BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
PAM1806BZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TMSDM6467TCUT1TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V				GRID ARRAY, FINE PITCH		1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.3 V			.8 mm		S-PBGA-B529	4			e1
XAM1806BZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
DRA782BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM505LRBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM8147BCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, HEAT SINK/SLUG		3.14 V				TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY			30	250	23 mm		CMOS		3.3 V			.8 mm		S-PBGA-B684	4			e1
XAM1806BZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
SN74LVT8986ZGV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	2.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		8 mm		0		30	260	8 mm		BICMOS		3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	3	Not Qualified		e1
CC3000YFVT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	126	BGA	SQUARE	PLASTIC/EPOXY	YES	4.8 V				GRID ARRAY		2.7 V	70 Cel		-20 Cel		BOTTOM											CMOS							S-PBGA-B126
V62/09643-01XE	Texas Instruments	MICROPROCESSOR CIRCUIT	MILITARY	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	125 Cel		-55 Cel	TIN LEAD	BOTTOM	1.3 mm	8192	13 mm		32			260	13 mm		CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3			e0
DRA785BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
X1642BIGABL	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel		BOTTOM	1.17 mm		10.4 mm						10.4 mm		CMOS		1.2 V			.65 mm		S-PBGA-B161
DRA752BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760	3			e1
DRA787BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
VVLOG365ZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.28 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm				30	260	13 mm		CMOS		1.2 V			.65 mm		S-PBGA-B338	3			e1
TMX320DM6467ZUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		0 Cel		BOTTOM	3.1 mm	32768	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			NOT SPECIFIED	NOT SPECIFIED	19 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B529		Not Qualified
DRA750BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		48	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1000 rpm	e1
CP3SP33SMRX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm				30	260	10 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers		.8 mm		S-PBGA-B144	3	Not Qualified	96 rpm	e1
DM505MRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA786BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
PAM1806BZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TMX320DM6443BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			NOT SPECIFIED	NOT SPECIFIED	16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
DRA751BLGABCQ	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760
DRA786BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
POMAPL132BZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
TMX320DM365AZCE300	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel		BOTTOM	1.3 mm		13 mm						13 mm		CMOS		1.35 V			.65 mm		S-PBGA-B338		Not Qualified
TMX320DM6446DZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm						16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B316
DRA783BRJABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz			15 mm		CMOS		1.06 V		CAN(2), I2C(2), SPI(4), QSPI, UART(3)	.65 mm		S-PBGA-B367				e1
SN3490586	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DRA745BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1176 rpm	e1
XOMAPL132BZWT2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
DRA746BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
DRA782BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
CP3SP33SMR/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		10 mm				30	260	10 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers		.8 mm		S-PBGA-B144	3	Not Qualified	96 rpm	e1
AWR1642ABISABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.17 mm		10.4 mm				NOT SPECIFIED	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm		S-PBGA-B161	3			e1
AM1806BZWTD3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
AWR1642ABISABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.17 mm		10.4 mm				30	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm		S-PBGA-B161	3			e1
POMAPL132BZWT2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
DRA756	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	760	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY							BOTTOM											CMOS							S-PBGA-B760
VCBUP7TC6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
DRA780BDGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
TNETV1647GSTZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	IT ASLO OPERATES IN 1V MINIMUM SUPPLY			30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
DRA755BLGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760
PAM1806BZWT3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
TMX320DM365BZCE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel		0 Cel		BOTTOM	1.3 mm	8192	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS		1.2 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B338		Not Qualified
TMX320DM355ZCE216	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel		BOTTOM	1.3 mm	32768	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
DRA783BRJABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz			15 mm		CMOS		1.06 V		CAN(2), I2C(2), SPI(4), QSPI, UART(3)	.65 mm		S-PBGA-B367				e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.