BALL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
ADSP-SC584BBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
FIDO1100BGA208IR1	Analog Devices	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	BALL	208	BGA	SQUARE	PLASTIC	YES	2.75 V			GRID ARRAY	BGA208,18X18,20	2.25 V	85 Cel	-40 Cel		BOTTOM	1.2 mm	10 mm		16	2.6 MHz			10 mm		2.5 V		SPI; UART	.5 mm	S-PBGA-B208
ADSP-SC583KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC584CBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21584BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADUCM350BBCZ-RL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	120	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.5 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.35 mm	8 mm				30	260	8 mm	CMOS	3 V			.5 mm	S-PBGA-B120	3		e1
ADSP-SC583CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21584CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC587KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-21583KBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC583BBCZ-3A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-SC582BBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
ADSP-21573-BCZENG	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.47 V			GRID ARRAY, LOW PROFILE, FINE PITCH		3.13 V	70 Cel	0 Cel		BOTTOM	1.5 mm	17 mm						17 mm	CMOS	3.3 V			.8 mm	S-PBGA-B400
ADSP-21584KBCZ-5A	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel		BOTTOM	1.5 mm	19 mm			500 MHz		260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3
ADSP-SC582CBCZ-4A	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	19 mm			500 MHz	30	260	19 mm	CMOS	1.1 V		SPI; UART	.8 mm	S-PBGA-B349	3		e1
MAX78002GXE+	Analog Devices	MICROPROCESSOR, RISC		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.21 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,13X13,32	.9 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	12 mm				30	260	12 mm	CMOS	1.1 V			.8 mm	S-PBGA-B144	3		e1
DS3641B+TRL	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY		3.3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	260		CMOS					S-PBGA-B25	3		e1
DS3641B+	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	25	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY		3.3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM						30	260		CMOS					S-PBGA-B25	3		e1
MAX78000EXG+	Analog Devices	SoC		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.21 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32	.9 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8 mm				30	260	8 mm	CMOS	1.1 V			.8 mm	S-PBGA-B81	3		e1
LC898113	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel		BOTTOM	.8 mm	4 mm						4 mm	CMOS	3.3 V			.5 mm	S-PBGA-B49
LC898124EP3XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA27,3X9,16	2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.33 mm	1.3 mm				30	260	3.89 mm	CMOS	2.8 V			.4 mm	R-PBGA-B27	1		e1
LC898129DP1XHTBG	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	40	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA40,4X10,16	2.7 V	85 Cel	-30 Cel	TIN SILVER	BOTTOM	.35 mm	1.6 mm			1 MHz	30	260	4.15 mm		2.8 V		I2C, SPI	.4 mm	R-PBGA-B40	1		e2
LC898124EP2XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.33 mm	1.3 mm				30	260	3.89 mm	CMOS	2.8 V			.4 mm	R-PBGA-B27	1		e1
LC898128DP1XGTBG	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.7 V	85 Cel	-30 Cel	TIN SILVER	BOTTOM	.35 mm	1.175 mm				30	260	4.3 mm	CMOS	2.8 V			.4 mm	R-PBGA-B30	1		e2
LC898123F40XC-VH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.45 mm	2.3 mm				30	260	3.22 mm	CMOS	2.8 V			.4 mm	R-PBGA-B35	1		e1
MT9S311	Onsemi	MICROPROCESSOR CIRCUIT		BALL	137	BGA	SQUARE	PLASTIC/EPOXY	YES	1.95 V			GRID ARRAY	BGA137(UNSPEC)	1.7 V				BOTTOM					54 MHz				CMOS					S-PBGA-B137
LC898123AXD-VH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.45 mm	2.3 mm				30	260	3.39 mm	CMOS	2.8 V			.4 mm	R-PBGA-B35	1		e1
LC77700B	Onsemi			BALL	456	BGA	SQUARE	PLASTIC/EPOXY	YES			2.5,3.3	GRID ARRAY	BGA456,26X26,40					BOTTOM											Other Microprocessor ICs		1 mm	S-PBGA-B456		Not Qualified
LC898124EP1XC-MH	Onsemi	MICROPROCESSOR CIRCUIT	OTHER	BALL	27	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.6 V	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM	.33 mm	1.3 mm				30	260	3.89 mm	CMOS	2.8 V			.4 mm	R-PBGA-B27	1		e1
STA2058EXTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	3.3 V			.8 mm	S-PBGA-B144		Not Qualified
SPEAR-09-H042	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, LOW PROFILE, FINE PITCH			85 Cel	-40 Cel		BOTTOM	1.7 mm	15 mm	IT ALSO REQUIRES 3.3V SUPPLY					15 mm	CMOS	1.2 V			.8 mm	S-PBGA-B289		Not Qualified
STA1085POCTR	STMicroelectronics	SoC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS				.8 mm	S-PBGA-B361
SPEAR-09-H020	STMicroelectronics		COMMERCIAL	BALL	420	BGA	SQUARE	PLASTIC/EPOXY	YES			1.2,2.5,3.3	GRID ARRAY	BGA420,22X22,40		70 Cel	0 Cel		BOTTOM									CMOS		Other Microprocessor ICs		1 mm	S-PBGA-B420		Not Qualified
STA2058EXATR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	3.3 V			.8 mm	S-PBGA-B144		Not Qualified
STA2058EX	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm	10 mm				30	260	10 mm	CMOS	3.3 V			.8 mm	S-PBGA-B144	3	Not Qualified	e1
STA2058EXA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V			GRID ARRAY, LOW PROFILE, FINE PITCH		2.97 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	3.3 V			.8 mm	S-PBGA-B144		Not Qualified
FLI30336-AC	STMicroelectronics	MICROPROCESSOR CIRCUIT		BALL	416	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES				GRID ARRAY					TIN SILVER COPPER	BOTTOM						30	250		CMOS					X-PBGA-B416	3		e1
STA1085HOCTR	STMicroelectronics	SoC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	16 mm				NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS				.8 mm	S-PBGA-B361
STV0991NA	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm	10 mm						10 mm	CMOS	1.1 V			.65 mm	S-PBGA-B201
STM32TS60ZH6XXY	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		2.4 V	85 Cel	-40 Cel		BOTTOM	.6 mm	7 mm						7 mm	CMOS				.5 mm	S-PBGA-B144
STV0991NA/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm	10 mm						10 mm	CMOS	1.1 V			.65 mm	S-PBGA-B201
STV0991FN/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1.1 V			.65 mm	S-PBGA-B201
STV0991NAR/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm	10 mm						10 mm	CMOS	1.1 V			.65 mm	S-PBGA-B201
STV0987A/TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	OTHER	BALL	104	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.9 V			GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel	-25 Cel		BOTTOM	1.31 mm	5 mm						5 mm	CMOS	1.8 V			.4 mm	S-PBGA-B104
STV0987B	STMicroelectronics	MICROPROCESSOR CIRCUIT		BALL	104	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES				GRID ARRAY						BOTTOM						NOT SPECIFIED	NOT SPECIFIED		CMOS					X-PBGA-B104
STV0991FAR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	201	TFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY, THIN PROFILE, FINE PITCH			105 Cel	-40 Cel		BOTTOM	1.12 mm	10 mm						10 mm	CMOS	1.1 V			.65 mm	S-PBGA-B201

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.