BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	No. of Ports	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code	No. of I/O Lines
MPFS025T-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V					.97 V	100 Cel	-40 Cel		BOTTOM				ALSO OPERATES AT 1.05V NOMINAL SUPPLY							CMOS		1 V			R-PBGA-B325
MPFS095T-1FCSG536E	Microchip Technology	PROGRAMMABLE SoC		BALL	536	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA536,30X30,20	.97 V	100 Cel	0 Cel		BOTTOM		1.4 mm	16 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					16 mm		CMOS		1 V		.5 mm	S-PBGA-B536
MPFS095T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM		2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM		2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V		.8 mm	S-PBGA-B484
MPFS160T-1FCVG784E	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	0 Cel		BOTTOM		2.92 mm	23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm		CMOS		1 V		.8 mm	S-PBGA-B784
MPFS160TS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM		2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm		CMOS		1 V		.8 mm	S-PBGA-B484
OMAPL138EZWTA3R	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	16 mm		CMOS		1.3 V	I2C; SPI; UART; USB	.8 mm	S-PBGA-B361	3	456 rpm	e1
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM		2.57 mm	23 mm						23 mm		CMOS		.8 V		.8 mm	S-PBGA-B770	3	2000 rpm
VCBU65WMCE30	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	13 mm		32		30	260	13 mm		CMOS		1.35 V	I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3		e1
VS3673UNION	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.3 mm	13 mm		32		30	260	13 mm		CMOS		1.35 V	I2C; SPI; UART; USB	.65 mm	S-PBGA-B338	3		e1
XC7Z012S-1CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM		1.6 mm	19 mm						19 mm		CMOS		1 V		.8 mm	S-PBGA-B485
XCZU11EG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.85 V			R-PBGA-B1156	4		e1
XCZU11EG-1FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.85 V			R-PBGA-B1760	4		e1
XCZU11EG-2FFVB1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.85 V			R-PBGA-B1517	4		e1
XCZU11EG-3FFVC1156E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY		.873 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.9 V			R-PBGA-B1156	4		e1
XCZU19EG-2FFVE1924I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1924	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245			CMOS		.85 V			R-PBGA-B1924	4		e1
XCZU3CG-2SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	250			CMOS		.85 V			R-PBGA-B484	4		e1
XCZU3CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250			CMOS		.72 V			R-PBGA-B484	4		e1
XCZU4CG-L1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V			R-PBGA-B900	4		e1
XCZU4EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250			CMOS		.72 V			R-PBGA-B784	4		e1
XCZU4EV-L2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V			R-PBGA-B900	4		e1
XCZU5CG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	245			CMOS		.85 V			R-PBGA-B900	4		e1
XCZU5CG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250			CMOS		.85 V			S-PBGA-B784	4		e1
XCZU5CG-2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, FINE PITCH			100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		3.32 mm	23 mm				30	250	23 mm		CMOS		.85 V		.8 mm	S-PBGA-B784	4		e1
XCZU5CG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY			100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM				IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)			30	250			CMOS		.72 V			S-PBGA-B784	4		e1
XCZU5EG-1FBVB900I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA900,30X30,40	.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		2.88 mm	31 mm				30	245	31 mm		CMOS		.85 V		1 mm	R-PBGA-B900	4		e1
XCZU5EG-3SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES	.927 V			GRID ARRAY	BGA784,28X28,32	.873 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.32 mm	23 mm				30	250	23 mm		CMOS		.9 V		.8 mm	S-PBGA-B784	4		e1
XCZU5EG-L1SFVC784I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA784,28X28,32	.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250	23 mm		CMOS		.72 V		.8 mm	R-PBGA-B784	4		e1
XCZU5EG-L2SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY	BGA784,28X28,32	.698 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		3.32 mm	23 mm	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250	23 mm		CMOS		.72 V		.8 mm	R-PBGA-B784	4		e1
XCZU5EV-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250			CMOS		.85 V			R-PBGA-B784	4		e1
XCZU7EV-L1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245			CMOS		.72 V			R-PBGA-B1517	4		e1
10AS016C4U19I3LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	-40 Cel		BOTTOM		3.25 mm	19 mm						19 mm		TSMC		.9 V		.8 mm	S-PBGA-B484
10AS032H3F35E2SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM		3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY					35 mm		TSMC		.9 V		1 mm	S-PBGA-B1152
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.56 mm	21 mm				30	260	21 mm		CMOS		1 V		.8 mm	S-PBGA-B625	3		e1
AM6234ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm						13 mm		CMOS		.75 V		.5 mm	S-PBGA-B425
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM		.89 mm	13 mm					250	13 mm		CMOS		.75 V		.5 mm	S-PBGA-B425	3
AM6412BKCGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM		2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY					17.2 mm		CMOS		.75 V		.8 mm	S-PBGA-B441
AT32UC3A4256HHB-C1UR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,10X10,25		85 Cel	-40 Cel		BOTTOM		1 mm	7 mm						7 mm		CMOS		3.3 V		.65 mm	S-PBGA-B100
ATMXT640UD-CCU001	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	3.14 V	85 Cel	-40 Cel		BOTTOM		.6 mm	6 mm						6 mm		CMOS		3.3 V		.5 mm	S-PBGA-B88
AWR1642ABIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1.17 mm	10.4 mm				30	260	10.4 mm	1572864	CMOS		1.2 V		.65 mm	S-PBGA-B161	3		e1
CY8C6136BZI-F14	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		1 mm	9 mm						9 mm		CMOS		1.8 V		.65 mm	S-PBGA-B124	3		e1
DM6446ANB6C2127VC	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	16 mm				30	260	16 mm		CMOS		1.2 V		.8 mm	S-PBGA-B361	3		e1
DM6446AZWTKEDACOM	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	16 mm				30	260	16 mm		CMOS		1.2 V		.8 mm	S-PBGA-B361	3		e1
DM6446GB6C0121MV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		1.4 mm	16 mm				30	260	16 mm		CMOS		1.2 V		.8 mm	S-PBGA-B361	3		e1
LM8330TME/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm				30	260	2.01 mm		CMOS	.03 mA	1.8 V		.4 mm	S-PBGA-B25	1		e1	20
LM8330TMX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		128	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	1.62 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	20	.675 mm	2.01 mm				30	260	2.01 mm		CMOS	.03 mA	1.8 V		.4 mm	S-PBGA-B25	1		e1	20
MCIMX257DJM4A,557	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	70 Cel	-20 Cel		BOTTOM		1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY					17 mm		CMOS		1.45 V		.8 mm	S-PBGA-B400
MCIMX286DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel		BOTTOM		1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm		CMOS		1.45 V		.8 mm	S-PBGA-B289	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.