BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
DRA746APGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES		AEC-Q100			GRID ARRAY						TIN SILVER COPPER	BOTTOM							30	250			CMOS							X-PBGA-B760	3		1500 rpm	e1
PAM1806BZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
DRA746BPGABCQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		64	32 MHz	30	250	23 mm		CMOS		1.15 V		CAN; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm	e1
TMX320DM6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY					16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
DRA751BLGABCRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.2 V	AEC-Q100			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	2.96 mm		23 mm						23 mm		CMOS		1.15 V			.8 mm		S-PBGA-B760
TMX320DM6441DZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP					16 mm		CMOS		1.05 V			.8 mm		S-PBGA-B316
CP3SP33SMSX/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	224	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.98 V		16	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA224,15X15,32	1.62 V	85 Cel	CR16C	-40 Cel	TIN LEAD	BOTTOM	1.4 mm		13 mm		32		30	260	13 mm	32768	CMOS	200 mA	1.8 V	Microcontrollers	I2C; I2S; SPI; UART; USB	.8 mm		S-PBGA-B224	3	Not Qualified	96 rpm	e0
SM320DM6446AZWTA	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	20480	16 mm	ITS ALSO OPERATES AT 1.8/3.3 V SUPPLY	48	27 MHz	30	260	16 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified		e1
AWR1443FQIGABLQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.17 mm		10.4 mm				30	260	10.4 mm	589824	CMOS		1.2 V			.65 mm		S-PBGA-B161	3			e1
AWR1642ABIGABLRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.17 mm		10.4 mm				30	260	10.4 mm	1572864	CMOS		1.2 V			.65 mm		S-PBGA-B161	3			e1
DM505LRBABFR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, HEAT SINK/SLUG		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
DRA829VMTGBALFRQ1	Texas Instruments	SoC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm		24 mm					250	24 mm		CMOS		.8 V			.8 mm		S-PBGA-B827	3		2000 rpm	e1
DRA821U4TCBALMQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel		-40 Cel		BOTTOM	2.57 mm		17.2 mm					250	17.2 mm		CMOS		.8 V			.8 mm		S-PBGA-B433	3		2000 rpm
XAM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel		-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm		CMOS		.75 V			.8 mm		S-PBGA-B484
AM69A98ATNGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel		-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm		CMOS		.8 V			.8 mm		S-PBGA-B1414
AM69A94ATMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel		-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm		CMOS		.8 V			.8 mm		S-PBGA-B1414
XAM62A74AUMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel		-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm		CMOS		.75 V			.8 mm		S-PBGA-B484
XAM69A98ATNGHAALY	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel		-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm		CMOS		.8 V			.8 mm		S-PBGA-B1414
XAM62A34ASMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel		-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm		CMOS		.75 V			.8 mm		S-PBGA-B484
XAM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V				GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel		-40 Cel		BOTTOM	2.556 mm		18 mm						18 mm		CMOS		.75 V			.8 mm		S-PBGA-B484
AM69A54ANMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel		-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm		CMOS		.8 V			.8 mm		S-PBGA-B1414
AM69A34AHMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel		-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm		CMOS		.8 V			.8 mm		S-PBGA-B1414
AM69A78ATMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V				GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel		-40 Cel		BOTTOM	3.341 mm		31 mm						31 mm		CMOS		.8 V			.8 mm		S-PBGA-B1414
DRA785BSGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY, FINE PITCH	BGA167,22X22,26	1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		32	32 MHz	30	250	15 mm		CMOS		1.06 V		I2C(2), SPI(4), UART(3),	.65 mm		S-PBGA-B367	3			e1
CC3000YFVR	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	126	VFBGA	RECTANGULAR	UNSPECIFIED	YES	4.8 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	70 Cel		-20 Cel	TIN SILVER COPPER	BOTTOM							30	260			CMOS							R-XBGA-B126	1			e1
TMX320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY					16 mm		CMOS		1.2 V	Digital Signal Processors		.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMX320DM6443CZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		0 Cel		BOTTOM	1.4 mm		16 mm						16 mm		CMOS		1.2 V			.8 mm		S-PBGA-B316
