BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
TMS320DM365ZCEF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm		32		30	260	13 mm	CMOS	1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
AM6421BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm		17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY					17.2 mm	CMOS	.75 V			.8 mm		S-PBGA-B441
MCIMX283DVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm		S-PBGA-B289	3			e1
MCIMX6S5DVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
ADSP-21583BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm		S-PBGA-B349	3			e1
AM4376BZDND30	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	.912 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	.95 V			.65 mm		S-PBGA-B491	3			e1
AM4378BZDND80	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		17 mm				30	260	17 mm	CMOS	1.26 V			.65 mm		S-PBGA-B491	3			e1
ATMXT640U-CCU023	Microchip Technology	CAPACITIVE TOUCH SCREEN CONTROLLERS		BALL	88	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V	TS 16949			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA88,10X10,20	2.7 V	85 Cel	-40 Cel		BOTTOM	.6 mm		6 mm				30	260	6 mm	CMOS	3.3 V			.5 mm		S-PBGA-B88
DLPC3439CZEZ	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	201	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.155 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.045 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	1 mm		13 mm				30	260	13 mm	CMOS	1.1 V			.8 mm		S-PBGA-B201	3			e1
DRA821U4TCBALMRQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm		17.2 mm					250	17.2 mm	CMOS	.8 V			.8 mm		S-PBGA-B433	3		2000 rpm
IS2083BM-232	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel	-40 Cel		BOTTOM	.9 mm		5.5 mm						5.5 mm	CMOS	1.2 V			.5 mm		S-PBGA-B82
IS2083BM-232-TRAY	Microchip Technology	PROGRAMMABLE RFSoC		BALL	82	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA82,10X10,20	1.14 V	85 Cel	-40 Cel		BOTTOM	.9 mm		5.5 mm						5.5 mm	CMOS	1.2 V			.5 mm		S-PBGA-B82
MCIMX357CJQ5C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm		S-PBGA-B400	3	Not Qualified		e1
MCIMX6U8DVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6X1EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		14 mm				40	260	14 mm	CMOS				.65 mm		S-PBGA-B400	3			e1
MPFS095TLS-FCSG325I	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V						.97 V	100 Cel	-40 Cel		BOTTOM				ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V					R-PBGA-B325
XC7Z100-1FFG1156C	Xilinx	SYSTEM ON CHIP		BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA1156,34X34,40	.95 V	85 Cel	0 Cel		BOTTOM	3.1 mm		35 mm						35 mm	CMOS	1 V			1 mm		S-PBGA-B1156
XCZU11EG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B1517	4			e1
XCZU4EG-1SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	250		CMOS	.85 V					R-PBGA-B784	4			e1
AM6254ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm		13 mm						13 mm	CMOS	.75 V			.5 mm		S-PBGA-B425
AM6441BSDGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm		17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY					17.2 mm	CMOS	.75 V			.8 mm		S-PBGA-B441
AM6441BSFGHAALV	Texas Instruments	SYSTEM ON CHIP		BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm		17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY					17.2 mm	CMOS	.75 V			.8 mm		S-PBGA-B441
CY8C6137BZI-F54	Infineon Technologies	PROGRAMMABLE SoC		BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1 mm		9 mm						9 mm	CMOS	1.8 V			.65 mm		S-PBGA-B124	3			e1
MCIMX27LMOP4A	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.38 V	85 Cel	-40 Cel		BOTTOM	1.54 mm		19 mm	ALSO OPERATES WITH 1.3VNOM @266MHZ			40	260	19 mm	CMOS	1.45 V			.8 mm		S-PBGA-B473	3	Not Qualified
MCIMX6D6AVT10AC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE			40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6U5EVM10AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3			e1
MCIMX6Y7DVK05AA	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.275 V	95 Cel	0 Cel		BOTTOM	1.23 mm		9 mm				40	260	9 mm	CMOS				.5 mm		S-PBGA-B272	3
MPFS095TLS-FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm		19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm		S-PBGA-B484
MTFC16GJDDQ-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, LOW PROFILE		2.7 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		14 mm				30	260	18 mm	CMOS	3.3 V			1 mm		R-PBGA-B100				e1
OMAPL138EZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY	32	50 MHz	30	260	13 mm	CMOS	1.3 V		I2C; SPI; UART; USB	.65 mm		S-PBGA-B361	3		456 rpm	e1
XCZU19EG-2FFVC1760I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B1760	4			e1
XCZU27DR-1FSVG1517E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM							30	240		CMOS	.85 V					R-PBGA-B1517	4			e1
XCZU27DR-L2FFVG1517I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	245		CMOS	.72 V					R-PBGA-B1517	4			e1
XCZU27DR-L2FSVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V				GRID ARRAY		.698 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM							30	240		CMOS	.72 V					R-PBGA-B1156	4			e1
XCZU4EG-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B900	4			e1
XCZU7CG-1FBVB900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B900	4			e1
XCZU7CG-1FFVC1156I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B1156	4			e1
XCZU7CG-1FFVF1517E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM							30	245		CMOS	.85 V					R-PBGA-B1517	4			e1
XCZU7CG-2FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V				GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	2.97 mm		31 mm				30	245	31 mm	CMOS	.85 V			1 mm		R-PBGA-B900	4			e1
XQ7Z100-2RF900I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel	-40 Cel		BOTTOM	3.44 mm		31 mm				NOT SPECIFIED	NOT SPECIFIED	31 mm	CMOS				1 mm		S-PBGA-B900
80312	Intel	MICROPROCESSOR CIRCUIT		BALL	540	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY		3 V				BOTTOM	4.1 mm		42.5 mm						42.5 mm	CMOS	3.3 V			1.27 mm		S-PBGA-B540		Not Qualified
A2F200M3F-FG484	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V				GRID ARRAY		1.425 V	85 Cel	0 Cel	TIN LEAD	BOTTOM										CMOS	1.5 V					S-PBGA-B484	3
MCIMX233DJM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	169	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA169,13X13,32	1 V	70 Cel	-10 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm		11 mm				40	260	11 mm	CMOS	1.35 V			.8 mm		S-PBGA-B169	3			e1
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm		14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm		S-PBGA-B289	3			e1
MCIMX6S5DVM10ABR	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm				40	260	21 mm	CMOS		Graphics Processors		.8 mm		S-PBGA-B624	3	Not Qualified		e1
MCIMX6X4EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm		19 mm				40	260	19 mm	CMOS				.8 mm		S-PBGA-B529	3			e1
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel	-40 Cel		BOTTOM	1.23 mm		9 mm				40	260	9 mm	CMOS				.5 mm		S-PBGA-B272	3
MPFS095T-1FCVG784I	Microchip Technology	PROGRAMMABLE SoC		BALL	784	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V				GRID ARRAY, FINE PITCH	BGA784,28X28,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm		23 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					23 mm	CMOS	1 V			.8 mm		S-PBGA-B784

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.