BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
TCI6636K2HAXAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
66AK2G12ABYA100	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.56 mm		21 mm				30	260	21 mm	CMOS		1 V			.8 mm		S-PBGA-B625	3		e1
66AK2G12ABYA60E	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.56 mm		21 mm				30	260	21 mm	CMOS		.9 V			.8 mm		S-PBGA-B625	3		e1
TCI6636K2HCSAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM6467ZUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TCI6638K2KXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HAXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HCAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6630K2LDCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V					GRID ARRAY		.902 V				BOTTOM											CMOS		.95 V					S-PBGA-B900
TCI6630K2LDCMS2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V					GRID ARRAY		.902 V				BOTTOM											CMOS		.95 V					S-PBGA-B900
SCANSTA101SM	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM		1.5 mm		7 mm				20	235	7 mm	CMOS		3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	3	Not Qualified	e0
TMS320DM369ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES				32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	32768	13 mm		32		30	260	13 mm	CMOS			Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified	e1
DM355SZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TCI6636K2HADAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HCXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HDDAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM335ZCEA135	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	100 Cel	-40 Cel		BOTTOM		1.3 mm		13 mm						13 mm	CMOS		1.3 V			.65 mm		S-PBGA-B337		Not Qualified
LM8333GGR8AXSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V		1		2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4	1.1 mm		4 mm				30	260	4 mm	CMOS	80 mA	2.75 V	Other Microprocessor ICs	I2C	.5 mm		S-PBGA-B49	1	Not Qualified	e1	4
LM8322JGR8/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel	TIN	BOTTOM		1.1 mm		3.5 mm						3.5 mm	CMOS		1.8 V			.5 mm		S-PBGA-B36	1	Not Qualified	e3
TMS320DM6467TCUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS		1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6446BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	16384	16 mm		48		30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TCI6638K2KASAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM6467TZUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6467TZUTD1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.3 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
OMAPL137CZKBD	Texas Instruments	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES						GRID ARRAY	BGA256,16X16,40		70 Cel	-40 Cel		BOTTOM		2.05 mm		17 mm						17 mm	CMOS					1 mm		S-PBGA-B256
TCI6630K2LXCMSA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V					GRID ARRAY		.902 V				BOTTOM											CMOS		.95 V					S-PBGA-B900
TMS320DM355DZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM6446BZWT8	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	16384	16 mm		48		30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TCI6638K2KAXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM6443ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM		1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	260	16 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified
TCI6636K2HDXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM		3.75 mm		40 mm				30	245	40 mm	CMOS		1 V			1 mm		S-PBGA-B1517	4		e1
TCI6638K2KSAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HAAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM6467CZUTV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TMS320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	48		30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
OMAP3515DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA515,28X28,16	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		.9 mm		12 mm				30	260	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified	e1
TCI6638K2KAAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HBXAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM		3.75 mm		40 mm				30	245	40 mm	CMOS		1 V			1 mm		S-PBGA-B1517	4		e1
TCI6636K2HCXAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM		3.75 mm		40 mm				30	245	40 mm	CMOS		1 V			1 mm		S-PBGA-B1517	4		e1
OMAP3515DCUS72	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V				1.1,1.2,1.8,1.8/3	GRID ARRAY	BGA423,24X24,25	1.71 V	90 Cel	0 Cel		BOTTOM		1.4 mm		16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS		1.8 V	Graphics Processors		.65 mm		S-PBGA-B423		Not Qualified
OMAPL132BZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V			TIN SILVER COPPER	BOTTOM		1.4 mm		16 mm	ALSO OPERATES AT 1.2 V TYP			30	260	16 mm	CMOS		1 V	Other Microprocessor ICs		.8 mm		S-PBGA-B361	3	Not Qualified	e1
DM355SZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM357ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	4096	16 mm	ALSO REQUIRES 3.3 V I/O SUPPLY			30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	e1
TMS320DM335DZCEA13	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	8192	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
DLPC230TZDQRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V	AEC-Q100				GRID ARRAY		1.045 V	105 Cel	-40 Cel		BOTTOM		2.352 mm		23 mm						23 mm	CMOS		1.1 V			1 mm		S-PBGA-B324
TCI6638K2KBXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.75 mm		40 mm				30	245	40 mm	CMOS		1 V		I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4		e1
TMS320DM355ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V			32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TCI6636K2HCAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V					GRID ARRAY		.95 V				BOTTOM		3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.