BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
TCI6630K2LSCMSA	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V			GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V				S-PBGA-B900	4		e1
TCI6630K2LSCMSA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V			GRID ARRAY		.902 V			TIN SILVER COPPER	BOTTOM						30	245		CMOS	.95 V				S-PBGA-B900	4		e1
XC7Z030-L2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	23 mm						23 mm	CMOS	1 V			1 mm	S-PBGA-B484
XCVC1902-2HSIVSVD1760	Xilinx	MICROPROCESSOR CIRCUIT		BALL	1760	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V			GRID ARRAY, HEAT SINK/SLUG	BGA1760,42X42,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	40 mm						40 mm	CMOS	.88 V			.92 mm	S-PBGA-B1760
XCVC1902-2LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT		BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V			GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm						45 mm	CMOS	.7 V			.92 mm	S-PBGA-B2197			e1
XCZU17EG-2FFVD1760E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	1760	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.71 mm	42.5 mm				30	245	42.5 mm	CMOS	.85 V			1 mm	R-PBGA-B1760	4		e1
XCZU27DR-2FFVE1156I	Xilinx	PROGRAMMABLE SoC	INDUSTRIAL	BALL	1156	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1156	4		e1
XCZU2CG-L1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V				R-PBGA-B484	4		e1
XCZU2CG-L1SFVA625I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	625	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	250		CMOS	.72 V				R-PBGA-B625	4		e1
XCZU2EG-1SBVA484E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	484	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM									CMOS	.85 V				R-PBGA-B484	4		e1
XCZU5EG-1SFVC784E	Xilinx	PROGRAMMABLE SoC	OTHER	BALL	784	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY	BGA784,28X28,32	.825 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.32 mm	23 mm				30	250	23 mm	CMOS	.85 V			.8 mm	R-PBGA-B784	4		e1
XCZU7CG-1FFVF1517I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	1517	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B1517	4		e1
XCZU7EV-1FBVB900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.876 V			GRID ARRAY		.825 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM						30	245		CMOS	.85 V				R-PBGA-B900	4		e1
XCZU9EG-L2FFVC900E	Xilinx	MICROPROCESSOR CIRCUIT	OTHER	BALL	900	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	.742 V			GRID ARRAY		.698 V	110 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY			30	245		CMOS	.72 V				R-PBGA-B900	4		e1
10AS048H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm						35 mm	TSMC	.9 V			1 mm	S-PBGA-B1152
10AS066H2F34I1HG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1152,34X34,40		100 Cel	-40 Cel		BOTTOM	3.35 mm	35 mm						35 mm	TSMC				1 mm	S-PBGA-B1152
66AK2G12ABYA60	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.945 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.56 mm	21 mm				30	260	21 mm	CMOS	.9 V			.8 mm	S-PBGA-B625	3		e1
A2F200M3F-1FG484I	Microchip Technology	SoC FPGA		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V			GRID ARRAY		1.425 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM									CMOS	1.5 V				S-PBGA-B484	3
ADSP-SC583CBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
AM4378BZDN80	Texas Instruments	SYSTEM ON CHIP	OTHER	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.326 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	17 mm				30	260	17 mm	CMOS	1.26 V			.65 mm	S-PBGA-B491	3		e1
AM6232ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6234ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
AM6251ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm						13 mm	CMOS	.75 V			.5 mm	S-PBGA-B425
ATWILC1000B-UU-T	Microchip Technology	SoC		BALL	55	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA55,8X8,14		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.589 mm	3.24 mm						3.24 mm	CMOS	1.1 V			.35 mm	S-PBGA-B55
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V			GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel		BOTTOM	2.42 mm	27 mm		16	20 MHz			27 mm	CMOS	1.15 V		I2C; SPI; UART; USB	1 mm	S-PBGA-B516				9
LS1021ASE7HNB	NXP Semiconductors	MICROPROCESSOR CIRCUIT		BALL	525	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm				40	260	19 mm	CMOS	1 V			.8 mm	S-PBGA-B525	3		e1
MCIMX27VOP4AR2	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	404	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.52 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA404,24X24,25	1.38 V	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	17 mm	ALSO OPERATES 1.3V AT 266MHZ			40	260	17 mm	CMOS	1.45 V			.65 mm	S-PBGA-B404	3		e1
MCIMX280CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm	S-PBGA-B289	3	Not Qualified	e1
MCIMX286CVM4C	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel		BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS	1.45 V			.8 mm	S-PBGA-B289	3
MCIMX353CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX353DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX357CVM5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX357DVM5B	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.33 V	70 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	IT ALSO OPERATES AT 1.22 TO 1.47 V			40	260	17 mm	CMOS	1.8 V			.8 mm	S-PBGA-B400	3	Not Qualified	e1
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm				40	260	19 mm	CMOS	1.1 V			.8 mm	S-PBGA-B529	3		e2
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm				40	260	21 mm	CMOS	1.4 V			.8 mm	S-PBGA-B624	3
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O			40	260	21 mm	CMOS	1.4 V			.8 mm	S-PBGA-B624	3		e1
MCIMX6X1CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm				40	260	17 mm	CMOS				.8 mm	S-PBGA-B400	3		e1
MCIMX6X1EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm				40	260	17 mm	CMOS				.8 mm	S-PBGA-B400	3		e1
MCIMX6X3EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm				40	260	14 mm	CMOS				.65 mm	S-PBGA-B400	3		e1
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm				40	260	14 mm	CMOS				.8 mm	S-PBGA-B289	3
MEC1521H-B0-I/SZ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm	CMOS	1.8 V		I2C, ESPI, UART	.65 mm	S-PBGA-B144
MEC1521H-B0-I/SZ-TR	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.89 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA144,13X13,25	1.71 V	85 Cel	-40 Cel		BOTTOM	.8 mm	9 mm	ALSO OPERATES AT 3.3V NOMINAL VOLATGE	0	.032768 MHz			9 mm	CMOS	1.8 V		I2C, ESPI, UART	.65 mm	S-PBGA-B144
MPC8548ECHXAQG	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V		1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.38 mm	29 mm				40	260	29 mm	CMOS	1.1 V	Microprocessors		1 mm	S-CBGA-B783	1	Not Qualified	e0
MPC8548ECHXAUJ	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V		1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.38 mm	29 mm				40	260	29 mm	CMOS	1.1 V	Microprocessors		1 mm	S-CBGA-B783	1	Not Qualified	e0
MPFS025T-1FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V					.97 V	100 Cel	0 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V				R-PBGA-B325
MPFS025T-1FCVG484E	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
MPFS025T-1FCVG484I	Microchip Technology	PROGRAMMABLE SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY					19 mm	CMOS	1 V			.8 mm	S-PBGA-B484
MPFS025T-FCSG325E	Microchip Technology	PROGRAMMABLE SoC		BALL	325		RECTANGULAR	PLASTIC/EPOXY	YES	1.03 V					.97 V	100 Cel	0 Cel		BOTTOM			ALSO OPERATES AT 1.05V NOMINAL SUPPLY						CMOS	1 V				R-PBGA-B325

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.