BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
DRA787BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DM8147SCIS0	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, HEAT SINK/SLUG		3.14 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY	48		NOT SPECIFIED	250	23 mm		CMOS		3.3 V		ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B684	4		1000 rpm	e1
PAM1806BZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
AM1806BZWTA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
XDM505XXBABF	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY		1.11 V	125 Cel		-40 Cel		BOTTOM											CMOS		1.15 V					S-PBGA-B367
XOMAPL132BZWTA2E	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZCED3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
DRA788BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
XAM1806BZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TMX320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm						16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B316
TMX320DM6443ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY					16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
PAM1806BZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
DRA755BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760
DRA745BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1176 rpm	e1
VCBUP7CT7	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
XOMAPL137AZKB3	Texas Instruments		COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES				1.2,1.8/3.3	GRID ARRAY	BGA256,16X16,40		70 Cel		0 Cel		BOTTOM														Other Microprocessor ICs		1 mm		S-PBGA-B256		Not Qualified
TNETV6446AINZWT8	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm				30	260	16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B361	3			e1
TMSDM6467CCUT6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
AWR1443FQIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.2 mm		10.4 mm				30	260	10.4 mm	589824	CMOS		1.2 V			.65 mm		S-PBGA-B161	3			e1
TMSDM6467CCUT7TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		19 mm				NOT SPECIFIED	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
XAM1806BZCEA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
DRA750BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760
PAM1806BZCE3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
DRA744BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1000 rpm	e1
XAM1806BZCED4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
DRA754BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760
TMX320DM365AZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.3 mm		13 mm						13 mm		CMOS		1.2 V			.65 mm		S-PBGA-B338		Not Qualified
AM1806BZCEA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
TWL92230CZQE	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.8 V	85 Cel		-30 Cel		BOTTOM	1 mm		5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm		BICMOS					.5 mm		S-PBGA-B80		Not Qualified
TDA3X	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY							BOTTOM											CMOS							S-PBGA-B
DRA744BJGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1000 rpm	e1
ZDM8147L3MOBCYE1	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	684	HBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V				GRID ARRAY, HEAT SINK/SLUG		3.14 V				TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm	IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY			30	250	23 mm		CMOS		3.3 V			.8 mm		S-PBGA-B684	4			e1
DRA781BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA788BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
XAM1806BZWTD3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
XAM1806BZCEA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
XAM1806BZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
DRA784BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
TWL92230CZQER	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	4.5 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.8 V	85 Cel		-30 Cel		BOTTOM	1 mm		5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm		BICMOS					.5 mm		S-PBGA-B80		Not Qualified
DRA754BJGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760
PAM1806BZCEA4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
XDRA821UXXGALM	Texas Instruments	SoC	AUTOMOTIVE	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel		-40 Cel		BOTTOM	2.57 mm		17.2 mm						17.2 mm		CMOS		.8 V			.8 mm		S-PBGA-B433			2000 rpm
DRA784BSGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
DRA780BDGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
CP3SP33SMS/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	224	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA224,15X15,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN LEAD	BOTTOM	1.4 mm		13 mm		32		30	260	13 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers	I2C; I2S; SPI; UART; USB	.8 mm		S-PBGA-B224	3	Not Qualified	96 rpm	e0
PAM1806BZWT4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
AM1806BZCED3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
DRA752BPGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm				30	250	23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760	3			e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.