BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

TMS320DM355DZCEA21

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

100 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TCI6636K2HDAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HXAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HCAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HBSAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HDSAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

100 Cel

-40 Cel

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

66AK2L06XCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

900

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

GRID ARRAY, FINE PITCH

.95 V

100 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.55 mm

25 mm

30

245

25 mm

CMOS

1.05 V

.8 mm

S-PBGA-B900

4

e1

TCI6636K2HBSAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HSAAW

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HDAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HBAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6467CCUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TCI6636K2HDAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6630K2LCMS2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

TCI6636K2HAAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

SCANSTA111SM

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

3 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.5 mm

7 mm

20

235

7 mm

CMOS

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B49

3

Not Qualified

e0

TCI6638K2KXAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

DLPC230TZDQQ1

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

AEC-Q100

GRID ARRAY

1.045 V

105 Cel

-40 Cel

BOTTOM

2.352 mm

23 mm

23 mm

CMOS

1.1 V

1 mm

S-PBGA-B324

TMS320DM365SVZCE27

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

BOTTOM

1.3 mm

8192

13 mm

13 mm

CMOS

1.2 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B338

Not Qualified

DLPC910ZYR

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

676

HBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, HEAT SINK/SLUG

.95 V

85 Cel

0 Cel

BOTTOM

3 mm

27 mm

27 mm

CMOS

1 V

I2C; USB

1 mm

S-PBGA-B676

TCI6636K2HCDAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

OMAP3515DCUS

Texas Instruments

SYSTEM ON CHIP

OTHER

BALL

423

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

1.1,1.8,3.3

GRID ARRAY

BGA423,24X24,25

1.71 V

90 Cel

0 Cel

BOTTOM

1.4 mm

16 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

CMOS

1.8 V

Graphics Processors

.65 mm

S-PBGA-B423

Not Qualified

TMS320DM6467CCUT7

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

OMAPL132EZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

30

260

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

3

200 rpm

e1

TMS320DM365SZCE30

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

BOTTOM

1.3 mm

8192

13 mm

13 mm

CMOS

1.35 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B338

Not Qualified

TCI6638K2KAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

SCANSTA101SMX/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

7 mm

32

30

260

7 mm

CMOS

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B49

4

Not Qualified

e1

TCI6638K2KXAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KXAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HADAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HAAAW

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KASAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

OMAPL138ZCE

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 V

BOTTOM

1.3 mm

13 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

13 mm

CMOS

1.3 V

.65 mm

S-PBGA-B361

TCI6638K2KDAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

AM4377BZDND100

Texas Instruments

SYSTEM ON CHIP

INDUSTRIAL

BALL

491

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.378 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA491,25X25,25

1.272 V

90 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

17 mm

30

260

17 mm

CMOS

1.325 V

.65 mm

S-PBGA-B491

3

e1

TCI6638K2KADAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TMS320DM355DZCE27J

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TCI6636K2HAXAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6630K2LCMSA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

900

BGA

SQUARE

PLASTIC/EPOXY

YES

.997 V

GRID ARRAY

.902 V

BOTTOM

CMOS

.95 V

S-PBGA-B900

TCI6636K2HDXAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

DLPC2607ZVB

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

176

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.95 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

260

CMOS

1 V

S-PBGA-B176

3

e1

TCI6636K2HSAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HSAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6467TCUT9

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8/3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

ALSO REQUIRES 3.3V I/O SUPPLY

48

35 MHz

30

245

19 mm

CMOS

1.3 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TCI6636K2HDSAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

100 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HAAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

AM5716AABCD

Texas Instruments

SYSTEM ON CHIP

OTHER

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

GRID ARRAY, FINE PITCH

BGA760,28X28,31

1.11 V

90 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

23 mm

30

250

23 mm

CMOS

1.15 V

.8 mm

S-PBGA-B760

3

e1

TCI6636K2HCSAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.