BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

LM8333GGR8X

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

49

TFBGA

SQUARE

PLASTIC/EPOXY

YES

2.75 V

GRID ARRAY, THIN PROFILE, FINE PITCH

2.25 V

85 Cel

-40 Cel

BOTTOM

1.1 mm

4 mm

4 mm

CMOS

.5 mm

S-PBGA-B49

Not Qualified

OMAP3515DCUSA

Texas Instruments

SYSTEM ON CHIP

INDUSTRIAL

BALL

423

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.89 V

1.1,1.2,1.8,1.8/3

GRID ARRAY

BGA423,24X24,25

1.71 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

30

260

16 mm

CMOS

1.8 V

Graphics Processors

.65 mm

S-PBGA-B423

4

Not Qualified

e1

DLPC6401ZFF

Texas Instruments

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

419

BGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY

1.116 V

55 Cel

0 Cel

BOTTOM

2.36 mm

23 mm

23 mm

CMOS

1.2 V

1 mm

S-PBGA-B419

TCI6636K2HAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HAAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HCAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

SCANSTA101SMX

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

3 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1.5 mm

7 mm

20

235

7 mm

CMOS

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B49

3

Not Qualified

e0

TCI6636K2HASAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

DM355SDZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TCI6638K2KASAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6467CZUT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TCI6638K2KXAAW

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

DM365ZCEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.28 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

13 mm

32

30

260

13 mm

CMOS

1.35 V

I2C; SPI; UART; USB

.65 mm

S-PBGA-B338

3

e1

TCI6636K2HBDAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HSAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HAXAAW

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6443BZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

316

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B316

3

Not Qualified

e1

TMS32DM6467CCUTAV6

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

DLPC3439ZEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

201

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.045 V

85 Cel

-30 Cel

BOTTOM

1 mm

13 mm

13 mm

CMOS

1.1 V

.8 mm

S-PBGA-B201

TMS320DM6467CCUTD7

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TMS320DM365SZCE27

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

BOTTOM

1.3 mm

8192

13 mm

13 mm

CMOS

1.2 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B338

Not Qualified

DM355SDZCE270

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

OMAPL132BZWT2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.32 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

BOTTOM

1.4 mm

16 mm

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

TMS320DM6446BZWTA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

16384

16 mm

48

30

260

16 mm

CMOS

1.2 V

Digital Signal Processors

I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B361

3

Not Qualified

e1

SCANSTA111SM/NOPB

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

49

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA49,7X7,32

3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

7 mm

30

260

7 mm

CMOS

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B49

4

Not Qualified

e1

TMS320DM6467CCUTA

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

85 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

3.3 mm

8192

19 mm

16

NOT SPECIFIED

245

19 mm

CMOS

1.2 V

Digital Signal Processors

I2C; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TCI6636K2HCDAAW

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM335CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TCI6636K2HDAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6638K2KDAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

TCI6636K2HSAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HDSAAW

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

100 Cel

0 Cel

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM6467CZUTAV

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.14 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.3 mm

8192

19 mm

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

30

245

19 mm

CMOS

1.2 V

Digital Signal Processors

.8 mm

FIXED POINT

S-PBGA-B529

4

Not Qualified

e1

TCI6636K2HDSAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

100 Cel

-40 Cel

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KAAAW2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6638K2KASAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

AM4377BZDNA80

Texas Instruments

SYSTEM ON CHIP

INDUSTRIAL

BALL

491

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.326 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA491,25X25,25

1.21 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

17 mm

30

260

17 mm

CMOS

1.26 V

.65 mm

S-PBGA-B491

3

e1

TMS320DM6441BZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

316

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.1 V

32

1.05/1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

1 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.4 mm

20480

16 mm

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

48

30

260

16 mm

CMOS

1.05 V

Digital Signal Processors

ETHERNET; I2C; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B316

3

Not Qualified

e1

TMS320DM357AZWT

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

1.14 V

85 Cel

0 Cel

BOTTOM

1.4 mm

16 mm

ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY

16 mm

CMOS

1.2 V

.8 mm

S-PBGA-B361

Not Qualified

TCI6636K2HCSAAWA2

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HBAAWA

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TCI6636K2HAXAAW24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

BOTTOM

3.75 mm

40 mm

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

TMS320DM365VZCE27

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

32

1.2,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.14 V

BOTTOM

1.3 mm

8192

13 mm

13 mm

CMOS

1.2 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B338

Not Qualified

TMS320DM335ZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

32768

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

DLPC3438CZEZ

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

201

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.155 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.045 V

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

1 mm

13 mm

30

260

13 mm

CMOS

1.1 V

.8 mm

S-PBGA-B201

3

e1

TCI6638K2KDAAWA24

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

1517

BGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

GRID ARRAY

.95 V

TIN SILVER COPPER

BOTTOM

3.75 mm

40 mm

30

245

40 mm

CMOS

1 V

1 mm

S-PBGA-B1517

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.