BALL Other Function uPs,uCs & Peripheral ICs 2,400+

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
TCI6636K2HBSAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KSAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KADAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
LM8322JGR8X/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel	TIN	BOTTOM	1.1 mm		3.5 mm						3.5 mm	CMOS		1.8 V			.5 mm		S-PBGA-B36	1	Not Qualified	e3
DM355SZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TMS320DM6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	260	16 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified
TCI6636K2HBSAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM8167CCYG	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	3.31 mm		25 mm						25 mm	CMOS		1 V			.65 mm		S-PBGA-B1031
LM8333GGR8/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V			2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel		BOTTOM	1.1 mm		4 mm				30	260	4 mm	CMOS	6 mA	2.75 V	Other Microprocessor ICs		.5 mm		S-PBGA-B49	1	Not Qualified
TCI6636K2HCDAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
AM4379BZDNA80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS		1.26 V			.65 mm		S-PBGA-B491	3		e1
TMS320DM6467CZUT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
TCI6636K2HCAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HASAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM6467CCUT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	16		NOT SPECIFIED	245	19 mm	CMOS		1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
OMAP3503DCUS	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V			1.1,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm	CMOS		1.8 V	Graphics Processors		.8 mm		S-PBGA-B423	4	Not Qualified	e1
TMS320DM6441ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS		1.05 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMS320DM6467CZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified	e1
LM8333GGR8AXS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V	1		2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		4 mm		0	.4 MHz	30	260	4 mm	CMOS	6 mA	2.75 V	Other Microprocessor ICs	I2C	.5 mm		S-PBGA-B49	1	Not Qualified	e1	4
TCI6630K2LSCMSA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V				BOTTOM										CMOS		.95 V					S-PBGA-B900
DM355SZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
TCI6638K2KAAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KADAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KSAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HDSAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V	100 Cel	-40 Cel		BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM8167CCYG4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1031	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, HEAT SINK/SLUG		.95 V				BOTTOM	3.31 mm		25 mm						25 mm	CMOS		1 V			.65 mm		S-PBGA-B1031
TCI6636K2HADAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HADAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HAAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS		1 V			1 mm		S-PBGA-B1517	4		e1
TCI6636K2HAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TMS320DM335DZCEA21	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
LM8322JGR8	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V				GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel		BOTTOM	1.1 mm		3.5 mm						3.5 mm	CMOS		1.8 V			.5 mm		S-PBGA-B36		Not Qualified
LM8333GGR8	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.75 V				GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel		BOTTOM	1.1 mm		4 mm						4 mm	CMOS					.5 mm		S-PBGA-B49		Not Qualified
LM8330TMX	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-30 Cel		BOTTOM	.675 mm		2.015 mm						2.015 mm	CMOS		1.8 V			.4 mm		S-PBGA-B25
TCI6638K2KAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6636K2HBAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KAXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS		1 V			1 mm		S-PBGA-B1517	4		e1
TMS320DM6467ZUTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel	-40 Cel		BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified
TMS320DM335ZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.235 V	100 Cel	-40 Cel		BOTTOM	1.3 mm		13 mm						13 mm	CMOS		1.3 V			.65 mm		S-PBGA-B337		Not Qualified
OMAPL132BZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V			TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP			30	260	16 mm	CMOS		1 V	Other Microprocessor ICs		.8 mm		S-PBGA-B361	3	Not Qualified	e1
TMS320VER6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	260	16 mm	CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified
OMAP3515DCBB	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			1.1,1.8,3.3	GRID ARRAY	BGA515,23X23,20	1.71 V	90 Cel	0 Cel		BOTTOM	.9 mm		12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS		1.8 V	Graphics Processors		.5 mm		S-PBGA-B515		Not Qualified
TMS320DM355ZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified	e1
OMAPL137BZKBA4	Texas Instruments	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY	BGA256,16X16,40	1.25 V	85 Cel	-40 Cel		BOTTOM	2.05 mm		17 mm						17 mm	CMOS		1.3 V			1 mm		S-PBGA-B256
TCI6636K2HDDAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KSAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS		1 V			1 mm		S-PBGA-B1517

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.