BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MTFC8GLCDM-1MWT	Micron Technology	MICROPROCESSOR CIRCUIT	OTHER	BALL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, THIN PROFILE, FINE PITCH		1.65 V	85 Cel	-25 Cel			BOTTOM	1.2 mm	11.5 mm	IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY	30	260	13 mm	CMOS		1.8 V		.5 mm	R-PBGA-B153
SC2200UCL-266	National Semiconductor			BALL	432	BGA	SQUARE	PLASTIC/EPOXY	YES			1.8,3.3	GRID ARRAY	BGA432,31X31,50				TIN LEAD		BOTTOM				30	220		CMOS			Other Microprocessor ICs	1.27 mm	S-PBGA-B432	3	Not Qualified	e0
XA7Z010-1CLG400Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100	1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32		125 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	N	BOTTOM	1.6 mm	17 mm		30	260	17 mm	CMOS			Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B400	3	Not Qualified	e1
XAZU5EV-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS		.72 V		.8 mm	S-PBGA-B784	4		e1
XC7Z045-3FFG900E	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel			BOTTOM	3.24 mm	27 mm				27 mm	CMOS		1 V		1 mm	S-PBGA-B900
XCVC1902-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	4 mm	45 mm				45 mm	CMOS		.8 V		.92 mm	S-PBGA-B2197			e1
XCVP1502-3HSEVSVA2785	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2785	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY, HEAT SINK/SLUG	BGA2785,53X53,36	.854 V	100 Cel	0 Cel			BOTTOM	4.48 mm	50 mm				50 mm	CMOS		.88 V		.92 mm	S-PBGA-B2785
XCZU19EG-1FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU27DR-1FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU27DR-2FFVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU2EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS		.85 V			S-PBGA-B784	4		e1
XCZU2EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	30	250		CMOS		.72 V			R-PBGA-B784	4		e1
XCZU3EG-2SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		BOTTOM				30	250		CMOS		.85 V			R-PBGA-B784	4		e1
XCZU47DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU48DR-2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU6EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XCZU9CG-2FFVB1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVB1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU9EG-1FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM				30	245		CMOS		.85 V			R-PBGA-B900	4		e1
XQ7Z020-1CL484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		100 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS			Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQ7Z020-1CL484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES			1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel	-40 Cel	TIN LEAD	N	BOTTOM	1.6 mm	19 mm		30	225	19 mm	CMOS			Other uPs/uCs/Peripheral ICs	.8 mm	S-PBGA-B484	3	Not Qualified	e0
XQZU3EG-1SFRA484M	Xilinx	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.892 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.808 V	125 Cel	-55 Cel	Tin/Lead (Sn/Pb)		BOTTOM	3.35 mm	19 mm		40	245	19 mm	CMOS		.85 V		.8 mm	S-PBGA-B484	4		e0
10AS016E4F27E3LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	27 mm				27 mm	TSMC		.9 V		1 mm	S-PBGA-B672
10AS027H2F34E2LG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			35 mm	TSMC		.9 V		1 mm	S-PBGA-B1152
10AS032E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	29 mm				29 mm	TSMC		.9 V		1 mm	S-PBGA-B780
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1517,39X39,40		100 Cel	0 Cel			BOTTOM	3.5 mm	40 mm				40 mm	TSMC				1 mm	S-PBGA-B1517
10AS066H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel			BOTTOM	3.35 mm	35 mm				35 mm	TSMC		.9 V		1 mm	S-PBGA-B1152
88AP270MA2-BGO2C624	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER		BOTTOM							CMOS			Graphics Processors				Not Qualified	e8
88AP270MA2-BHE1E416	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V			TIN SILVER COPPER		BOTTOM							CMOS			Graphics Processors				Not Qualified	e1
88AP310-B1-BGK2C806-TN02	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel			BOTTOM							CMOS
88AP320-C0-BGR2C624-TN20	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel			BOTTOM							CMOS
88AP320-C0-BGR2C624-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER		BOTTOM							CMOS								e1
88AP320-C0-BGR2C806-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER		BOTTOM							CMOS								e1
88AP320-C0-BGR2C806-TN31	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel			BOTTOM							CMOS
AC5520/SLH3P	Intel			BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES			1.1,1.5,1.8	GRID ARRAY	BGA1295,36X36,40						BOTTOM										Other Microprocessor ICs	1 mm	S-PBGA-B1295		Not Qualified
AF82801IEM/SLB8P	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES			1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40						BOTTOM								308 mA		Other Microprocessor ICs	1 mm	S-PBGA-B676		Not Qualified
AF82801JD/SLG8T	Intel			BALL	676	BGA	SQUARE	PLASTIC	YES			1.1,1.5,3.3,5	GRID ARRAY	BGA676,30X30,40						BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B676		Not Qualified
CYTMA525-49FNI25ZZT	Cypress Semiconductor	MICROPROCESSOR CIRCUIT		BALL	49	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			GRID ARRAY		1.71 V					BOTTOM			IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY				CMOS					R-PBGA-B49
EFR32FG12P431F1024GL125-C	Silicon Labs	SYSTEM ON CHIP		BALL	125	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA125,13X13,20	1.62 V	85 Cel	-40 Cel			BOTTOM	.94 mm	7 mm				7 mm	CMOS		1.8 V		.5 mm	S-PBGA-B125
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC	YES			1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel			BOTTOM										Other uPs/uCs/Peripheral ICs	.8 mm	S-XBGA-B256		Not Qualified
MPC8548VUAUJ	Freescale Semiconductor	SoC		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V		1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Silver (Sn/Ag)		BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS		1.1 V	Microprocessors	1 mm	S-CBGA-B783	1	Not Qualified	e2
MTFC64GJVDN-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	169	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.65 V	85 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	1.4 mm	14 mm	IT ALSO OPERATES AT 3.3 VOLTS			18 mm	CMOS		1.8 V		.5 mm	R-PBGA-B169			e1
NQ6702PXHV/SL7X4	Intel			BALL	567	BGA	SQUARE	PLASTIC/EPOXY	YES			1.5,3.3	GRID ARRAY	BGA567,24X24,50						BOTTOM								2160 mA		Other uPs/uCs/Peripheral ICs	1.27 mm	S-PBGA-B567		Not Qualified
QG6402/SL9XC	Intel			BALL	655	FBGA	RECTANGULAR	PLASTIC	YES			1.5,1.8,3.3	GRID ARRAY, FINE PITCH	BGA655,23X29,32						BOTTOM							CMOS			Other uPs/uCs/Peripheral ICs	.8 mm	R-PBGA-B655		Not Qualified
XAZU2EG-1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.43 mm	21 mm		30	250	21 mm	CMOS		.85 V		.8 mm	S-PBGA-B625	3		e1
XAZU2EG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS		.85 V		.8 mm	S-PBGA-B784	4		e1
XAZU3EG-1SFVC784Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER		BOTTOM	3.32 mm	23 mm		30	250	23 mm	CMOS		.85 V		.8 mm	S-PBGA-B784	4		e1
XC7Z010-2CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	0 Cel			BOTTOM	1.5 mm	13 mm				13 mm	CMOS		1 V		.8 mm	S-PBGA-B225

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.