO AVAILABLE					7 mm	CMOS	1.8 V		I2C, QSPI, UART	.65 mm		S-PBGA-B84
CN5020-500BG564-SCP-G	Marvell Technology	MICROPROCESSOR CIRCUIT		BALL	564	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY							BOTTOM										CMOS						S-PBGA-B564
CSR8811A08-ICXR-R	Qualcomm	MICROPROCESSOR CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.8 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.3 V	85 Cel	-30 Cel			BOTTOM	.6 mm		2.569 mm						3.208 mm	CMOS	3.3 V			.5 mm		R-PBGA-B28	1
DLPC350ZFF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	419	BGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V				GRID ARRAY		3.135 V	85 Cel	0 Cel			BOTTOM	2.36 mm		23 mm				NOT SPECIFIED	NOT SPECIFIED	23 mm	CMOS	3.3 V			1 mm		S-PBGA-B419					14
DM505MRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm	CMOS	1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
GE209HISJ23HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY							BOTTOM										CMOS						S-PBGA-B
GE210JIHJ23HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY							BOTTOM										CMOS						S-PBGA-B
GE415GIBJ44HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY							BOTTOM										CMOS						S-PBGA-B
GE420CIAJ44HM	Advanced Micro Devices	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY							BOTTOM										CMOS						S-PBGA-B
LH7A404N0F000B3	NXP Semiconductors		INDUSTRIAL	BALL	324	FBGA	SQUARE	CERAMIC	YES				1.8,3.3	GRID ARRAY, FINE PITCH	BGA324,20X20,32		85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM							30	260				Other uPs/uCs/Peripheral ICs		.8 mm		S-XBGA-B324	3	Not Qualified		e1
M82710-14	Mindspeed Technologies	MICROPROCESSOR CIRCUIT	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES					GRID ARRAY			110 Cel	-25 Cel			BOTTOM										CMOS						R-PBGA-B484
MCIMX257DJM4A	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm	CMOS	1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX258CJM4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			1.2/1.5,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.38 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			40	260	17 mm	CMOS	1.45 V	Microprocessors		.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX283CVM4CR2	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel			BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm		S-PBGA-B289	3
MCIMX285AVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V	AEC-Q100		1.4,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V	Microprocessors		.8 mm		S-PBGA-B289	3	Not Qualified		e1
MCIMX503CVM8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		17 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ			40	260	17 mm	CMOS	1.225 V			.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX508CVK8B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	416	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.275 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA416,24X24,20	1.175 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	1.52 mm		13 mm	ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ			40	260	13 mm	CMOS	1.225 V			.5 mm		S-PBGA-B416	3	Not Qualified		e1
MCIMX512CJM6C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	.95 V	85 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX512DJM8C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		19 mm				40	260	19 mm	CMOS	1.1 V	Graphics Processors		.8 mm		S-PBGA-B529	3	Not Qualified		e1
MCIMX6D5EYM10AC	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm	24MHZ NOMINAL FREQ AVAILABLE			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6D6AVT10AD	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS	1.4 V			.8 mm		S-PBGA-B624	3			e1
MCIMX6D7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.25 mm		12 mm				40	260	12 mm	CMOS	1.4 V			.4 mm		S-PBGA-B569	3			e1
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel			BOTTOM	2.16 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3
MCIMX6Q7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.25 mm		12 mm				40	260	12 mm	CMOS	1.4 V			.4 mm		S-PBGA-B569	3			e1
MCIMX6S5EVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MEC1418-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	.8 mm		9 mm						9 mm	CMOS	3 V			.65 mm		S-PBGA-B144				e1
MEC1705Q-C2-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel	-40 Cel			BOTTOM	.8 mm		9 mm	ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE					9 mm	CMOS	1.8 V			.65 mm		S-PBGA-B144
SC1100UFH-266	National Semiconductor			BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES				1.9,3.3	GRID ARRAY	BGA388,26X26,50				TIN LEAD		BOTTOM							30	220				Other Microprocessor ICs		1.27 mm		S-PBGA-B388	3	Not Qualified		e0
T1014ME3PQA	Teledyne E2v (Uk)	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	125 Cel	-55 Cel			BOTTOM	2.07 mm		23 mm						23 mm	CMOS	1 V			.8 mm		S-PBGA-B780
T1024NXE7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.07 mm		23 mm				30	250	23 mm	CMOS	1 V			.8 mm		S-PBGA-B780	3			e1
XA7Z010-1CLG225Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32		125 Cel	-40 Cel	TIN SILVER COPPER	N	BOTTOM	1.5 mm		13 mm						13 mm	CMOS		Other uPs/uCs/Peripheral ICs		.8 mm		S-PBGA-B225	3	Not Qualified		e1
XCZU15EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245		CMOS	.85 V					R-PBGA-B1156	4			e1
XCZU3EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	250		CMOS	.85 V					R-PBGA-B625	4			e1
XCZU6CG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245		CMOS	.85 V					R-PBGA-B900	4			e1
XCZU9EG-1FFVC900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM							30	245		CMOS	.85 V					R-PBGA-B900	4			e1
XQ7Z100-1RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	-40 Cel			BOTTOM	3.44 mm		31 mm				NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS				1 mm		S-PBGA-B900
DRA756BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm	CMOS	1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
VCBUP7CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER		BOTTOM	3.3 mm		19 mm				30	245	19 mm	CMOS	1.2 V			.8 mm		S-PBGA-B529	4			e1
SM32DM355GCEM216EP	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	125 Cel	-55 Cel	TIN LEAD		BOTTOM	1.3 mm	8192	13 mm		32			260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3			e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.