TMX320DM365AZCE	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	338	FBGA	SQUARE	PLASTIC/EPOXY	YES			32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA338,19X19,25						BOTTOM		2048					NOT SPECIFIED	NOT SPECIFIED			CMOS			Digital Signal Processors		.635 mm	FIXED POINT	S-PBGA-B338		Not Qualified
XAM1806BZWTA3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
SN74LVT8986GGV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA64,8X8,32	2.7 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	1.4 mm		8 mm				20	220	8 mm		BICMOS		3 V	Other Microprocessor ICs		.8 mm		S-PBGA-B64	3	Not Qualified		e0
TMSDM6467CCUTV6TAN	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, HEAT SINK/SLUG		1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		19 mm				30	245	19 mm		CMOS		1.2 V			.8 mm		S-PBGA-B529	4			e1
PAM1806BZCED3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
X1443BIGABL	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.32 V	AEC-Q100			GRID ARRAY, THIN PROFILE, FINE PITCH		1.14 V	125 Cel		-40 Cel		BOTTOM	1.17 mm		10.4 mm						10.4 mm		CMOS		1.2 V			.65 mm		S-PBGA-B161
PAM1806BZWTD3	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
TMX320DM355ZCE270	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	85 Cel		0 Cel		BOTTOM	1.3 mm	32768	13 mm				NOT SPECIFIED	NOT SPECIFIED	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337		Not Qualified
PAM1806BZWTD4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.4 mm		16 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					16 mm		CMOS		1.3 V			.8 mm		S-PBGA-B361		Not Qualified
DRA781BRGABFRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
XAM1806BZCE4	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V					BOTTOM	1.3 mm		13 mm	IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY					13 mm		CMOS		1.3 V			.65 mm		S-PBGA-B361		Not Qualified
DRA783BRGABFQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	367	BGA	SQUARE	PLASTIC/EPOXY	YES	1.11 V	AEC-Q100			GRID ARRAY		1.02 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.82 mm		15 mm		48	32 MHz	30	250	15 mm		CMOS		1.06 V		CAN; I2C; SPI; UART	.65 mm		S-PBGA-B367	3			e1
TCI6630K2LSCMS	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V					BOTTOM											CMOS		.95 V					S-PBGA-B900
TMS320DM355DZCEA13	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V				TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O			30	260	13 mm		CMOS		1.3 V	Digital Signal Processors		.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TMS320DM355CZCEA21	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	337	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA337,19X19,25	1.235 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8192	13 mm	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O	32		30	260	13 mm		CMOS		1.3 V	Digital Signal Processors	I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B337	3	Not Qualified		e1
TCI6630K2LCMS24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	.997 V				GRID ARRAY		.902 V					BOTTOM											CMOS		.95 V					S-PBGA-B900
TMS320DM6433ZDU4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	376	HBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA376,22X22,40	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	20480	23 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ , 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			30	260	23 mm		CMOS		1.2 V	Digital Signal Processors	I2C; SPI; UART	1 mm	FIXED POINT	S-PBGA-B376	3	Not Qualified		e1
TCI6636K2HBSAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V					BOTTOM	3.75 mm		40 mm						40 mm		CMOS		1 V			1 mm		S-PBGA-B1517
TCI6638K2KXAAWA24	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY		.95 V					BOTTOM	3.75 mm		40 mm						40 mm		CMOS		1 V			1 mm		S-PBGA-B1517
LM8333GGR8X/NOPB	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	49	TFBGA	SQUARE	PLASTIC/EPOXY	YES	2.9 V			2.5	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA49,7X7,20	2.25 V	85 Cel		-40 Cel		BOTTOM	1.1 mm		4 mm				30	260	4 mm		CMOS	6 mA	2.75 V	Other Microprocessor ICs		.5 mm		S-PBGA-B49	1	Not Qualified
OMAP3503DCBBA	Texas Instruments	SYSTEM ON CHIP	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.91 V			1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.71 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm						12 mm		CMOS		1.8 V	Graphics Processors		.4 mm		S-PBGA-B515	3	Not Qualified		e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.