BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
TCI6638K2KAXAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
SCANSTA111SMX	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA49,7X7,32	3 V	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1.5 mm		7 mm				20	235	7 mm	CMOS	3.3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B49	3	Not Qualified		e0
TMS320DM369ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm		32		30	260	13 mm	CMOS		Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TCI6636K2HDXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1
TMS320DM6467TCUTL1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm		48	35 MHz	30	245	19 mm	CMOS	1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM355CZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm	CMOS	1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TCI6638K2KAXAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TCI6636K2HDXAAWA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TMS320DM365ZCE27	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
OMAP3515DCBCA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V		1.1,1.8,3.3	GRID ARRAY	BGA515,26X26,20	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm				30	260	12 mm	CMOS	1.8 V	Graphics Processors		.5 mm		S-PBGA-B515	3	Not Qualified		e1
DM355SDZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TCI6636K2HBAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1
OMAPL132ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel		BOTTOM	1.4 mm		16 mm						16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361
LM8333	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	UNSPECIFIED	YES	2.75 V			GRID ARRAY, THIN PROFILE, FINE PITCH		2.25 V	85 Cel	-40 Cel	TIN	BOTTOM	1.1 mm		4 mm						4 mm	CMOS				.5 mm		S-XBGA-B49	1	Not Qualified		e3
TCI6636K2HBXAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1
TCI6636K2HDDAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1
TCI6636K2HCSAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TCI6636K2HBXAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1
DM355SZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TCI6638K2KAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
AM4372BZDN60	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.144 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	1.1 V			.65 mm		S-PBGA-B491	3			e1
LM8322JGR8X	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.62 V	85 Cel	-40 Cel		BOTTOM	1.1 mm		3.5 mm						3.5 mm	CMOS	1.8 V			.5 mm		S-PBGA-B36		Not Qualified
TCI6636K2HBDAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TCI6636K2HDXAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1
OMAPL132EZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY			30	260	16 mm	CMOS	1.2 V			.8 mm		S-PBGA-B361	3		200 rpm	e1
TCI6636K2HADAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TMS320DM365SVZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V				BOTTOM	1.3 mm	8192	13 mm						13 mm	CMOS	1.35 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
OMAP3503DCBB	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,23X23,20	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm				30	260	12 mm	CMOS	1.8 V	Graphics Processors		.4 mm		S-PBGA-B515	3	Not Qualified		e1
TCI6638K2KASAAW2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
OMAPL138ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V				BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm	CMOS	1.3 V			.8 mm		S-PBGA-B361
TMS320DM6467TCUTD1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY	48	35 MHz	30	245	19 mm	CMOS	1.3 V	Digital Signal Processors	ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TCI6636K2HBXAAW	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TCI6638K2KAAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TCI6638K2KAAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
AM4372BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	1.26 V			.65 mm		S-PBGA-B491	3			e1
TMS320DM365VZCE30	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V	32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V				BOTTOM	1.3 mm	8192	13 mm						13 mm	CMOS	1.35 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TCI6636K2HBAAW24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TMS320DM6467ZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	245	19 mm	CMOS	1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TCI6636K2HAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TMS320DM335DZCE135	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
DLPC200	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	780	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V			GRID ARRAY, HEAT SINK/SLUG		1.15 V	70 Cel	0 Cel		BOTTOM	2.44 mm		29 mm						29 mm	CMOS	1.2 V			1 mm		S-PBGA-B780		Not Qualified
TMS320DM6467CCUT6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm	8192	19 mm		16		NOT SPECIFIED	245	19 mm	CMOS	1.2 V	Digital Signal Processors	I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
AM5716AABCDA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm	CMOS	1.15 V			.8 mm		S-PBGA-B760	3			e1
TCI6630K2LXCMS24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V			GRID ARRAY		.902 V				BOTTOM										CMOS	.95 V					S-PBGA-B900
OMAP3503DCBCA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.71 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm				30	260	12 mm	CMOS	1.8 V	Graphics Processors		.4 mm		S-PBGA-B515	3	Not Qualified		e1
TCI6636K2HASAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm						40 mm	CMOS	1 V			1 mm		S-PBGA-B1517
TMS320DM355ZCEA216	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	32768	13 mm				30	260	13 mm	CMOS	1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TCI6638K2KAAAWA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY		.95 V			TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm				30	245	40 mm	CMOS	1 V			1 mm		S-PBGA-B1517	4			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.