BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
TCI6638K2KADAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V				BOTTOM	3.75 mm	40 mm					40 mm	CMOS	1 V		1 mm	S-PBGA-B1517
TCI6636K2HCSAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V				BOTTOM	3.75 mm	40 mm					40 mm	CMOS	1 V		1 mm	S-PBGA-B1517
TCI6636K2HAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V				BOTTOM	3.75 mm	40 mm					40 mm	CMOS	1 V		1 mm	S-PBGA-B1517
TCI6636K2HDDAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY		.95 V				BOTTOM	3.75 mm	40 mm					40 mm	CMOS	1 V		1 mm	S-PBGA-B1517
AM6252ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm					13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AM6421BSEFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
AM6441BSFFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3
AM6441BSDFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
AM6421BSEGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
AM6441BSEGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
AM6421BSDFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY				17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441
AM6421BSFFHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			250	17.2 mm	CMOS	.75 V		.8 mm	S-PBGA-B441	3
TDA4VE88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm					23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770	3	2000 rpm
TDA4VL21HGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm					23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770	3	1200 rpm
AM62A74AVMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM68A92ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm			30	260	23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770	3
AM62A32AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMSIAMBRQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMHAAMBR	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM6252ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm			30	250	13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425	3
AM62A32AMLSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A74AUMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A34ASMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM62A31AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm					18 mm	CMOS	.75 V		.8 mm	S-PBGA-B484
AM6251ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				250	13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425	3
AM6232ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				250	13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425	3
AM6231ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				250	13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425	3
ADSP-SC583KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC587KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21583-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm	19 mm					19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B349
ADSP-21584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC589BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC584KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584-ENG	Analog Devices	MICROPROCESSOR CIRCUIT		BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V				BOTTOM	1.5 mm	19 mm					19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B349
ADSP-SC587BBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC584BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC589BBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC582KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADUCM350BBCZ	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.35 mm	8 mm			30	260	8 mm	CMOS	3 V		.5 mm	S-PBGA-B120	3		e1
ADSP-SC584CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz	30	260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm		500 MHz		260	19 mm	CMOS	1.1 V	SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC573-BCZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V		GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		BOTTOM	1.5 mm	17 mm					17 mm	CMOS	3.3 V		.8 mm	S-PBGA-B400

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.